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(Lead free solder used in the board (material : Sn-Ag-Cu, melting point : 219 Centigrade))
(Lead free solder used in the board (material : Sn-Cu, melting point : 230 Centigrade))
No.MB726
F1F
S1F
PbF
D9205
UL
STAMPING DATE CODE
(No.MB726<Rev.001>)30/36
<LED Illumination board>
D9200
D9204
MARK
D9201
GVA10177-A2
created date:2010-02-02
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