Low Profile Fan Heat Sink; Low Profile Fan Heat Sink Pcb Layout Guidelines - Intel 740 Design Manual

4.2.2

Low Profile Fan Heat Sink

A generic drawing for this Fan Heat Sink is shown in
Profile Fan Heat Sink are discussed in
The thermal performance of the Fan Heat Sink and Thermal Interface Material (combined) must be
sufficient to maintain a case temperature at or below T
environment (defined as: zero airflow, 55°C ambient temperature).
Note: The weight of the Fan Heat Sink must not exceed 55 gm.
Figure 4. Low Profile Fan Heat Sink Drawing
4.2.2.1

Low Profile Fan Heat Sink PCB Layout Guidelines

As the Low Profile Fan Heat Sink uses a mechanical attach, mounting holes must be provided in
the PCB to accommodate the clips necessary in attaching the Fan Heat Sink. PCB Guidelines for
the Fan Heat Sink mounting hole layout are provided in
plated, but each must have a grounding pad on the solder side of the board surrounding the hole. It
must be designed in such a way to ensure that the mechanical attachment clip is in solid contact
with this pad. The mechanical assembly should only contact the PCB within the four 0.300 inch
diameter component keep-out zones as shown in
be silk-screened onto the PCB to facilitate placement of the Fan Heat Sink on to the package.
Application Note 653
Intel740™ Graphics Accelerator Thermal Design Considerations
Appendix A, "Sources".
Figure
Figure 4. Recommended sources for the Low
(See Table 1) in a worst case system
case-hs
Figure 5. The mounting holes must be non-
5. The outline of the Fan Heat Sink should
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