Lga1356 Socket; Lga1356 Socket With Pick And Place Cover Removed - Intel Xeon E5-2400 Thermal/Mechanical Design Manual

LGA1356 Socket

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LGA1356 Socket
This chapter describes a surface mount, LGA (Land Grid Array) socket intended for
processors in the E5-2400 Product Family Platform. The socket provides I/O, power and
ground contacts. The socket contains 1356 contacts arrayed about a cavity in the
center of the socket with lead-free solder balls for surface mounting on the
motherboard.
The socket has 1356 contacts with 1.016 mm X 1.016 mm pitch (X by Y) in a 43x41
grid array with 21x17 grid depopulation in the center of the array and selective
depopulation elsewhere.
The socket must be compatible with the package (processor) and the Independent
Loading Mechanism (ILM). The design includes a back plate which is a key contributor
in producing a uniform load on the socket solder joints. Socket loading specifications
are listed in
Figure 2-1.

LGA1356 Socket with Pick and Place Cover Removed

Intel® Xeon® Processor E5-2400 Product Family
Thermal/Mechanical Design Guide
Section 4.4.
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