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Embedded Thermal Solutions
Figure E-2.
NEBS Thermal Profile
\
90
80
70
60
50
40
Notes:
1.) The Nominal Thermal Profile must be used for all normal operating conditions, or for products that do not
require NEBS Level 3 compliance.
2.) The Short-Term Thermal Profile may only be used for short-term excursions to higher ambient operating
temperatures, not to exceed 360 hours per year as compliant with NEBS Level 3.
3.) Implementation of either thermal profile should result in virtually no TCC activation.
4.) Utilization of a thermal solution that exceeds the Short-Term Thermal Profile, or which operates at the Short-
Term Thermal Profile for a duration longer than the limits specified in Note 3 above, do not meet the processor
thermal specifications and may result in permanent damage to the processor.
E.3
Mechanical Drawings and Supplier Information
See
Appendix B
The part number below represent Intel reference designs for a ATCA reference
heatsink. Customer implementation of these components may be unique and require
validation by the customer. Customers can obtain these components directly from the
supplier below.
Table E-3.
Embedded Heatsink Component Suppliers
Component
ATCA
Reference
Heatsink
Intel P/N
E65918-001
Intel® Xeon® Processor E5-2400 Product Family
Thermal/Mechanical Design Guide
Thermal Profile
Short-term Thermal Profile may only be used for short term
excursions to higher ambient temperatures, not to exceed 360
hours per year
Short-Term Thermal Profile
Tc = 0.302 * P + 66.9
0
5
10
15
20
for retention and keep out drawings.
Description
ATCA Copper Fin,
Copper Base
Nominal Thermal Profile
Tc = 0.302* P + 51.9
25
30
35
40
45
Power [W]
§
Supplier PN
Supplier Contact Info
Fujikura
Fujikura America
HSA-7901-B
Yuji Yasuda
yuji@fujikura.com
408-988-7478
Fujikura Taiwan Branch
Yao-Hsien Huang
yeohsien@fujikuratw.com.tw
886(2)8788-4959
50
55
60
95
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