Sony HDCU3300 Maintenance Manual page 66

Hd camera control unit
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(AU-302 BOARD suffix 14)
Ref. No.
or Q'ty Part No.
SP Description
L7
1-414-404-41 s INDUCTOR (SMD) 100.0UH
Q1
8-729-928-05 s TRANSISTOR 2SC4617TL-QR
R1
1-208-863-81 s RES, CHIP 100 (1005)
R2
1-208-887-81 s RES, CHIP 1.0K (1005)
R4
1-208-863-81 s RES, CHIP 100 (1005)
R5
1-208-887-81 s RES, CHIP 1.0K (1005)
R6
1-208-863-81 s RES, CHIP 100 (1005)
R7
1-208-887-81 s RES, CHIP 1.0K (1005)
R8
1-208-887-81 s RES, CHIP 1.0K (1005)
R10
1-208-863-81 s RES, CHIP 100 (1005)
R11
1-208-911-81 s RES, CHIP 10K (1005)
R12
1-208-919-81 s RES, CHIP 22K (1005)
R13
1-208-867-81 s RES, CHIP 150 (1005)
R15
1-208-919-81 s RES, CHIP 22K (1005)
R16
1-208-867-81 s RES, CHIP 150 (1005)
R17
1-208-903-81 s RES, CHIP 4.7K (1005)
R18
1-208-935-81 s RES, CHIP 100K (1005)
R19
1-208-935-81 s RES, CHIP 100K (1005)
R20
1-218-851-91 s RES, CHIP 1.5K (1608)
R21
1-218-851-91 s RES, CHIP 1.5K (1608)
R22
1-208-911-81 s RES, CHIP 10K (1005)
R25
1-208-895-81 s RES, CHIP 2.2K (1005)
R26
1-208-943-81 s RES, CHIP 220K (1005)
R27
1-208-919-81 s RES, CHIP 22K (1005)
R28
1-208-895-81 s RES, CHIP 2.2K (1005)
R29
1-208-943-81 s RES, CHIP 220K (1005)
R30
1-208-943-81 s RES, CHIP 220K (1005)
R31
1-208-863-81 s RES, CHIP 100 (1005)
R32
1-208-935-81 s RES, CHIP 100K (1005)
R33
1-208-943-81 s RES, CHIP 220K (1005)
R34
1-208-943-81 s RES, CHIP 220K (1005)
R42
1-208-863-81 s RES, CHIP 100 (1005)
R43
1-208-863-81 s RES, CHIP 100 (1005)
R44
1-208-863-81 s RES, CHIP 100 (1005)
RV1
1-238-255-21 s RES, VAR, CARBON 10K
S1
1-762-122-11 s SWITCH, TOGGLE
S2
1-762-217-31 s SWITCH, SLIDE
S3
1-570-711-33 s SWITCH, SLIDE
S4
1-762-217-31 s SWITCH, SLIDE
S5
1-570-711-33 s SWITCH, SLIDE
4-22
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AVP-6 BOARD
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Ref. No.
or Q'ty Part No.
