Preface: About This Guide; Guide Contents; Additional Resources - Xilinx Virtex-4 QV FPGA Manual

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About This Guide
This guide provides complete packing information for Virtex
Radiation-Hardened FPGAs in 1.00-mm pitch ceramic flip-chip column grid array (CF)
packages. Virtex-4 QV Radiation Hardened FPGAs are offered exclusively in ceramic flip-
chip column grid array (CF) packages that are optimally designed for improved thermal
cycle reliability.

Guide Contents

This manual contains the following chapters:
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Additional Resources

To find additional documentation, see the Xilinx website at:
To search the Answer Database of silicon, software, and IP questions and answers, or to
create a technical support WebCase, see the Xilinx website at:
Virtex-4 QV FPGA Ceramic Packaging
UG496 (v1.1) June 8, 2012
Chapter 1, "Device Packaging Overview,"
family with a summary of maximum I/Os available in each device/package
combination. Also includes table of pin definitions.
Chapter 2, "Pinout Tables,"
Radiation-Hardened FPGAs.
Chapter 3, "Pinout Diagrams,"
Radiation-Hardened package/device combinations.
Chapter 4, "Mechanical Drawings,"
Radiation-Hardened FPGAs.
Chapter 5, "Thermal Specifications,"
QV Radiation-Hardened FPGA packaging. Discusses Virtex-4 QV FPGA power
management strategy and thermal management options.
http://www.xilinx.com/literature.
http://www.xilinx.com/support.
www.xilinx.com
provides an introduction to the Virtex-4 QV
provides pinout information for all Virtex-4 QV
provides pinout diagrams for all Virtex-4 QV
provides mechanical drawings of all Virtex-4 QV
provides thermal data associated with Virtex-4
Preface
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-4 QPro™-V (QV)
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