Sony HDCU3300 Maintenance Manual page 126
Hd camera control unit
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- Speci?cations (8 pages) ,
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- Installation manual (72 pages)
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DTX-5 BOARD suffix (11, 12)
---------------------------
*1: Board No. suffix 11
*2: Board No. suffix 12
Ref. No.
or Q'ty Part No.
SP Description
1pc
A-1129-301-A s MOUNTED CIRCUIT BOARD, DTX-5
4pcs
7-682-947-01 s SCREW +PSW 3X6
C101
1-127-573-91 s CAP, CHIP CERAMIC 1MF B (2012)
C102
1-127-573-91 s CAP, CHIP CERAMIC 1MF B (2012)
C103
1-126-396-21 s CAP, CHIP ELECT 47MF (6.3X5.7)
C104
1-126-396-21 s CAP, CHIP ELECT 47MF (6.3X5.7)
C105
1-164-874-81 s CAP,CHIP CERAMIC 100PF CH 1005
C106
1-164-874-81 s CAP,CHIP CERAMIC 100PF CH 1005
C107
1-127-692-91 s CAP, CHIP CERAMIC 10MF B 3225
C108
1-164-874-81 s CAP,CHIP CERAMIC 100PF CH 1005
C109
1-127-692-91 s CAP, CHIP CERAMIC 10MF B 3225
C110
1-127-573-91 s CAP, CHIP CERAMIC 1MF B (2012)
C111
1-127-573-91 s CAP, CHIP CERAMIC 1MF B (2012)
C112
1-127-573-91 s CAP, CHIP CERAMIC 1MF B (2012)
C113
1-128-589-21 s CAP, CHIP ELECT 47MF
C114
1-128-589-21 s CAP, CHIP ELECT 47MF
C115
1-127-573-91 s CAP, CHIP CERAMIC 1MF B (2012)
C116
1-128-589-21 s CAP, CHIP ELECT 47MF
C117
1-164-874-81 s CAP,CHIP CERAMIC 100PF CH 1005
C118 *1 1-127-738-91 s CAP, CERAMIC 4700000PF B(3225)
*2 1-127-573-91 s CAP, CHIP CERAMIC 1MF B (2012)
C119
1-164-874-81 s CAP,CHIP CERAMIC 100PF CH 1005
C120
1-127-573-91 s CAP, CHIP CERAMIC 1MF B (2012)
C121
1-128-589-21 s CAP, CHIP ELECT 47MF
C122
1-127-573-91 s CAP, CHIP CERAMIC 1MF B (2012)
C123
1-128-589-21 s CAP, CHIP ELECT 47MF
C124
1-164-874-81 s CAP,CHIP CERAMIC 100PF CH 1005
C125
1-127-692-91 s CAP, CHIP CERAMIC 10MF B 3225
C126
1-164-874-81 s CAP,CHIP CERAMIC 100PF CH 1005
C127
1-127-573-91 s CAP, CHIP CERAMIC 1MF B (2012)
C128
1-128-589-21 s CAP, CHIP ELECT 47MF
C129
1-127-692-91 s CAP, CHIP CERAMIC 10MF B 3225
C130
1-119-923-81 s CAP, CERAMIC 0.047MF B 1005
C131
1-100-055-21 s CAP, CHIP CERAMIC 22MF B 3225
C132
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C133
1-100-055-21 s CAP, CHIP CERAMIC 22MF B 3225
C134
1-119-923-81 s CAP, CERAMIC 0.047MF B 1005
C135
1-100-055-21 s CAP, CHIP CERAMIC 22MF B 3225
C136
1-107-819-81 s CAP,CHIP CERAMIC 22000PF B1005
C137
1-164-936-81 s CAP, CHIP CERAMIC 680PF B 1005
C138
1-100-055-21 s CAP, CHIP CERAMIC 22MF B 3225
C139
1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C140
1-127-692-91 s CAP, CHIP CERAMIC 10MF B 3225
C141
1-127-692-91 s CAP, CHIP CERAMIC 10MF B 3225
C142
1-119-923-81 s CAP, CERAMIC 0.047MF B 1005
C143
1-100-055-21 s CAP, CHIP CERAMIC 22MF B 3225
C144
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C145
1-100-055-21 s CAP, CHIP CERAMIC 22MF B 3225
C146
1-119-923-81 s CAP, CERAMIC 0.047MF B 1005
C147
1-100-055-21 s CAP, CHIP CERAMIC 22MF B 3225
C148
1-107-819-81 s CAP,CHIP CERAMIC 22000PF B1005
C149
1-164-936-81 s CAP, CHIP CERAMIC 680PF B 1005
C150
1-100-055-21 s CAP, CHIP CERAMIC 22MF B 3225
C151
1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C152
1-127-692-91 s CAP, CHIP CERAMIC 10MF B 3225
C154
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
4-82
(DTX-5 BOARD suffix 11, 12)
Ref. No.
or Q'ty Part No.
SP Description
C155
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C156
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C157
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C158
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C159
1-165-989-91 s CAP, CERAMIC 10MF (2012)
C160
1-165-989-91 s CAP, CERAMIC 10MF (2012)
C161
1-165-989-91 s CAP, CERAMIC 10MF (2012)
C162
1-165-989-91 s CAP, CERAMIC 10MF (2012)
C163
1-128-589-21 s CAP, CHIP ELECT 47MF
C164
1-128-589-21 s CAP, CHIP ELECT 47MF
C165
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C201
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C202
1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C203
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C204
1-164-939-81 s CAP, CHIPCERAMIC 2200PF B 1005
C205
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C207 *2 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C208
1-165-871-21 s CAP, ELECT 22MF (4.0X5.5)
C209
1-100-507-91 s CAP, CERAMIC 4.7MF C (1608)
C210
1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C211
1-100-507-91 s CAP, CERAMIC 4.7MF C (1608)
C212
1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C213
1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C215
1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C216
1-127-573-91 s CAP, CHIP CERAMIC 1MF B (2012)
C217
1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C218 *2 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C219
1-100-506-91 s CAP, CERAMIC 1MF C (1005)
C220
1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C221 *1 1-100-506-91 s CAP, CERAMIC 1MF C (1005)
*2 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C222
1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C223
1-100-506-91 s CAP, CERAMIC 1MF C (1005)
C224
1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C225
1-100-506-91 s CAP, CERAMIC 1MF C (1005)
C226
1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C227
1-100-506-91 s CAP, CERAMIC 1MF C (1005)
C228
1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C251
1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C252
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C253
1-100-506-91 s CAP, CERAMIC 1MF C (1005)
C254
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C255
1-165-989-91 s CAP, CERAMIC 10MF (2012)
C256
1-165-989-91 s CAP, CERAMIC 10MF (2012)
C257
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C258
1-165-989-91 s CAP, CERAMIC 10MF (2012)
C259
1-164-850-81 s CAP, CHIP CERAMIC 10PF CH 1005
C260
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C261
1-165-989-91 s CAP, CERAMIC 10MF (2012)
C262
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C263
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C264
1-100-506-91 s CAP, CERAMIC 1MF C (1005)
C265
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C266
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C267
1-100-506-91 s CAP, CERAMIC 1MF C (1005)
C268
1-100-506-91 s CAP, CERAMIC 1MF C (1005)
C269
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C270
1-100-506-91 s CAP, CERAMIC 1MF C (1005)
C271
1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
HDCU3300/MM (J,E)
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