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(Lead free solder used in the board (material : Sn-Ag-Cu, melting point : 219 Centigrade))
(Lead free solder used in the board (material : Sn-Cu, melting point : 230 Centigrade))
C291
R373
TP303
R324
R372
R333
TP302
R357
R813
R814
R360
R316
1
TP813
TP811
1
R308
TP819
R531
D811
D812
1
24
C555
R371
27
R363
6
R361
IC505
R368
N
TP801
1
IC891
28
C561
R860
UL
MARK
R861
TP802
R891
HEAT PROOF FLUX
5
1
CN801
No.MB726
R104
R103
R129
R109
R110
Q101
CN301
C352
C351
24
1
6
R458
Q102
D301
C106
48
C357
C353
TP300
TP301
C328
R326
4
R375
R376
R347
C358
C354
5
C560
C368
C563
C551
C559
C367
4
1
IC304
R704
R705
R315
7
R313
54
C562
C557
K501
C558
25
CN701
<DVD module board>
1
1
CN101
TP112
TP123
R201
24
R393
TP321
C359
TP726
PbF
1
TP727
25
IC701
R719
IC704
8
TP380
C304
1
R740
C740
R317
1
1
C364
C714
C742
C743
R399
TP761
K706
R730
1
TP702
CN713
(No.MB726<Rev.001>)34/36
LVB10824-001A
R291
CN201
C290
8
C201
C202
C205
C204
C203
R206
1
C210
LVA10824-
TP226
48
IC201
IC703
IC702
A1
1
1
1
C703
C701
C702
1
8
TP731
TP732
1
TP733
TP735
TP737
TP738
TP736
TP734
created date:2010-02-02
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