Sony HDCU3300 Maintenance Manual page 179
Hd camera control unit
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Also See for HDCU3300:
- Speci?cations (8 pages) ,
- Quick manual (52 pages) ,
- Installation manual (72 pages)
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(SDP-15 BOARD suffix 11)
Ref. No.
or Q'ty Part No.
SP Description
C413
1-100-507-91 s CAP, CERAMIC 4.7MF C (1608)
C414
1-100-506-91 s CAP, CERAMIC 1MF C (1005)
C415
1-100-506-91 s CAP, CERAMIC 1MF C (1005)
C416
1-100-506-91 s CAP, CERAMIC 1MF C (1005)
C417
1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C418
1-164-939-81 s CAP, CHIPCERAMIC 2200PF B 1005
C419
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C420
1-100-506-91 s CAP, CERAMIC 1MF C (1005)
C423
1-100-507-91 s CAP, CERAMIC 4.7MF C (1608)
C424
1-100-507-91 s CAP, CERAMIC 4.7MF C (1608)
C425
1-100-506-91 s CAP, CERAMIC 1MF C (1005)
C426
1-100-506-91 s CAP, CERAMIC 1MF C (1005)
C428
1-100-506-91 s CAP, CERAMIC 1MF C (1005)
C429
1-100-507-91 s CAP, CERAMIC 4.7MF C (1608)
C430
1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C431
1-100-507-91 s CAP, CERAMIC 4.7MF C (1608)
C432
1-100-507-91 s CAP, CERAMIC 4.7MF C (1608)
C433
1-100-506-91 s CAP, CERAMIC 1MF C (1005)
C436
1-100-507-91 s CAP, CERAMIC 4.7MF C (1608)
C437
1-100-506-91 s CAP, CERAMIC 1MF C (1005)
C439
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C440
1-128-416-21 s CAP, CHIP ELECT 100MF
C447
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C448
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C449
1-100-055-21 s CAP, CHIP CERAMIC 22MF B 3225
C450
1-100-055-21 s CAP, CHIP CERAMIC 22MF B 3225
C451
1-100-055-21 s CAP, CHIP CERAMIC 22MF B 3225
C452
1-100-055-21 s CAP, CHIP CERAMIC 22MF B 3225
C453
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C454
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C455
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C456
1-100-507-91 s CAP, CERAMIC 4.7MF C (1608)
C457
1-100-507-91 s CAP, CERAMIC 4.7MF C (1608)
C459
1-100-507-91 s CAP, CERAMIC 4.7MF C (1608)
C460
1-100-506-91 s CAP, CERAMIC 1MF C (1005)
C461
1-216-864-91 s CONDUCTOR, CHIP (1608)
C462
1-216-864-91 s CONDUCTOR, CHIP (1608)
C466
1-216-864-91 s CONDUCTOR, CHIP (1608)
C467
1-216-864-91 s CONDUCTOR, CHIP (1608)
C471
1-216-864-91 s CONDUCTOR, CHIP (1608)
C472
1-216-864-91 s CONDUCTOR, CHIP (1608)
C476
1-216-864-91 s CONDUCTOR, CHIP (1608)
C477
1-216-864-91 s CONDUCTOR, CHIP (1608)
C481
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C483
1-216-864-91 s CONDUCTOR, CHIP (1608)
C484
1-216-864-91 s CONDUCTOR, CHIP (1608)
C488
1-100-507-91 s CAP, CERAMIC 4.7MF C (1608)
C489
1-100-507-91 s CAP, CERAMIC 4.7MF C (1608)
C502
1-112-015-91 s CAP, CHIP CERAMIC 47MF B 3225
C503
1-112-015-91 s CAP, CHIP CERAMIC 47MF B 3225
C701
1-165-989-91 s CAP, CERAMIC 10MF (2012)
C702
1-100-506-91 s CAP, CERAMIC 1MF C (1005)
C703
1-100-506-91 s CAP, CERAMIC 1MF C (1005)
C704
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C705
1-100-506-91 s CAP, CERAMIC 1MF C (1005)
C706
1-100-506-91 s CAP, CERAMIC 1MF C (1005)
C707
1-100-506-91 s CAP, CERAMIC 1MF C (1005)
C708
1-100-507-91 s CAP, CERAMIC 4.7MF C (1608)
C709
1-100-507-91 s CAP, CERAMIC 4.7MF C (1608)
HDCU3300/MM (J,E)
(SDP-15 BOARD suffix 11)
Ref. No.
or Q'ty Part No.
