Sony HDCU3300 Maintenance Manual page 196
Hd camera control unit
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Also See for HDCU3300:
- Speci?cations (8 pages) ,
- Quick manual (52 pages) ,
- Installation manual (72 pages)
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(VDA-64B BOARD)
Ref. No.
or Q'ty Part No.
SP Description
R204
1-218-823-91 s RES, CHIP 100 (1608)
R205
1-218-887-91 s RES, CHIP 47K (1608)
R207
1-218-847-91 s RES, CHIP 1.0K (1608)
R208
1-218-847-91 s RES, CHIP 1.0K (1608)
R209
1-218-831-91 s RES, CHIP 220 (1608)
R210
1-218-831-91 s RES, CHIP 220 (1608)
R212
1-218-839-91 s RES, CHIP 470 (1608)
R214
1-218-839-91 s RES, CHIP 470 (1608)
R215
1-216-864-91 s CONDUCTOR, CHIP (1608)
R216
1-216-864-91 s CONDUCTOR, CHIP (1608)
R217
1-218-847-91 s RES, CHIP 1.0K (1608)
R218
1-218-847-91 s RES, CHIP 1.0K (1608)
R219
1-218-823-91 s RES, CHIP 100 (1608)
R220
1-218-823-91 s RES, CHIP 100 (1608)
R221
1-218-843-91 s RES, CHIP 680 (1608)
R222
1-218-843-91 s RES, CHIP 680 (1608)
R225
1-218-843-91 s RES, CHIP 680 (1608)
R226
1-218-843-91 s RES, CHIP 680 (1608)
R227
1-211-990-91 s RES, CHIP 75 (1608)
R228
1-211-990-91 s RES, CHIP 75 (1608)
R229
1-218-887-91 s RES, CHIP 47K (1608)
R230
1-218-887-91 s RES, CHIP 47K (1608)
R231
1-218-887-91 s RES, CHIP 47K (1608)
R232
1-211-977-91 s RES, CHIP 22 (1608)
R235
1-218-859-91 s RES, CHIP 3.3K (1608)
R236
1-218-887-91 s RES, CHIP 47K (1608)
R237
1-211-977-91 s RES, CHIP 22 (1608)
R238
1-211-990-91 s RES, CHIP 75 (1608)
RY101
1-755-380-21 s RELAY
RY201
1-755-380-21 s RELAY
4-152
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VIF-34G BOARD
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Ref. No.
or Q'ty Part No.
SP Description
1pc
A-1161-076-A s MOUNTED CIRCUIT BOARD, VIF-34G
C1
1-127-573-91 s CAP, CHIP CERAMIC 1MF B (2012)
C2
1-127-573-91 s CAP, CHIP CERAMIC 1MF B (2012)
C3
1-126-395-21 s CAP, CHIP ELECT 22MF (5X5.7)
C4
1-126-395-21 s CAP, CHIP ELECT 22MF (5X5.7)
C5
1-164-874-81 s CAP,CHIP CERAMIC 100PF CH 1005
C6
1-164-874-81 s CAP,CHIP CERAMIC 100PF CH 1005
C7
1-100-505-91 s CAP, CERAMIC 0.1MF C (1005)
C8
1-100-505-91 s CAP, CERAMIC 0.1MF C (1005)
C9
1-165-989-91 s CAP, CERAMIC 10MF (2012)
C10
1-165-989-91 s CAP, CERAMIC 10MF (2012)
C11
1-164-874-81 s CAP,CHIP CERAMIC 100PF CH 1005
C12
1-127-573-91 s CAP, CHIP CERAMIC 1MF B (2012)
C13
1-100-055-21 s CAP, CHIP CERAMIC 22MF B 3225
C14
1-100-055-21 s CAP, CHIP CERAMIC 22MF B 3225
C15
1-100-055-21 s CAP, CHIP CERAMIC 22MF B 3225
C16
1-100-055-21 s CAP, CHIP CERAMIC 22MF B 3225
C17
1-127-573-91 s CAP, CHIP CERAMIC 1MF B (2012)
C18
1-115-340-91 s CAP, CERAMIC 0.22MF B (2012)
C19
1-115-340-91 s CAP, CERAMIC 0.22MF B (2012)
C20
1-128-589-21 s CAP, CHIP ELECT 47MF
C21
1-126-399-21 s CAP, CHIP ELECT 10MF (5X5.7)
C22
1-126-399-21 s CAP, CHIP ELECT 10MF (5X5.7)
C23
1-164-874-81 s CAP,CHIP CERAMIC 100PF CH 1005
C24
1-165-989-91 s CAP, CERAMIC 10MF (2012)
C25
1-164-874-81 s CAP,CHIP CERAMIC 100PF CH 1005
C26
1-100-055-21 s CAP, CHIP CERAMIC 22MF B 3225
C27
1-100-055-21 s CAP, CHIP CERAMIC 22MF B 3225
C28
1-100-055-21 s CAP, CHIP CERAMIC 22MF B 3225
C29
1-100-055-21 s CAP, CHIP CERAMIC 22MF B 3225
C31
1-100-505-91 s CAP, CERAMIC 0.1MF C (1005)
C32
1-100-505-91 s CAP, CERAMIC 0.1MF C (1005)
C33
1-100-505-91 s CAP, CERAMIC 0.1MF C (1005)
C34
1-100-505-91 s CAP, CERAMIC 0.1MF C (1005)
C35
1-100-505-91 s CAP, CERAMIC 0.1MF C (1005)
C36
1-100-505-91 s CAP, CERAMIC 0.1MF C (1005)
C101
1-100-505-91 s CAP, CERAMIC 0.1MF C (1005)
C102
1-100-505-91 s CAP, CERAMIC 0.1MF C (1005)
C103
1-100-055-21 s CAP, CHIP CERAMIC 22MF B 3225
C104
1-100-506-91 s CAP, CERAMIC 1MF C (1005)
C105
1-100-506-91 s CAP, CERAMIC 1MF C (1005)
C106
1-100-055-21 s CAP, CHIP CERAMIC 22MF B 3225
C107
1-100-055-21 s CAP, CHIP CERAMIC 22MF B 3225
C108
1-100-506-91 s CAP, CERAMIC 1MF C (1005)
C109
1-100-506-91 s CAP, CERAMIC 1MF C (1005)
C110
1-100-055-21 s CAP, CHIP CERAMIC 22MF B 3225
C111
1-100-055-21 s CAP, CHIP CERAMIC 22MF B 3225
C112
1-100-506-91 s CAP, CERAMIC 1MF C (1005)
C113
1-100-506-91 s CAP, CERAMIC 1MF C (1005)
C114
1-100-055-21 s CAP, CHIP CERAMIC 22MF B 3225
C115
1-100-506-91 s CAP, CERAMIC 1MF C (1005)
C116
1-100-506-91 s CAP, CERAMIC 1MF C (1005)
C117
1-164-874-81 s CAP,CHIP CERAMIC 100PF CH 1005
C120
1-127-573-91 s CAP, CHIP CERAMIC 1MF B (2012)
C121
1-127-573-91 s CAP, CHIP CERAMIC 1MF B (2012)
C122
1-100-505-91 s CAP, CERAMIC 0.1MF C (1005)
CN3
1-778-451-31 s CONNECTOR, FFC/FPC(ZIF) AN 50P
CN4
1-770-161-21 s PIN, CONNECTOR (PC BOARD) 6P
HDCU3300/MM (J,E)
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