Contacts; Pick And Place Cover - Intel Xeon E5-2400 Thermal/Mechanical Design Manual

LGA1356 Socket
compatible with immersion silver (ImAg) motherboard surface finish and a SAC
alloy solder paste.
The co-planarity (profile) and true position requirements are defined in
2.3.3

Contacts

Base material for the contacts is high strength copper alloy.
For the area on socket contacts where processor lands will mate, there is a 0.381 μm
[15 μinches] minimum gold plating over 1.27 μm [50 μinches] minimum nickel
underplate.
No contamination by solder in the contact area is allowed during solder reflow.
2.3.4

Pick and Place Cover

The cover provides a planar surface for vacuum pick up used to place components in
the Surface Mount Technology (SMT) manufacturing line. The cover remains on the
socket during reflow to help prevent contamination during reflow. The cover can
withstand 260 °C for 40 seconds (typical reflow/rework profile) and the conditions
listed in the LGA1366 Socket Validation Reports, and LGA1356 Addendum, without
degrading. Reports are available from socket suppliers listed in
As indicated in
installation. Use of the ILM cover can mitigate against bent socket contacts associated
with reinstalling the Pick and Place cover. A cover should remain on whenever possible
to help prevent damage to the socket contacts. See
additional information on the ILM cover.
Pick and Place cover retention must be sufficient to support the socket weight during
lifting, translation, and placement (board manufacturing), and during board and
system shipping and handling.
Pick and Place covers are designed to be interchangeable between socket suppliers. As
indicated in
reference for proper orientation with the socket.
Figure 2-5.

Pick and Place Cover

Intel® Xeon® Processor E5-2400 Product Family
Thermal/Mechanical Design Guide
Figure 2-5, the Pick and Place cover remains on the socket during ILM
Figure 2-5, a Pin1 indicator on the Pick and Place cover provides a visual
ILM cover
ILM Installation
Pick and
Place Cover
Appendix
Appendix A.
Section 3.2 and Section 3.3
Pin 1
C.
for
17