Sony HDCU3300 Maintenance Manual page 186
Hd camera control unit
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Also See for HDCU3300:
- Speci?cations (8 pages) ,
- Quick manual (52 pages) ,
- Installation manual (72 pages)
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(SDP-15 BOARD suffix 12)
Ref. No.
or Q'ty Part No.
SP Description
C112
1-125-891-91 s CAP, CHIP CERAMIC0.47MF B 1608
C113
1-100-055-21 s CAP, CHIP CERAMIC 22MF B 3225
C114
1-100-055-21 s CAP, CHIP CERAMIC 22MF B 3225
C115
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C116
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C117
1-164-850-81 s CAP, CHIP CERAMIC 10PF CH 1005
C118
1-164-850-81 s CAP, CHIP CERAMIC 10PF CH 1005
C119
1-164-937-81 s CAP, CHIPCERAMIC 1000PF B 1005
C120
1-164-937-81 s CAP, CHIPCERAMIC 1000PF B 1005
C121
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C122
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C123
1-165-989-91 s CAP, CERAMIC 10MF (2012)
C124
1-165-989-91 s CAP, CERAMIC 10MF (2012)
C125
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C221
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C225
1-100-507-91 s CAP, CERAMIC 4.7MF C (1608)
C226
1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C227
1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C228
1-100-507-91 s CAP, CERAMIC 4.7MF C (1608)
C229
1-164-939-81 s CAP, CHIPCERAMIC 2200PF B 1005
C230
1-100-506-91 s CAP, CERAMIC 1MF C (1005)
C231
1-164-939-81 s CAP, CHIPCERAMIC 2200PF B 1005
C232
1-100-506-91 s CAP, CERAMIC 1MF C (1005)
C233
1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C234
1-100-506-91 s CAP, CERAMIC 1MF C (1005)
C235
1-100-506-91 s CAP, CERAMIC 1MF C (1005)
C236
1-100-506-91 s CAP, CERAMIC 1MF C (1005)
C237
1-100-506-91 s CAP, CERAMIC 1MF C (1005)
C238
1-100-506-91 s CAP, CERAMIC 1MF C (1005)
C239
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C246
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C248
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C249
1-165-989-91 s CAP, CERAMIC 10MF (2012)
C250
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C251
1-165-989-91 s CAP, CERAMIC 10MF (2012)
C252
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C253
1-165-989-91 s CAP, CERAMIC 10MF (2012)
C254
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C255
1-165-989-91 s CAP, CERAMIC 10MF (2012)
C256
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C257
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C258
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C259
1-165-989-91 s CAP, CERAMIC 10MF (2012)
C260
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C261
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C262
1-165-989-91 s CAP, CERAMIC 10MF (2012)
C263
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C264
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C265
1-165-989-91 s CAP, CERAMIC 10MF (2012)
C266
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C267
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C268
1-165-989-91 s CAP, CERAMIC 10MF (2012)
C269
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C270
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C271
1-165-989-91 s CAP, CERAMIC 10MF (2012)
C301
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C302
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C303
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C305
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
4-142
(SDP-15 BOARD suffix 12)
Ref. No.
or Q'ty Part No.
SP Description
C308
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C309
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C313
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C314
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C316
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C317
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C319
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C320
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C321
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C322
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C323
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C324
1-165-989-91 s CAP, CERAMIC 10MF (2012)
C325
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C326
1-165-989-91 s CAP, CERAMIC 10MF (2012)
C327
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C328
1-165-989-91 s CAP, CERAMIC 10MF (2012)
C329
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C330
1-165-989-91 s CAP, CERAMIC 10MF (2012)
C331
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C332
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C333
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C334
1-165-989-91 s CAP, CERAMIC 10MF (2012)
C335
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C336
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C337
1-165-989-91 s CAP, CERAMIC 10MF (2012)
C338
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C339
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C340
1-165-989-91 s CAP, CERAMIC 10MF (2012)
C341
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C342
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C343
1-165-989-91 s CAP, CERAMIC 10MF (2012)
C344
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C345
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C346
1-100-506-91 s CAP, CERAMIC 1MF C (1005)
C347
1-100-506-91 s CAP, CERAMIC 1MF C (1005)
C348
1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C349
1-164-939-81 s CAP, CHIPCERAMIC 2200PF B 1005
C350
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C351
1-100-506-91 s CAP, CERAMIC 1MF C (1005)
C354
1-100-506-91 s CAP, CERAMIC 1MF C (1005)
C355
1-100-507-91 s CAP, CERAMIC 4.7MF C (1608)
C356
1-100-506-91 s CAP, CERAMIC 1MF C (1005)
C357
1-100-507-91 s CAP, CERAMIC 4.7MF C (1608)
C358
1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C359
1-100-506-91 s CAP, CERAMIC 1MF C (1005)
C360
1-100-506-91 s CAP, CERAMIC 1MF C (1005)
C361
1-100-506-91 s CAP, CERAMIC 1MF C (1005)
C362
1-100-507-91 s CAP, CERAMIC 4.7MF C (1608)
C363
1-100-507-91 s CAP, CERAMIC 4.7MF C (1608)
C365
1-100-506-91 s CAP, CERAMIC 1MF C (1005)
C366
1-100-507-91 s CAP, CERAMIC 4.7MF C (1608)
C368
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C369
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C401
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C402
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C403
1-100-506-91 s CAP, CERAMIC 1MF C (1005)
C408
1-100-507-91 s CAP, CERAMIC 4.7MF C (1608)
C410
1-100-507-91 s CAP, CERAMIC 4.7MF C (1608)
C412
1-100-507-91 s CAP, CERAMIC 4.7MF C (1608)
HDCU3300/MM (J,E)
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