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No. per
Pos.
Ref Des
Board
31
U1
33
U2
34
JP1
35
JP2, JP6, JP8
JP3, JP5, JP9,
36a
JP10
38
JP1a
38
C7
38
C8-9
38
C041
SLAU278AG – MAY 2009 – REVISED DECEMBER 2020
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Table B-47. EM430F6147RF900 Bill of Materials (continued)
Description
DUT, SMT, PQFP, RGC-64, 0.5mmLS,
1
9.15x9.15x1mm, THRM.PAD
IC, Step Down Converter with Bypass Mode for
1
Low Power Wireless
1
Pin Connector 2x4pin
3
Pin Connector 1x3pin
4
Pin Connector 1x2pin
1
Pin Connector 2x3pin
1
Capacitor, Ceramic, 1206, 16V, X5R, 20%
2
CAP, SMD, Ceramic, 0402, 2.2uF, X5R
CAP, SMD, Ceramic, 0603, 4.7uF, 16V, 10%,
1
X5R
Copyright © 2020 Texas Instruments Incorporated
Part No.
CC430F6147
TI
TPS62370
TI
61300821121
WUERTH
61300311121
WUERTH
61300211121
WUERTH
61300621121
WUERTH
GRM31CR61C226ME15L
MURATA
GRM155R60J225ME15D
MURATA
MURATA
MSP430™ Hardware Tools
Hardware
Manufacturer
187