Cartridge Terminology - EPOX EP-61LXA-M Manual

A pentium ii processor based agp mainboard
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EP-61LXA-M
processor. This is the model used in past packaging technologies like PGA, TCP,
PQFP, DIP, etc.
S.E.C. Cartridge Terminology
Pentium
The new enclosed card packaging technology is called a "Single
Edge Contact cartridge." This is similar to previous names for
packaging technology such as PGA or TCP.
Processor card
The green PCB (with or without components on it)
Processor core
The silicon on the PLGA package on the PCB
Cover
The plastic cover on the opposite side from the thermal plate.
Slot 1
The slot that the S.E.C. cartridge plugs into, just as the Pentium
Pro processor uses Socket 8.
Retention mechanism
Formerly 'retention module' the dual posts, etc. that holds the
cartridge in place.
Thermal plate
The heatsink attachment plate.
Heat sink supports
The support pieces that are mounted on the mainboard to provide
added support for heatsinks.
The L2 cache (TagRAM, PBSRAM)
components keep standard industry
names.
®
The Pentium
II Processor is the first
product to utilize the S.E.C. cartridge
technology and Slot 1 connector. Unless
otherwise noted, any references to
®
"Pentium
II Processor," "Pentium
Processor/Slot 1 processor" or Proces-
sor" will apply to both the Pentium
Processor desktop processors.
®
II Processor
®
II
®
II
Cover
Printed Circuit Board
®
Figure 1: Pentium
with S.E.C. Cartridge
Introduction
®
Thermal Plate
Processor
II Processor CPU
Page 1-3

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