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<Mic board>
(Lead free solder used in the board (material : Sn-Ag-Cu, melting point : 219 Centigrade))
(Lead free solder used in the board (material : Sn-Cu, melting point : 230 Centigrade))
GVA10182-A5
J8000
K8003
R8015
C8017
P1F
R8016
T1F
C8018
C8032
C8031
C8030
No.MB726
J8001
C8039
D8003
C8035
W8000
D8004
R8005
R8004
C8006
C8012
IC800
R8013
C8013
IC801
R8018
C8027
R8019
C8028
C8025
D8002
D8000
C8004
R8001
D8001
1
MIC SIG
C8001
R8003
A9V
C8036
RECL
AGND
RECR
C8002
A5V
MIC DET
MIC CAL
MIC CLK
MIC FLG
K8001
MIC DAT
11
C8023
C8024
(No.MB726<Rev.001>)25/36
created date:2010-02-02
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