Table of Contents
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<Power AMP board>
(Lead free solder used in the board (material : Sn-Ag-Cu, melting point : 219 Centigrade))
(Lead free solder used in the board (material : Sn-Cu, melting point : 230 Centigrade))
FW601
R6502
R6506
D6501
R6503
R6507
C6506
P1F
T1F
CP620
C6503
D6502
X6501
C6504
C6505
PP601
D6222
C6510
D6220
K6501
R6223
Q6220
K6502
C6971
+B
C6210
PGND
R6206
PGND
-B
Q6210
PP602
No.MB726
Q6500
R6501
R6500
IC650
C6075
R6403
R6499
C6409
R6505
C6407
C6406
R6400
Q6200
D6200
C6211
R6205
C6412
C6312
C6427
K6202
K6201
PP603
1
CN600
C6324
D6000
C6304
C6305
R6303
R6103
R6399
R6199
C6309
C6109
C6307
C6107
C6106
C6306
R6100
IC630
C6308
C6112
C6327
C6127
R6348
R6428
(No.MB726<Rev.001>)23/36
IC670
D6701
R6705
R6706
C6902
C6085
R6902
C6004
C6024
L6070
C6104
R6702
C6084
R6003
R6099
C6009
R6901
C6007
C6006
L6071
R6806
IC610
C6008
C6083
R6028
R6703
C6028
C6012
C6073
R6704
D6802
D6804
R6128
R6809
created date:2010-02-02
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