<Sensor board>
(Lead free solder used in the board (material : Sn-Ag-Cu, melting point : 219 Centigrade))
(Lead free solder used in the board (material : Sn-Cu, melting point : 230 Centigrade))
No.MB726
created date:2010-02-02
(No.MB726<Rev.001>)26/36
