Printed Wiring Boards - Jack Section; Schematic Diagram - Jack Section - Sony HCD-GT111 Service Manual

HCD-GT111/GT222/GT444/GT555

7-19. PRINTED WIRING BOARDS - JACK Section -

• See page 27 for Circuit Boards Location.
1 2
MIC BOARD
A
C718
C716
R712
RV700
C713 C722
MIC
R706
LEVEL
R714
C712
C707
IC700
R705
B
C701 R704
JW701
J700
MIC
C702
C711
R702
C710
C720
C
R715
C721
R716
MAIN
A
BOARD
R719
CN470
(Page 35)
R722
D R720
R721
R723
MAIN
J
BOARD
CN488
(Page 35)
JW708
NO702
(CHASSIS)
E
JW707
D701
R
J701
R710
F
AUDIO
INPUT
FB700
R709
L
G
J702
PHONES
C717
H
D702
1-875-674-
HCD-GT111/GT222/GT444/GT555
• : Uses unleaded solder.
3 4 5
JK890
SW JACK BOARD SUB WOOFER
D890
C836
R873
R880 1 6
CN890
R876 R870
Q
POWERAMP (Page 41)
BOARD
(GT444/GT555) NO800
13
(13)

7-20. SCHEMATIC DIAGRAM - JACK Section -

1 2
A
MIC BOARD
B
R700
1k
C702
11
(11)
C
C707
2.2
50V
R701
100k
C709
R706
220p
C719
330p
D
IC700
3 2
MIC AMP
+ -
R712
1
18k
C710 10
4.5
NJM4558V-TE2
C718
9
0.1
50V
E
R718 R713
100
18k
MIC LEVEL
F
R720
100k
(GT444/GT555)
G
H
CN890
SW-SP_GND 1
Q
SW-SP_GND 2
SW OUT 3
POWERAMP
SW OUT 4
BOARD
(2/2)
I
RLY+ 5
NO800
(Page 43)
RLY- 6
40 40
3 4
J701
AUDIO
INPUT
J700
J702
MIC L R
PHONES
L R
C700
0.1
R709
1k
C703
0.1
D701
R707 R708
220k 220k MC2837
C704
C714 C715 1000p
1000p 1000p R722
10k
1000p
R702
R704 R705
10k
4.7k 4.7k
C717
C708 1000p
1000p
C716
C712 2.2
R711
47p 50V
1.5k 10k R721
47k
C713 C711
2.2 100
50V 6.3V
4.4
5 6
+ -
R714 C722
220k 180p
7
C701
4.4
0.1
C720
16V
2.2
50V
IC700(3/3)
R715
C721
100
0.1
POWER
8 GND 4
R716
100k
1
RV700
50k
R719
10k
SW JACK BOARD
RY890 L890 JK890
1.7uH
+
SUBWOOFER
R893 R894
C836 10 10 -
0.1
C841 R892 R891
0.1 10 10
R880
10
D890
MA2J1110GLS0
6P
5 6 7
D702
MC2837
NO702
(CHASSIS)
NO701
4P
TP714
J
4 CHASSIS
TP713
3 HP-R
TP712
MAIN
2 HP GND
BOARD
C705 0.1 TP711
(3/4)
1 HP-L
CN488
(Page 38)
NO700
8P
TP700
1 A+9V
TP701
2 MIC SIGNAL
TP702
A
3 MIC GND
TP703
4 AUX-L
TP704
MAIN
5
AGND
BOARD
TP705
(1/4)
6
AUX-R
TP706 CN470
7
AGND (Page 36)
TP707
8
HP/MIC DET