11. Environmental Limits Specification; 11.1 Processor Thermal Design Power (Tdp) Support; Table 48. Server Board Design Specifications - Intel S2400SC Technical Product Specification

Intel® Server Board S2400SC TPS

11. Environmental Limits Specification

The following table defines the Intel
environmental limits. Operation of the Intel
shown in the following table may cause permanent damage to the system. Exposure to absolute
maximum rating conditions for extended periods may affect system reliability.
Operating Temperature
Non-Operating Temperature
DC Voltage
Shock (Unpackaged)
Shock (Packaged)
< 20 pounds
20 to < 40 pounds
40 to < 80 pounds
80 to < 100 pounds
100 to < 120 pounds
120 pounds
Vibration (Unpackaged)
Note:
1.
Intel Corporation server boards contain a number of high-density VLSI and power delivery
components that need adequate airflow to cool. Intel ensures through its own chassis development
and testing that when Intel
will meet the intended thermal requirements of these components. It is the responsibility of the
system integrator who chooses not to use Intel
datasheets and operating parameters to determine the amount of airflow required for their specific
application and environmental conditions. Intel Corporation cannot be held responsible, if
components fail or the server board does not operate correctly when used outside any of its
published operating or non-operating limits.
Disclaimer Note: Intel
requirement mentioned above through its own chassis development and system configuration. It
is the responsibility of the system integrator to determine the proper shock level of the board
and system if the system integrator chooses different system configuration or different chassis.
Intel Corporation cannot be held responsible if components fail or the server board does not
operate correctly when used outside any of its published operating or non-operating limits.

11.1 Processor Thermal Design Power (TDP) Support

To allow optimal operation and long-term reliability of Intel processor-based systems, the
processor must remain within the defined minimum and maximum case temperature (T
specifications. Thermal solutions not designed to provide sufficient thermal capability may affect
the long-term reliability of the processor and system. The server board is designed to support
® ®
the Intel Xeon Processor E5-2400 product family TDP guidelines up to and including 95W.
Disclaimer Note: Intel Corporation server boards contain a number of high-density VLSI and
power delivery components that need adequate airflow to cool. Intel
chassis development and testing that when Intel server building blocks are used together, the
fully integrated system will meet the intended thermal requirements of these components. It is
the responsibility of the system integrator who chooses not to use Intel developed server
Revision 2.0
®
Server Board S2400SC operating and non-operating
®
Server Board S2400SC at conditions beyond those

Table 48. Server Board Design Specifications

0º C to 55º C
-40º C to 70º C (-40º F to 158º F)
± 5% of all nominal voltages
Trapezoidal, 35g
36 inches
30 inches
24 inches
18 inches
12 inches
9 inches
5 Hz to 500 Hz 3.13 g RMS random
®
server building blocks are used together, the fully integrated system
®
ensures the unpackaged server board and system meet the shock
Intel order number G36516-002
Environmental Limits Specification
1
(32º F to 131º F)
,
170 inches/sec
®
developed server building blocks to consult vendor
®
ensures through its own
)
CASE
111