Ilm Back Plate Design Overview; Durability; Ilm Assembly - Intel Xeon E5-2400 Thermal/Mechanical Design Manual

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Figure 3-1.

3.1.2

ILM Back Plate Design Overview

The unified back plate consists of a flat steel back plate with threaded studs for ILM

attach, and internally threaded nuts for heatsink attach. The threaded studs have a

smooth surface feature that provides alignment for the back plate to the motherboard

for proper assembly of the ILM around the socket. A clearance hole is located at the

center of the plate to allow access to test points and backside capacitors. An additional

cut-out on two sides provides clearance for backside voltage regulator components. An

insulator is pre-applied. To stay within the temperature limit of the insulator, remove

the back plate prior to board component rework.

3.1.3

The ILM durability requirement is 30 processor cycles. 1 processor cycle = install

processor, close load plate, latch load lever, unlatch load lever, open load plate.

The ILM durability requirement is 6 assembly cycles. See

procedure. 1 assembly cycle = fasten the ILM assembly to the back plate with the four

captive screws, torque to 9 ± 1 inch-pounds, unfasten ILM assembly from the back

plate.

Independent Loading Mechanism (ILM) and Back Plate

Section 3.2

Intel® Xeon® Processor E5-2400 Product Family

Thermal/Mechanical Design Guide

for assembly

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