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80960MC
3.3
Package Thermal Specification
The 80960MC is specified for operation when case
temperature is within the range 0°C to 85°C (PGA).
Measure case temperature at the top center of the
package. Ambient temperature can be calculated
from:
•
T
= T
+ P*θ
J
C
jc
•
T
= T
+ P*θ
A
J
ja
−θ
•
T
= T
+ P*[θ
]
C
A
ja
jc
Values for θ
and θ
for various airflows are given in
ja
jc
for the PGA package. The PGA's θ
Table 10
be reduced by adding a heatsink.
Table 10. 80960MC PGA Package Thermal Characteristics
Thermal Resistance — °C/Watt
Parameter
0
(0)
θ
Junction-to-Case
2
θ
Case-to-Ambient
19
(No Heatsink)
θ
Case-to-Ambient
16
(Omnidirectional
Heatsink)
θ
Case-to-Ambient
15
(Unidirectional
Heatsink)
NOTES:
1. This table applies to 80960MC PGA plugged into socket or soldered directly to board.
2. θ
= θ
+ θ
JA
JC
CA
3. θ
= 4°C/W (approx.)
J-CAP
θ
= 4°C/W (inner pins) (approx.)
J-PIN
θ
= 8°C/W (outer pins) (approx.)
J-PIN
28
can
ja
Airflow — ft./min (m/sec)
50
100
200
(0.25)
(0.50)
(1.01)
2
2
2
18
17
15
15
14
12
14
13
11
Maximum allowable ambient temperature (T
permitted without exceeding T
graphs in
Figure
23,
Figure 24
curves assume the maximum permitted supply
current (I
) at each speed, V
CC
T
of +85° C (PGA).
CASE
400
600
800
(2.03)
(3.04)
(4.06)
2
2
2
12
10
9
9
7
6
8
6
5
A
is shown by the
C
and
Figure
25. The
of +5.0 V and a
CC
θ
JA
θ
θ
J-PIN
JC
θ
J-CAP
)
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