Table of Contents
Advertisement
Intel® Server System M50FCP2UR System Integration and Service Guide
2.4 Processor Assembly and Installation
Components Required:
4
Gen Intel® Xeon® Scalable processors
•
th
Processor tray–Packaging tray that came with the processor
•
•
Processor carrier clip – one for each processor
Processor heat sink (2U or 1U) – one for each processor
•
Required Tools and Supplies
Anti-static wrist strap and conductive workbench pad (recommended)
•
•
T-30 Torx* screwdriver
ESD Gloves
•
The Intel® Server System M50FCP2UR includes two Socket- E LGA4677 processor sockets compatible with
the 4
th
Gen Intel Xeon Scalable processor family.
Two types of heat sinks are supported by the Intel® Server System M50FCP2UR: Standard 2U heat sink and
standard 1U heat sink. The type of heat sink used depends on the system configuration. Server systems
configured with the 1U air duct option, or the GPGPU air duct option must use 1U heat sinks.
Caution: Fin edges of the processor heat sink are very sharp. Intel recommends wearing thin ESD protective
gloves when handling the PHM during the following procedures.
Caution: Processor heat sinks are easily damaged if handled improperly. See the following image for proper
handling.
For the 4
th
Gen Intel® Xeon® Scalable processors, two types of processor carrier clips are supported (see
following figure). The type of carrier clip used is determined by the processor SKU.
Two types of processor carrier clips are supported by the 4
this server product family, they are identified as "E1A" and "E1B".
E1A Processor Carrier Clip
26
Figure 11. Supported 2U Processor Heat Sinks
Figure 12. Supported Processor Carrier Clips
th
Gen Intel® Xeon® Scalable processor family for
E1B Processor Carrier Clip
Advertisement
Table of Contents
