Locations Of Key Components And Connectors - IBM System x3650 M4 BD Product Manual

80 PLUS certified power supplies enable greater energy savings while providing flexibility to meet

your business needs.
The Intel Xeon processor E5-2600 v2 product family offers better performance over the previous

generation, while fitting into the same TDP limits.
Intel Intelligent Power Capability powers individual processor elements on and off as needed to

reduce power draw.
Low-voltage Intel Xeon processors draw less energy to satisfy the demands of power and thermally

constrained data centers and telecommunication environments.
Low-voltage 1.35 V DDR3 memory RDIMMs consume 19% less energy compared to 1.5 V DDR3

RDIMMs.
Solid-state drives (SSDs) consume as much as 80% less power than traditional spinning HDDs.

The server uses hexagonal ventilation holes, a part of IBM Calibrated Vectored Cooling™ technology.

Hexagonal holes can be grouped more densely than round holes, providing more efficient airflow
through the system.
IBM Systems Director Active Energy Manager™ provides advanced data center power notification and

management to help achieve lower heat output and reduced cooling needs.

Locations of key components and connectors

The following figure shows the front of the server.
Figure 2. Front view of the IBM System x3650 M4 BD
IBM System x3650 M4 BD Product Guide 4