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GTLP Evaluation Module (EVM) User’s Guide SCEA023 June 2001 Printed on Recycled Paper...
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IMPORTANT NOTICE Texas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue any product or service without notice, and advise customers to obtain the latest version of relevant information to verify, before placing orders, that information being relied on is current and complete.
Preface Read This First About This Manual Use this manual to set up and use the GTLP evaluation module (EVM) for the SN74GTLPH1655 and other GTLP devices. How to Use This Manual This document contains the following chapters: Chapter 1 – Introduction Chapter 2 –...
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Trademarks TI-OPC is a trademark of Texas Instruments. Trademarks are the property of their respective owners.
Chapter 1 Introduction The Texas Instruments (TI) GTLP evaluation module (EVM) board is used to evaluate the SN74GTLPH1655 in multipoint data-transmission applications in a heavily loaded backplane. The GTLP EVM is a 17.9-in., 20-slot, 0.94-in.-pitch, 8-layer PC backplane board that provides a total of 48 parallel data lines divided into 6 groups of 8 bits staggered into various lengths.
GTLP EVM Overview 1.1 GTLP EVM Overview The EVM can be used to evaluate device parameters, while acting as a guide for high-speed board layout. Because GTLP operates over a wide range of frequencies, designers must optimize their designs for the frequency of interest.
GTLP EVM Kit Contents 1.2 GTLP EVM Kit Contents This EVM kit comprises the following major parts, components of which are listed in Appendix A.1, GTLP EVM Bill of Materials: GTLP EVM kit documentation (this document, SCEA023) Backplane Clock driver card Termination card Monitored receiver card Monitored driver card...
GTLP EVM Kit Availability 1.3 GTLP EVM Kit Availability The GTLP EVM kit is not available for resale, but can be obtained and used for short periods of time by contacting the GTLP team at GTLP@list.ti.com. There are six locations worldwide where GTLP EVMs can be obtained: Europe, China, Korea, Japan, and the Americas (2).
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Chapter 2 GTLP EVM Board Typical Test and Setup Configuration This chapter describes the GTLP EVM setup and the configurations used to evaluate the SN74GTLPH1655 transceiver. These configurations can be used to evaluate different transceivers that will be available in the future. Topic Page GTLP EVM Case...
GTLP EVM Case 2.1 GTLP EVM Case The EVM is stored and transported in a sturdy plastic case with rollers and extensible handle (see Figure 2–1). The handle locks in position and can be extended or retracted by pressing the release on the underside of the handle. Figure 2–1.
Top Tray 2.2 Top Tray The top tray fits snuggly in the GTLP EVM case (see Figure 2–2) and holds the backplane board, power supply, extra clock crystals, and extra termination cards in place. The tray is electrostatic protective foam that holds the backplane board during demonstrations.
Backplane Board 2.3 Backplane Board The backplane board (see Figure 2–3) is typical of backplanes used in commercial applications, and consists of 20 slots with 0.94-in. pitch and 48 data bits, and 1 clock bit on stripline transmission lines. Figure 2–3. GTLP EVM Backplane Board This backplane board is constructed uniquely of six groups of eight data bits each to study the effect of different backplane lengths and driver/receiver placements.
Backplane Board Figure 2–4. GTLP EVM Backplane Block Diagram Backplane Overview É É É É É É É É É É É É É É É É É É Clock Generator X = Termination Card on Back of Connector Table 2–1. GTLP EVM Group Assignment Group 6 Group 5 Group 4...
Backplane Board A logic selection line (MODESEL) connects P1-1 through P1-20. The driver card uses this line to select between source-synchronous and system-clock operation. The demonstration board is an eight-layer board with separate V and ground planes. The backplane board stackup is shown in Table 2–2. Embedded microstrip nominal line width is 0.006 in., dielectric material is Nelco N4000-13 with a dielectric constant (50% resin contents) of 3.80 @ 100 MHz.
Backplane Board Targeted, nominal, unloaded line impedance was 50 Ω, but, based on post-manufacturing testing, was not consistent. Results for Group 1, bits 1 through 8 are shown in Table 2–3. The backplane natural trace impedance (Z is calculated and is a best estimate. The backplane trace impedance with only ′) and the backplane the connector pins attached (i.e., all cards removed) (Z ′′) are...
Connectors 2.4 Connectors An AMP Z-PACK 2-mm, 110-pin, hard-metric (HM) male connector is used in slots 1 through 20 (see Figure 2–5) . Figure 2–5. AMP Z-PACK 2-mm, 110-Pin, Hard-Metric (HM) Male Connector Five pins are used on the backplane, with three different lengths on the backplane daughter-card side.
Connectors Figure 2–6. AMP Pin Lengths * X, U, V are used only for cross-connect applications. Not all versions are tooled. GTLP EVM Board Typical Test and Setup Configuration...
Power Supply 2.5 Power Supply The power supply (see Figure 2–8) is a universal power supply that accepts 100 V to 240 V, 50/60-Hz ac and uses any wall plug that connects to the IEC 320 two-connector universal socket with the US/Canada Edison plug. An alternate supply cord with a different wall plug must be procured locally, if required.
