System Specifications - Clevo W760SUA Service Manual

Introduction

System Specifications

Processor
Intel® Core™2 Duo Processor:
T8100 (2.1GHz) / T8300 (2.4GHz)
(478-pin) Micro-FC-PGA Package, Socket P, 45nm (45 Nanometer)
Process Technology, 3MB On-die L2 Cache & 800MHz FSB - TDP
35W
T9300 (2.5GHz) / T9500 (2.6GHz)
(478-pin) Micro-FC-PGA Package, Socket P, 45nm (45 Nanometer)
Process Technology, 6MB On-die L2 Cache & 800MHz FSB - TDP
35W
T7300 (2.0GHz) / T7500 (2.2GHz)
T7700 (2.4GHz) / T7800 (2.6GHz)
(478-pin) Micro-FC-PGA Package, Socket P, 45nm (45 Nanometer)
Process Technology, 4MB On-die L2 Cache & 800MHz FSB - TDP
35W
Processor (cont'd)
Intel® Celeron® Processor:
T1600 (1.66GHz) / T1700 (1.86GHz)
(478-pin) Micro-FC-PGA Package, Socket P, 65nm (65 Nanometer)
Process Technology, 1MB On-die L2 Cache & 667MHz FSB - TDP
35W
575 (2.0GHz) / 585 (2.16GHz)
(478-pin) Micro-FC-PGA Package, Socket P, 65nm (65 Nanometer)
Process Technology, 1MB On-die L2 Cache & 667MHz FSB - TDP
35W
Core Logic
SiS 671DX + SiS968 Chipset
Display
15.6" HD 16:9 Wide Screen (1366 * 768) TFT LCD
1 - 2 System Specifications
Memory
64-bit Wide DDRII (DDR2) Data Channel
Two 200 Pin SO-DIMM Sockets Supporting DDRII (DDR2) 667MHz
Memory Expandable up to 4GB (1024MB/ 2048MB DDRII Modules)
Video Adapter
ATI Mobility Radeon HD 4570 Discrete Graphics On Board (PCIe * 16)
512MB GDDR2 Video RAM on board
®
Supports Microsoft DirectX 10.1
BIOS
One 8Mb SPI Flash ROM
Phoenix™ BIOS
Storage
One Changeable 12.7mm(h) Optical Device (CD/DVD) Type Drive (see
?$paratext>? on page 1 - 4)
Easy Changeable 2.5" 9.5 mm (h) SATA (Serial) HDD
Audio
High Definition Audio Compliant Interface
Compliant with Microsoft UAA (Universal Audio Architecture)
2 * Built-In Speakers
Built-In Microphone
Keyboard & Pointing Device
Full Size WinKey Keyboard
Built-in TouchPad (integrated scrolling key functionality)