<Sensor board>
(Lead free solder used in the board (material : Sn-Ag-Cu, melting point : 219 Centigrade))
(Lead free solder used in the board (material : Sn-Cu, melting point : 230 Centigrade))
No.MB726
R8900
R8901
FW315
(No.MB726<Rev.001>)27/36
T1F
P1F
created date:2010-02-02