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(Lead free solder used in the board (material : Sn-Ag-Cu, melting point : 219 Centigrade))
(Lead free solder used in the board (material : Sn-Cu, melting point : 230 Centigrade))
MARK
UL
GVA10177-
A1
PbF
D9012
D9010
D9011
D9009
STAMPING DATE CODE
No.MB726
D9005
D9007
D9002
D9003
D9006
D9008
(No.MB726<Rev.001>)28/36
<Touch board>
S1F
F1F
created date:2010-02-02
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