Power Supply The 3.3 V is further reduced to 1.5 V, 7.5 A by the LT1083CP linear regulator (see Figure 2–9) for the termination voltage (V ). V is set by the combination of R1 and R2 and can be varied in the factory between 0.8 V to 1.8 V, but is set at 1.0 V for field use at GTLP levels.
Clock Crystals 2.6 Clock Crystals Clock frequency is controlled by the clock-driver card and is limited by clock-control components to 100 MHz. The GTLP receiver device is used in a latched mode of operation, so GTLP data frequency is equal to one-half the clock frequency.
Termination Cards 2.7 Termination Cards Because proper backplane termination has a large effect on signal integrity and is investigated easily, Group 1 has removable termination cards on the back of the backplane (see Figure 2–13). The termination cards are identical, except for the resistor values that are 25 Ω, 33 Ω, 38 Ω, or 50 Ω.
Termination Cards Table 2–4. Termination-Card Stackup Copper Physical Dielectric Dielectric Trace Name Layer Weight (oz) Representation Height (in.) Name Data signal 0.004 B stage plane plane 0.004 Core Ground plane Ground plane 0.004 B stage Bottom Data signal Groups 2 through 6 have 25-Ω fixed termination resistors due to space limitations, and have one bypass capacitor for every four termination resistors.
Bottom Compartment 2.8 Bottom Compartment The portable oscilloscope and backplane daughter cards are stored under the top tray of the GTLP EVM case (see Figure 2–15). Figure 2–15. Oscilloscope and Backplane Daughter-Card Storage Area Clock Cards Unmonitored Monitored Receiver Receiver Cards Cards Empty...
Measurement Equipment 2.9 Measurement Equipment The Tektronix THS730A Oscilloscope/DMM (O-Scope) (see Figure 2–16) can be stored in the bottom of the case (see Figure 2–15). It is easy to operate and is portable. The O-Scope can monitor two channels simultaneously. Store the O-Scope face down to prevent damage to the buttons during transit.
Clock Cards 2.10 Clock Cards Two clock cards (see Figure 2–17) are included with the EVM, one primary and one spare. The clock cards generate the clock signal that is sent to every slot via mitered lines, so that the clock arrives at exactly the same time at each card.
Clock Cards Table 2–5. Clock-Card Stackup Copper Physical Dielectric Dielectric Trace Name Layer Weight (oz) Representation Height (in.) Name Data signal 0.004 B stage plane plane 0.004 Core Ground plane Ground plane 0.004 B stage Bottom Data signal 2-20...
Driver Cards 2.11 Driver Cards Separate driver and receiver daughter cards were manufactured for use on the backplane because, even though the bidirectional SN74GTLPH1655 device is used, each type of card is hardwired to operate in a certain direction. The driver card generates a data pattern from the system clock and drives the GTLP lines on the backplane.
Driver Cards The driver daughter card (see Figure 2–18) has SMB monitor points for selected LVTTL and GTLP signals, in addition to jumpers for Group 1, bit 1 switching (JB1), system or SN74GTLP1394 source-synchronous clock selection (JB2), and selection of the SN74GTLPH1655 slow or fast edge rate (JB3).
Driver Cards 2.11.1 Single-Bit Selection JB1 three-position jumper is used to set Group 1, bit 1 to pass the normal data pattern, set the signal low, or set the signal high (see Figure 2–19). The JB1 jumper is stored on the lowest pin (see Figure 2–19) when set high, to prevent losing it.
Driver Cards 2.11.2 Edge-Rate Control The device used as the backplane driver, SN74GTLPH1655, has a feature by which the backplane slew rate is adjustable via an external edge-rate-control (ERC) pin held at 3.3 V (slow) or GND (fast). The ERC is set by the JB3 jumper located below the bit-selection jumper and has two positions: not connected is slow, and shorted is fast (see Figure 2–20).
Driver Cards 2.11.3 Source-Synchronous Clock/System-Clock Selection Backplanes usually have a system-wide synchronous clock. A system clock provides an absolute reference time signal from the clock card to every daughter card at exactly the same time. Source-synchronous clock operation is different because it allows the absolute system clock to be sent by the backplane driver along with the data.
Receiver Cards 2.12 Receiver Cards Receiver cards place a load on the backplane and provide a point to monitor the signals. There are two types of receiver cards: one that has built-in monitor points, and one with no monitor points. Either type can be placed in any slot in the backplane, typically with the monitored receiver card placed in the slots under observation.
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Receiver Cards Figure 2–22 shows a monitored receiver card. Monitor points on the right side are for GTLP Groups 1, 2, 3, 4, 5, and 6. Monitor points on the top are for LVTTL latch clock, Groups 6, 5, 4, 3, 2, and 1. The LVTTL latch-clock source is either the system clock or source-synchronous clock.
