HP ProLiant WS460c Gen9 Maintenance And Service Manual page 64

CAUTION: When returning a damaged system board to Hewlett Packard Enterprise, always
install all processor socket covers to prevent damage to the processor sockets and system
board
To remove the component:
Power down the graphics server blade (on page 25).
1.
Remove the graphics server blade
2.
Place the graphics server blade on a flat, level work surface.
3.
Remove the access panel
4.
Remove all drives ("Drive" on page 33).
5.
Remove all drive blanks
6.
Remove the mezzanine assembly
7.
Remove the FlexibleLOM ("FlexibleLOM" on page 49).
8.
Do one of the following:
9.
Remove the storage controller
o
Disconnect the direct connect SATA cable
o
Remove the internal USB drive, if installed. To locate the internal USB connector, see "System
10.
board components (on page 91)."
Remove the microSD card, if installed. To locate the microSD card, see "System board
11.
components (on page 91)."
Remove all DIMM baffles
12.
Remove all DIMMs ("DIMMs" on page 53).
13.
Remove the front panel/drive cage assembly
14.
Remove the heatsink ("Heatsink" on page 57).
15.
Open each of the processor locking levers in the order indicated, and then open the processor
16.
retaining bracket.
CAUTION: THE PINS ON THE SYSTEM BOARD ARE VERY FRAGILE AND EASILY
DAMAGED. To avoid damage to the system board, do not touch the processor or the
processor socket contacts.
("Remove the graphics
("Access panel (graphics server
("Drive blank" on page 32).
("Mezzanine assembly" on page 34).
("Storage controller" on page 50)
("Direct connect SATA
("DIMM baffles" on page 51).
("Front panel/drive cage
blade" on page 26).
blade)" on page 31).
cabling" on page 80).
assembly" on page 54).
Removal and replacement procedures 64