SP Description
C710
1-125-891-91 s CAP, CHIP CERAMIC0.47MF B 1608
C711
1-165-989-91 s CAP, CERAMIC 10MF (2012)
C712
1-165-989-91 s CAP, CERAMIC 10MF (2012)
C713
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C715
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C717
1-100-507-91 s CAP, CERAMIC 4.7MF C (1608)
C718
1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C719
1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C720
1-100-507-91 s CAP, CERAMIC 4.7MF C (1608)
C721
1-164-939-81 s CAP, CHIPCERAMIC 2200PF B 1005
C722
1-100-506-91 s CAP, CERAMIC 1MF C (1005)
C723
1-164-939-81 s CAP, CHIPCERAMIC 2200PF B 1005
C724
1-100-506-91 s CAP, CERAMIC 1MF C (1005)
C725
1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C726
1-100-506-91 s CAP, CERAMIC 1MF C (1005)
C727
1-100-506-91 s CAP, CERAMIC 1MF C (1005)
C728
1-100-506-91 s CAP, CERAMIC 1MF C (1005)
C729
1-100-506-91 s CAP, CERAMIC 1MF C (1005)
C731
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C732
1-100-506-91 s CAP, CERAMIC 1MF C (1005)
CN103
1-695-480-21 o PIN, CONNECTOR (PC BOARD) 2P
CN104
1-770-470-21 o PIN, CONNECTOR (PC BOARD) 6P
CN105
1-815-921-11 s JACK, MODULAR
CN301
1-764-080-21 o PIN, CONNECTOR (PC BOARD) 8P
CN401
1-785-553-21 o CONNECTOR, BOARD TO BOARD 120P
D1
8-719-017-03 s DIODE 02DZ4.7-TPH3
D2
8-719-017-03 s DIODE 02DZ4.7-TPH3
D3
8-719-017-03 s DIODE 02DZ4.7-TPH3
D4
8-719-017-03 s DIODE 02DZ4.7-TPH3
D5
8-719-024-81 s DIODE 1SS300-TE85L
D101
8-719-024-81 s DIODE 1SS300-TE85L
D102
8-719-024-81 s DIODE 1SS300-TE85L
D103
8-719-024-81 s DIODE 1SS300-TE85L
D401
8-719-989-77 s DIODE SC802-04-TE12RA
D402
8-719-989-77 s DIODE SC802-04-TE12RA
E1
1-535-877-22 s CHIP, CHECKER
E2
1-535-877-22 s CHIP, CHECKER
E3
1-535-877-22 s CHIP, CHECKER
FB1
1-469-094-21 s FERRITE, EMI (SMD) (1608)
FB2
1-469-094-21 s FERRITE, EMI (SMD) (1608)
FB3
1-469-094-21 s FERRITE, EMI (SMD) (1608)
FB4
1-469-094-21 s FERRITE, EMI (SMD) (1608)
FB5
1-469-094-21 s FERRITE, EMI (SMD) (1608)
FB6
1-469-094-21 s FERRITE, EMI (SMD) (1608)
FB101
1-414-554-21 s FERRITE, EMI (SMD) (1608)
FB203
1-414-554-21 s FERRITE, EMI (SMD) (1608)
FB204
1-414-554-21 s FERRITE, EMI (SMD) (1608)
FB205
1-414-554-21 s FERRITE, EMI (SMD) (1608)
FB206
1-414-554-21 s FERRITE, EMI (SMD) (1608)
FB207
1-414-554-21 s FERRITE, EMI (SMD) (1608)
FB208
1-414-554-21 s FERRITE, EMI (SMD) (1608)
FB209
1-414-554-21 s FERRITE, EMI (SMD) (1608)
FB210
1-414-554-21 s FERRITE, EMI (SMD) (1608)
FB211
1-414-554-21 s FERRITE, EMI (SMD) (1608)
FB301
1-414-554-21 s FERRITE, EMI (SMD) (1608)
FB302
1-414-554-21 s FERRITE, EMI (SMD) (1608)
FB303
1-414-554-21 s FERRITE, EMI (SMD) (1608)
FB305
1-414-554-21 s FERRITE, EMI (SMD) (1608)
4-135
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