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IOB #2: Name = CLKIN’ Repetitive material that has been omitted Repetitive material that has allow block block_name loc1 Horizontal ellipsis . . . been omitted loc2 ... locn; www.xilinx.com Virtex-4 QV FPGA Ceramic Packaging UG496 (v1.1) June 8, 2012...
Figure 2-5 in the Virtex-II Red text in another document Platform FPGA User Guide. Go to http://www.xilinx.com Blue, underlined text Hyperlink to a website (URL) for the latest speed files. Virtex-4 QV FPGA Ceramic Packaging www.xilinx.com UG496 (v1.1) June 8, 2012...
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Preface: About This Guide www.xilinx.com Virtex-4 QV FPGA Ceramic Packaging UG496 (v1.1) June 8, 2012...
FPGA. The number of I/Os per package includes all user I/Os except the fifteen control pins (CCLK, DONE, M0, M1, M2, PROG_B, PWRDWN_B, TCK, TDI, TDO, TMS, HSWAPEN, DXN, DXP, AND RSVD). Virtex-4 QV FPGA Ceramic Packaging www.xilinx.com UG496 (v1.1) June 8, 2012...
Pin Definitions Table 1-3 provides a description of each pin type listed in Virtex-4 QV FPGA pinout tables. The "_#" suffix appended to some pin descriptions indicates the bank in which that pin resides. Pins without this suffix appended are not associated with any particular bank.
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High, which is its default state. It does not require an external pull-up. Do not connect this pin—leave floating. RDWR_B_0 Input In SelectMAP mode, this is the active-low Write Enable signal. TCK_0 Input Boundary-Scan Clock TDI_0 Input Boundary-Scan Data Input Virtex-4 QV FPGA Ceramic Packaging www.xilinx.com UG496 (v1.1) June 8, 2012...
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AVCCAUXMGT_# Input Analog power supply for global bias (2.5V). GNDA_# Input Ground for the analog circuitry of the RocketIO MGT. MGTCLK_# Input Differential reference clock for the RocketIO MGT. www.xilinx.com Virtex-4 QV FPGA Ceramic Packaging UG496 (v1.1) June 8, 2012...
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2. For more information on lower capacitance pins, see the UG070, Virtex-4 User Guide. 3. For more information on RocketIO pins, see the UG076, Virtex-4 RocketIO Multi-Gigabit Transceiver User Guide. Virtex-4 QV FPGA Ceramic Packaging www.xilinx.com UG496 (v1.1) June 8, 2012...
Note: Check www.xilinx.com for the latest pinout information. ASCII package pinout files are also available for download from the Xilinx website. CF1140 (SX55) Ceramic Flip-Chip Column Grid Package As shown in Table 2-1, the Virtex-4 QV XQR4VSX55 FPGA is available in the CF1140 ceramic flip-chip column grid package.
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Virtex-4 Configuration Guide. CC_CONFIG 2. Connect this reserved pin to GND. 3. Connect this reserved pin to 2.5V (sharing the same PCB supply distribution as V is acceptable). CCAUX www.xilinx.com Virtex-4 QV FPGA Ceramic Packaging UG496 (v1.1) June 8, 2012...
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Virtex-4 Configuration Guide. CC_CONFIG 2. Connect this reserved pin to GND. 3. Connect this reserved pin to 2.5V (sharing the same PCB supply distribution as V is acceptable). CCAUX www.xilinx.com Virtex-4 QV FPGA Ceramic Packaging UG496 (v1.1) June 8, 2012...
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Virtex-4 Configuration Guide. CC_CONFIG 2. Connect this reserved pin to GND. 3. Connect this reserved pin to 2.5V (sharing the same PCB supply distribution as V is acceptable). CCAUX Virtex-4 QV FPGA Ceramic Packaging www.xilinx.com UG496 (v1.1) June 8, 2012...
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Virtex-4 Configuration CC_CONFIG Guide. 2. Connect this reserved pin to GND. 3. Connect this reserved pin to 2.5V (sharing the same PCB supply distribution as is acceptable). CCAUX www.xilinx.com Virtex-4 QV FPGA Ceramic Packaging UG496 (v1.1) June 8, 2012...
Notes: 1. SM and ADC functionality in multi-function user I/O pins is reserved for future use. 2. Dedicated SM and ADC pins are reserved for future use. UG496_C03_01_040208 Figure 3-1: CF1140 Ceramic Flip-Chip Column Grid Pinout Diagram (SX55) www.xilinx.com Virtex-4 QV FPGA Ceramic Packaging UG496 (v1.1) June 8, 2012...
Notes: 1. SM and ADC functionality in multi-function user I/O pins is reserved for future use. 2. Dedicated SM and ADC pins are reserved for future use. UG496_C03_03_040208 Figure 3-3: CF1144 Flip-Chip Fine-Pitch BGA Pinout Diagram (FX60) www.xilinx.com Virtex-4 QV FPGA Ceramic Packaging UG496 (v1.1) June 8, 2012...
Notes: 1. SM and ADC functionality in multi-function user I/O pins is reserved for future use. 2. Dedicated SM and ADC pins are reserved for future use. UG496_C03_05_040208 Figure 3-5: CF1509 Flip-Chip Fine-Pitch BGA Composite Pinout Diagram (LX200) www.xilinx.com Virtex-4 QV FPGA Ceramic Packaging UG496 (v1.1) June 8, 2012...
Notes: 1. SM and ADC functionality in multi-function user I/O pins is reserved for future use. 2. Dedicated SM and ADC pins are reserved for future use. UG496_C03_07_040208 Figure 3-7: CF1509 Flip-Chip Fine-Pitch BGA Composite Pinout Diagram (FX140) www.xilinx.com Virtex-4 QV FPGA Ceramic Packaging UG496 (v1.1) June 8, 2012...
Column Grid Assembly and Rework User Guide by IBM (http://www.ibm.com). Thermal Resistance and Package Mass Virtex-4 QV FPGAs are offered exclusively in CF packages for high thermal cycle reliability. The Virtex-4 QV FPGA ceramic packages thermal resistance and package mass data is listed in Table 5-1.
Guidelines for Xilinx CF Package Handling and Assembly Xilinx ceramic flip-chip (CF) packages are robust and reliable. The CF package uses high lead columns (instead of solder balls) to create a higher standoff and more flexible interconnection, which achieves a significant increase in reliability. A silicon carbide (SiC) lid covers the die and ceramic chip capacitors are placed around the periphery of the package.
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Chapter 6: Guidelines for Xilinx CF Package Handling and Assembly After the dry pack bag is opened and the foam-covered banded tray is removed from the bag, carefully hold positive downward pressure on top of the foam tray while cutting the heat-sealed black plastic bands (see Figure 6-2).
Product Handling and Inspection All Xilinx CF package die are flip-chip and bumped with high lead bumping (95% Pb/5% Sn). The CF package substrate is ceramic. The bumped die is flipped and reflowed to the ceramic substrate at assembly. A moisture resistant epoxy underfill encapsulates the bumps.
The design and process requirements should be compatible with standard SMT equipment and with total assembly requirements as driven by other components on the product. Xilinx recommends PCB design rules for each of our packages. These rules are specified in UG112, Device Package User Guide.