Table Of Contents - Sony MV-101 Service Manual

MV-101
Ver 1.2
NOTES ON HANDLING THE OPTICAL PICK-UP
BLOCK OR BASE UNIT
The laser diode in the optical pick-up block may suffer electro-
static break-down because of the potential difference generated
by the charged electrostatic load, etc. on clothing and the human
body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.
NOTES ON LASER DIODE EMISSION CHECK
Never look into the laser diode emission from right above when
checking it for adjustment. It is feared that you will lose your sight.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous ra-
diation exposure.
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
Flexible Circuit Board Repairing
• Keep the temperature of the soldering iron around 270 ˚C dur-
ing repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40 ˚C higher than
ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350 ˚C.
Caution: The printed pattern (copper foil) may peel away if the
heated tip is applied for too long, so be careful!
• Strong viscosity
Unleaded solder is more viscou-s (sticky, less prone to flow)
than ordinary solder so use caution not to let solder bridges oc-
cur such as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED
LINE WITH MARK 0 ON THE SCHEMATIC DIAGRAMS
AND IN THE PARTS LIST ARE CRITICAL TO SAFE
OPERATION. REPLACE THESE COMPONENTS WITH
SONY PARTS WHOSE PART NUMBERS APPEAR AS
SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUB-
LISHED BY SONY.
2

TABLE OF CONTENTS

SERVICING NOTES
1. GENERAL
................................................................... 4
Location of Controls ....................................................... 4
2. DISASSEMBLY
2-1. Disassembly Flow ........................................................... 8
2-2. Cabinet Front Assy .......................................................... 8
2-3. Cabinet (Rear) ................................................................. 9
2-4. Case (Upper) ................................................................... 9
2-5. DVD MD Assy ................................................................ 10
2-6. Chassis (MD) Assy ......................................................... 10
2-7. SERVO Board, Mechanism Deck ................................... 11
2-8. TD-S-TOP-COVER ........................................................ 11
2-9. Loading Mechanism Assy ............................................... 12
2-10. Traverse Mechanism Assy .............................................. 12
3. DIAGRAMS
3-1. Note for Printed Wiring Boards
and Schematic Diagrams ................................................ 13
3-2. Printed Wiring Boards - KEY Section - ....................... 14
3-3. Schematic Diagrams - KEY Section - .......................... 15
3-4. Printed Wiring Board - POWER Section - ................... 16
3-5. Schematic Diagram - POWER Section - ..................... 17
4. EXPLODED VIEWS
4-1. Overall Section ................................................................ 18
4-2. Cabinet Front Assy Section ............................................ 19
4-3. Case (Lower) Assy Section ............................................. 20
4-4. DVD MD Assy Section ................................................... 21
4-5. Mechanism Deck Section-1 ............................................ 22
4-6. Mechanism Deck Section-2 ............................................ 23
4-7. Mechanism Deck Section-3 ............................................ 24
5. ELECTRICAL PARTS LIST
............................................... 3
............................... 25