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A.1.7 Operating Conditions
This chapter describes the operating conditions of the device. Unless otherwise noted those conditions
apply to all the following data.
NOTE:
Please refer to the temperature rating of the device (C, V, M) with regards to the
ambient temperature T
calculations refer to Section A.1.8 Power Dissipation and Thermal
Characteristics.
I/O, Regulator and Analog Supply Voltage
Digital Logic Supply Voltage
1
PLL Supply Voltage
Voltage Difference VDDX to VDDR and VDDA
Voltage Difference VSSX to VSSR and VSSA
Oscillator
Bus Frequency
MC9S12DT256C
Operating Junction Temperature Range
Operating Ambient Temperature Range
MC9S12DT256V
Operating Junction Temperature Range
Operating Ambient Temperature Range
MC9S12DT256M
Operating Junction Temperature Range
Operating Ambient Temperature Range
NOTES:
1. The device contains an internal voltage regulator to generate the logic and PLL supply out of the I/O supply. The
absolute maximum ratings apply when this regulator is disabled and the device is powered from an external
source.
2. Please refer to Section A.1.8 Power Dissipation and Thermal Characteristics for more details about the rela-
tion between ambient temperature T
A.1.8 Power Dissipation and Thermal Characteristics
Power dissipation and thermal characteristics are closely related. The user must assure that the maximum
operating junction temperature is not exceeded. The average chip-junction temperature (T
obtained from:
and the junction temperature T
A
Table A-4 Operating Conditions
Rating
1
and device junction temperature T
A
MC9S12DT256 Device User Guide — V03.07
Symbol
Min
V
4.5
DD5
V
2.35
DD
V
2.35
DDPLL
∆
-0.1
VDDX
∆
-0.1
VSSX
f
0.5
osc
f
0.5
bus
T
-40
J
T
2
-40
A
T
-40
J
T
2
-40
A
T
-40
J
T
2
-40
A
.
J
. For power dissipation
J
Typ
Max
5
5.25
2.5
2.75
2.5
2.75
0
0.1
0
0.1
-
16
-
25
-
100
27
85
-
120
27
105
-
140
27
125
) in °C can be
J
Unit
V
V
V
V
V
MHz
MHz
°C
°C
°C
°C
°C
°C
93
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