Specify Inquiry Scan Timing; Set Encryption/Authentication: "Pin Code; Manage Security Modes - Intermec 6820 Series User Manual

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Appendix A Bluetooth Configuration Commands

Manage Security Modes

136

Specify Inquiry Scan Timing

Command D1<Inquiry_Scan_Interval>,< Inquiry_Scan_Window><CR>
Description Sets the Inquiry Scan timing parameters
Default 4096,18
Example "D11024,512<CR>"
Note: To enable scanning, the values for Interval and Window must be in the range of 18 to
4096. The Window value must be less than the Interval value. Both values must be zero to
disable scanning.
Note: Page scan timing is described in the Bluetooth V1.1 Core Specifications; for up-to-date
information, see: The Bluetooth Specification.
Note: Modification of the Inquiry Scan Timing can improve device discovery response perfor-
mance, but may adversely affect battery performance.

Set Encryption/Authentication: "PIN CODE"

Command S4<PIN code>
Description PIN Code — Pin code can be NULL and as long as 16 characters
Default "S4%00"
NULL PIN code
Example "S4MyPinCode <CR>"
This command controls the security access mode and device pairing.
The modes available are:
L0 Disable encryption, authentication and exclusion
L1 Enable authentication
L2 Enable encryption and authentication
L3 Enable encryption, authentication and exclusive
Mode L0 allows any remote device to connect.
Mode L1 require the remote device to be authenticated by a PIN request.
The PIN code for the module is set to a user-specified value with the S4
command. Currently the default PIN is the NULL string (see Note).
Mode L2 adds encryption to the Bluetooth link.
Mode L3 adds exclusive connection to one specific Bluetooth device.
In this mode only connection requests from the initial device are al-
lowed. Connections from other devices are rejected even if they supply
the correct PIN code.
Device pairing and bonding are associated with this command and works
as follows:
After an L command is executed the current device pairing and bonding is
deleted. The next device to connect becomes paired and bonded to the
module.
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