Board Dimensions; Fan/Heatsink Hole Pattern; Mounting Hole Locations (Fan/Heatsink Assembly) - Intel 740 Design Manual

Mechanical Information
5.1

Board Dimensions

Board Dimensions should be obtained from the AGP 1.0 Specifications and the associated
Engineering Change Requests (ECRs).
5.2

Fan/Heatsink Hole Pattern

Note: This solution is only need for those designs in which it has been determined there is a need for
additional thermal cooling through the use of a fansink.
The Intel740™ graphics accelerator reference board has the capability of attaching a fansink. If a
design requires a fansink, the following design issues must be observed to be compatible with the
fan attach mechanism Intel has enabled. The mounting holes must be nonplated but each must have
a grounded annular ring on the solder side of the board surrounding the hole. This annular ring
should have an inner diameter of 150 mils and an outer diameter of 300 mils. This ring should
contain at least eight ground connections. The solder mask opening for these holes should have a
radius of 300 mils. The position of these mounting holes in relation to the MBGA is shown in
Figure 5-1.
Figure 5-1. Mounting Hole Locations (Fan/Heatsink Assembly)
Intel740™ Graphics Accelerator Design Guide
Mechanical Information
5
5-1