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(Lead free solder used in the board (material : Sn-Ag-Cu, melting point : 219 Centigrade))
(Lead free solder used in the board (material : Sn-Cu, melting point : 230 Centigrade))
R8950
R8801
S8801
C8709
C8704
S8802
C8500
S8803
No.MB726
K8500
CN850
C8710
C8702
FL870
GVA10182-A2
(No.MB726<Rev.001>)22/36
S8806
Q8501
S8805
S8804
C8700
R8804
T1F
P1F
created date:2010-02-02
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