Printed Wiring Boards - Mic/Jack Section - Sony HCD-GZR5D Service Manual

HCD-GZR5D
7-27. PRINTED WIRING BOARDS – MIC/JACK Section–
1 2 3
A
MIC BOARD
B
R914
C
D
RV261
E
MIC
LEVEL
F
G
J261
MIC
H
I
(CHASSIS)
HCD-GZR5D
• See page 36 for Circuit Boards Location.
4 5 6
JW203
R901
R916
R902
C281 R284
R907
R906
JW202
R899
JW201
R905
C290
R903
D262 JW206
C294
R895
R896
C293
R894
C292
RV261
1
C284
R898
2
R890
C278
3
C269
R273
J261
C267
R261
C262
R264
C275 C263
• : Uses unleaded solder.
7 8 9
W261
1
MAIN
F
BOARD
CN103
(Page 37)
9
C289
C288
C287
C286
C285
R283
R270
R271
C272
R277
C271
C270
R282
11
(11)
1-876-006-
58 58
10 11 12
JACK BOARD
J251
AUDIO IN
J252
PHONES
J251
C256
C257
W253
C253
W251
W252
5 1
3 1
1-875-993-
E D
MAIN MAIN
BOARD BOARD
CN101 CN101
- -
(Page 37) (Page 37)
• Semiconductor Location
Ref. No. Location Ref. No. Location
D261 C-4 Q262 H-6
D262 C-5 Q263 F-6
D263 G-5 Q264 C-4
Q265 B-4
IC261 G-6 Q266 B-4
IC262 D-6 Q267 C-3
Q268 C-3
Q261 H-5 Q269 B-3
13
11
(11)