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<Jack board>
(Lead free solder used in the board (material : Sn-Ag-Cu, melting point : 219 Centigrade))
(Lead free solder used in the board (material : Sn-Cu, melting point : 230 Centigrade))
AUDIO IN
HP
W8400
J8400
C8402
C8403
C8401
C8405
C8404
P1F
T1F
No.MB726
W8301
J8401
K8300
K8301
K8320
C8453
R8451
C8452
R8403
R8404
W8300
R8300
R8301
1
CN840
GVA10182-A4
7
(No.MB726<Rev.001>)24/36
W8100
D8200
D8201
K8200
D8300
D8301
C8202
K8202
K8201
USB B
W8200
D8303
D8302
C8303
R8201
USB A
R8100
R8200
R8101
A
USB C
D8100
K8105
A
D8101
K8100
K8101
K8102
created date:2010-02-02
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