11.
Release the zero insertion force (ZIF) connector (4) to which the keyboard cable is attached, and then
disconnect the keyboard cable from the system board.
12.
Release the ZIF connector (5) to which the power button board cable is attached, and then disconnect
the power button board cable from the system board.
13.
Release the ZIF connector (6) to which the TouchPad cable is attached, and then disconnect the
TouchPad cable from the system board.
14.
Remove the keyboard/top cover (7) by sliding it up and forward at an angle.
NOTE:
The thermal material must be thoroughly cleaned from the surfaces of the heat sink and the system
board components each time the heat sink is removed. Replacement thermal material is included with the
heat sink and system board spare part kits.
The following illustration shows the replacement thermal material locations on the system board (1) and the
heat sink (2).
Component replacement procedures
31