SP Description
1pc
A-1129-300-A s MOUNTED CIRCUIT BOARD, AVP-6
4pcs
7-682-947-01 s SCREW +PSW 3X6
C100
1-100-505-91 s CAP, CERAMIC 0.1MF C (1005)
C101
1-127-692-91 s CAP, CHIP CERAMIC 10MF B 3225
C102
1-127-573-91 s CAP, CHIP CERAMIC 1MF B (2012)
C103
1-127-573-91 s CAP, CHIP CERAMIC 1MF B (2012)
C104
1-127-573-91 s CAP, CHIP CERAMIC 1MF B (2012)
C105
1-127-573-91 s CAP, CHIP CERAMIC 1MF B (2012)
C106
1-127-573-91 s CAP, CHIP CERAMIC 1MF B (2012)
C107
1-126-396-21 s CAP, CHIP ELECT 47MF (6.3X5.7)
C108
1-126-396-21 s CAP, CHIP ELECT 47MF (6.3X5.7)
C109
1-126-396-21 s CAP, CHIP ELECT 47MF (6.3X5.7)
C110
1-126-396-21 s CAP, CHIP ELECT 47MF (6.3X5.7)
C111
1-126-396-21 s CAP, CHIP ELECT 47MF (6.3X5.7)
C112
1-127-692-91 s CAP, CHIP CERAMIC 10MF B 3225
C113
1-100-055-21 s CAP, CHIP CERAMIC 22MF B 3225
C114
1-100-505-91 s CAP, CERAMIC 0.1MF C (1005)
C115
1-164-874-81 s CAP,CHIP CERAMIC 100PF CH 1005
C116
1-164-874-81 s CAP,CHIP CERAMIC 100PF CH 1005
C117
1-164-874-81 s CAP,CHIP CERAMIC 100PF CH 1005
C118
1-164-874-81 s CAP,CHIP CERAMIC 100PF CH 1005
C119
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C120
1-165-989-91 s CAP, CERAMIC 10MF (2012)
C121
1-127-692-91 s CAP, CHIP CERAMIC 10MF B 3225
C123
1-127-573-91 s CAP, CHIP CERAMIC 1MF B (2012)
C124
1-165-989-91 s CAP, CERAMIC 10MF (2012)
C125
1-165-989-91 s CAP, CERAMIC 10MF (2012)
C126
1-165-989-91 s CAP, CERAMIC 10MF (2012)
C127
1-126-396-21 s CAP, CHIP ELECT 47MF (6.3X5.7)
C129
1-127-573-91 s CAP, CHIP CERAMIC 1MF B (2012)
C130
1-119-923-81 s CAP, CERAMIC 0.047MF B 1005
C131
1-100-055-21 s CAP, CHIP CERAMIC 22MF B 3225
C132
1-127-573-91 s CAP, CHIP CERAMIC 1MF B (2012)
C133
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C134
1-100-055-21 s CAP, CHIP CERAMIC 22MF B 3225
C135
1-100-055-21 s CAP, CHIP CERAMIC 22MF B 3225
C136
1-100-055-21 s CAP, CHIP CERAMIC 22MF B 3225
C137
1-164-874-81 s CAP,CHIP CERAMIC 100PF CH 1005
C138
1-100-055-21 s CAP, CHIP CERAMIC 22MF B 3225
C139
1-100-055-21 s CAP, CHIP CERAMIC 22MF B 3225
C140
1-119-923-81 s CAP, CERAMIC 0.047MF B 1005
C141
1-100-506-91 s CAP, CERAMIC 1MF C (1005)
C143
1-100-055-21 s CAP, CHIP CERAMIC 22MF B 3225
C144
1-100-055-21 s CAP, CHIP CERAMIC 22MF B 3225
C145
1-100-055-21 s CAP, CHIP CERAMIC 22MF B 3225
C146
1-100-055-21 s CAP, CHIP CERAMIC 22MF B 3225
C147
1-100-055-21 s CAP, CHIP CERAMIC 22MF B 3225
C148
1-107-819-81 s CAP,CHIP CERAMIC 22000PF B1005
C149
1-164-936-81 s CAP, CHIP CERAMIC 680PF B 1005
C150
1-100-055-21 s CAP, CHIP CERAMIC 22MF B 3225
C151
1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C152
1-100-055-21 s CAP, CHIP CERAMIC 22MF B 3225
C153
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C154
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C155
1-100-055-21 s CAP, CHIP CERAMIC 22MF B 3225
C156
1-127-692-91 s CAP, CHIP CERAMIC 10MF B 3225
C157
1-107-826-91 s CAP, CHIP CERAMIC 100000PF B
C158
1-107-826-91 s CAP, CHIP CERAMIC 100000PF B
HDCU3300/MM (J,E)

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