Sony MEX-R5 Service Manual page 2

MEX-R5
Ver. 1.1
QQ
3 7 63 1515 0
Power amplifier section
Outputs Speaker outputs (sure seal
connectors)
Speaker impedance 4 – 8 ohms
52 W × 4 (at 4 ohms)
Maximum power output
Wireless AV section
Transmission frequencies 2,414, 2,432, 2,450,
2,468 MHz
Modulation method FM modulation
RF output power –1.2 dBm (Except AEP,
UK, Russian models)
10 dBm
(AEP, UK, Russian models)
General
Outputs Front audio/video output
terminals
Rear audio output terminal
Subwoofer output terminal
(mono)
Optical digital output
terminal
Power antenna relay control
terminal
Power amplifier control
terminal
Inputs Telephone ATT control
terminal
Illumination control
terminal
BUS control input terminal
BUS audio input/AUX IN
terminal
Parking break control
terminal
Remote controller input
terminal
Antenna input terminal
Bass: ±8 dB at 100 Hz
Tone controls
Treble: ±8 dB at 10 kHz
TE
L 13942296513
Loudness +8 dB at 100 Hz
+2 dB at 10 kHz
Power requirements 12 V DC car battery
(negative ground)
Approx. 178 × 50 × 182 mm
Dimensions
1 × 2 ×
(7 /
8
Approx. 182 × 53 × 161 mm
Mounting dimensions
1 × 2
(7 /
4
(w/h/d)
Mass Approx. 1.3 kg (2 lb 14 oz)
Supplied accessories Card remote commander
RM-X702 (E, Chinese model)
RM-X703
(AEP, UK, Russian models)
RM-X704
(US, Canadian models)
Parts for installation and
connections (1 set)
Front panel case (1)
Note
This unit cannot be connected to a digital preamplifier
or an equalizer which is Sony BUS system compatible.
Design and specifications are subject to change
without notice.
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SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE
WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN
.
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE
PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR
IN SUPPLEMENTS PUBLISHED BY SONY.
2
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/ in) (w/h/d)
4
1 × 6 3
/ / in)
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CAUTION
The use of optical instruments with this
product will increase eye hazard.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous radiation
exposure.
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be
damaged by heat.
Flexible Circuit Board Repairing
• Keep the temperature of the soldering iron around 270 ˚C
during repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
This label is located on the bottom of the
chassis.
Q Q
3 6 7 1 3
CAUTION
:CLASS 1M VISIBLE/INVISIBLE LASER
RADIATION WHEN OPEN AND INTERLOCKS DEFEATED.
DO NOT VIEW DIRECTLY WITH OPTICAL INSTRUMENTS.
This label is located on the drive unit's internal
chassis
– US, Canadian models –
-
CAUTION
Laser radiation when open.
DO NOT STARE INTO BEAM.
This label is located on the drive unit's internal
chassis.
ATTENTION AU COMPOSANT AYANT RAPPORT
À LA SÉCURITÉ!
u163
LES COMPOSANTS IDENTIFIÉS PAR UNE MARQUE 0 SUR
LES DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES
PIÈCES SONT CRITIQUES POUR LA SÉCURITÉ DE
.
FONCTIONNEMENT. NE REMPLACER CES COM- POSANTS
QUE PAR DES PIÈCES SONY DONT LES NUMÉROS SONT
DONNÉS DANS CE MANUEL OU DANS LES SUPPLÉMENTS
PUBLIÉS PAR SONY.
2 9 9 4 2 8
1 5 0 5 8 2 9 9 4
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9 9
2 8 9 9