B-2
Board Keepin / Keepout Zones (Sheet 2 of 4)........................................................ 53
B-3
Board Keepin / Keepout Zones (Sheet 3 of 4)........................................................ 54
B-4
Board Keepin / Keepout Zones (Sheet 4 of 4)........................................................ 55
B-5
1U Reference Heatsink Assembly (Sheet 1 of 2) .................................................... 56
B-6
1U Reference Heatsink Assembly (Sheet 2 of 2) .................................................... 57
B-7
1U Reference Heatsink Fin and Base (Sheet 1 of 2)................................................ 58
B-8
1U Reference Heatsink Fin and Base (Sheet 2 of 2)................................................ 59
B-9
Heatsink Shoulder Screw (1U, 2U and Tower) ....................................................... 60
C-1
Socket Mechanical Drawing (Sheet 1 of 4) ............................................................ 86
C-2
Socket Mechanical Drawing (Sheet 2 of 4) ............................................................ 87
C-3
Socket Mechanical Drawing (Sheet 3 of 4) ............................................................ 88
C-4
Socket Mechanical Drawing (Sheet 4 of 4) ............................................................ 89
D-1
Processor Installation Tool .................................................................................. 92
E-1
ATCA Heatsink Performance Curves ..................................................................... 94
E-2
NEBS Thermal Profile ......................................................................................... 95
E-3
ATCA Reference Heat Sink Assembly (Sheet 1 of 2) ............................................... 97
E-4
ATCA Reference Heat Sink Assembly (Sheet 2 of 2) ............................................... 98
E-5
ATCA Reference Heatsink Fin and Base (Sheet 1 of 2) ............................................ 99
E-6
ATCA Reference Heatsink Fin and Base (Sheet 2 of 2) .......................................... 100
Tables
1-1
Reference Documents ........................................................................................ 10
1-2
Terms and Descriptions...................................................................................... 10
4-1
Component Mass............................................................................................... 29
4-2
1356-land Package and LGA1356 Socket Stackup Height ........................................ 29
4-3
Socket and ILM Mechanical Specifications ............................................................. 30
4-4
Electrical Requirements for LGA1356 Socket ......................................................... 31
5-1
Values Used to Generate Processor Thermal Specifications...................................... 33
5-2
Performance Expectations in Compact Electronics Bay (CEB) ................................... 34
Intel® Xeon® Processor E5-2400 Product Family
Thermal/Mechanical Design Guide
5