Locations Of Key Components And Connectors - IBM BladeCenter HS23 Product Manual

Energy efficiency
The HS23 offers the following energy-efficiency features to save energy, reduce operational costs,
increase energy availability, and contribute to the green environment:
Component-sharing design of the BladeCenter chassis provides ultimate power and cooling savings.

The Intel Xeon processor E5-2600 product family offers significantly better performance over the

previous generation while fitting into the same thermal design power (TDP) limits.
Intel Intelligent Power Capability powers individual processor elements on and off as needed, to

reduce power draw.
Low-voltage Intel Xeon processors draw less energy to satisfy demands of power and thermally

constrained data centers and telecommunication environments.
Low-voltage 1.35 V DDR3 memory RDIMMs consume 15% less energy than 1.5 V DDR3 RDIMMs.

Solid state drives (SSDs) consume as much as 80% less power than traditional spinning 2.5-inch

HDDs.
The HS23 uses hexagonal ventilation holes, a part of IBM Calibrated Vectored Cooling™ technology.

Hexagonal holes can be grouped more densely than round holes, providing more efficient airflow
through the system.
IBM Systems Director Active Energy Manager™ provides advanced power management features with

actual real-time energy monitoring, reporting, and capping features.

Locations of key components and connectors

Figure 2 shows the front view of the server, indicating key components.
Figure 2. Front view of the IBM BladeCenter HS23
IBM BladeCenter HS23 4