HP ProLiant DL160 Generation 5 Maintenance And Service Manual page 57

Figure 35
Removing the air baffle
To remove the heat sink:
Loosen the four mounting pins.
1.
Lift the heat sink away from the system board.
2.
CAUTION: Place heat sink down in an upright position with the thermal patch facing upward. Do
not let the thermal patch touch the work surface.
Figure 36 Removing heat sink assembly
IMPORTANT: If the heat sink has been removed for any reason on a previously installed processor, it
is critical that you apply more thermal interface material to the integrated heat spreader on the
processor to ensure proper thermal bonding between the processor and the heat sink.
To remove a processor:
Disengage the load lever.
1.
Lift the retention plate to expose the socket body.
2.
Grasp the processor by its edges and lift it out of its socket.
3.
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