Receiver Cards Figure 2–22. GTLP EVM Monitored Receiver Card TP13 TP12 TP11 TP10 TP9 TP8 Note: SN74GTL1655 devices were used on the receiver cards. The SN74GTLPH1655 was in development and initial preproduction samples were used for the driver cards, but insufficient quantities were available for the receiver cards.
Backplane Setup 2.13 Backplane Setup 2.13.1 Insertion of Clock Cards The clock-card connectors (see Figure 2–23) use AMP 55-pin, 2-mm, HM connectors and are identical to the backplane termination-card connectors. They can be mated improperly because they are keyed only on one side, whereas the backplane connectors are keyed in the center and do not allow improper insertion.
Backplane Setup Figure 2–24. Connector Premate (Left), Mating (Center), and Mated (Right) Figure 2–25 (left) shows the clock card properly inserted, with the CDC components and the clock crystal facing away from the backplane connectors and daughter cards. Yellow dots are located on the connector and the card to help ensure proper orientation.
Backplane Setup 2.13.2 Insertion of Clock Crystals Clock crystals are live insertable, unlike the clock card, which is not live insertable. Clock crystals are inserted easily on the clock card by pulling off one crystal and inserting the new crystal (see Figure 2–26). The leads can be bent gently to ease insertion.
Backplane Setup 2.13.3 Insertion of Termination Cards Termination-card, AMP Z-PACK, 2-mm, 55-pin, HM male and female connectors are identical to the clock-card connectors, and are inserted directly onto the K and T pins used for slots 1 and 20, V , and data bits.
Backplane Setup 2.13.4 Insertion of Driver and Receiver Cards The driver and receiver cards are live insertable and are easy to insert and remove, although some slight side-to-side rocking action might be required. The cards can be inserted into any slot in any order, but only one driver card should be used at any one time.
Backplane Setup Figure 2–30. Close-up View of Connector Keying Wide Key Narrow Key The card should be placed squarely on the connector and pressed down (see Figure 2–31), with very little side-to-side motion. The components are facing left towards slot 1, the power supplies are on the top/right, and the Group 1–6 markings are on the bottom/left.
Oscilloscope Setup 3.1 Oscilloscope Setup The recommended oscilloscope (O-Scope) for the GTLP EVM is the Tektronix THS730A (see Figure 3–1). It allows only two-channel operation, which should be sufficient for most investigations done with the demonstration backplane. Figure 3–1. Tektronix O-Scope Front (Left) and Top (Right) SMB adapters (see Figure 3–2) are needed to properly mate Tektronix probes with the test points.
Measurements 3.2 Measurements The first step in taking measurements is to plug one probe into channel 1 (CH 1) of the O-Scope and connect the opposite end to the desired monitor point. Plug the other probe into channel 2 (CH 2) of the O-Scope and connect the opposite end to the desired monitor point (see Figures 3–1 and 3–3).
Measurements Waveforms similar to those in Figure 3–5, depending on how the O-Scope presets were set, are displayed. In Figure 3–5, CH 2 is selected. Figure 3–5. O-Scope Display...
Measurements To adjust the timing (x or horizontal axis), press the appropriate side of the SEC/DIV button (see Figure 3–6). An example of the results is shown for 50 ns/division and 100 ns/division. Timing is the same for both channels and is independent of channel selection.
Measurements To adjust the trigger, press the MENU button (see Figure 3–8), then press Trigger Source to display a submenu. In the submenu, select Ch1, Ch2, or Ext [DMM] by repeatedly pressing the same Trigger Source button. After the appropriate trigger is selected, press the CLEAR MENU button to restore the O-Scope to operation.
Chapter 4 Waveform Measurement and Interpretation In this chapter, five different measurement cases are discussed in detail, and several more measurement combinations are outlined. Many other combinations are possible. Topic Page Timing Relationship of Driver Card (D1) Data Pattern (Ch1) and Driver Card (D1) Latch Clock (Ch2) .
Timing Relationship of Driver Card (D1) Data Pattern (Ch1) and Driver Card (D1) Latch Clock (Ch2) 4.1 Timing Relationship of Driver Card (D1) Data Pattern (Ch1) and Driver Card (D1) Latch Clock (Ch2) Figure 4–1 shows the probe hookup and related O-Scope output for Case 1. The LVTTL latch clock signal goes to the SN74GTLPH1655 driving device CLK pin, and the LVTTL data signal goes to the A-port input pin, specifically the Group 1, bit 1 data signal.
Timing Relationship of Driver Card (D1) Data Pattern (Ch1) and Driver Card (D1) Group 1 GTLP Data Out (Ch2) 4.2 Timing Relationship of Driver Card (D1) Data Pattern (Ch1) and Driver Card (D1) Group 1 GTLP Data Out (Ch2) Figure 4–2 shows the probe hookup and O-Scope output for Case 2. The LVTTL data goes into the SN74GTLPH1655 driving device A-port input, and the GTLP data comes out of the B-port output.
Timing Relationship of Driver Card (D1) Data Pattern (Ch1) and Receiver Card (R2) Group 1 GTLP Data In (Ch2) 4.3 Timing Relationship of Driver Card (D1) Data Pattern (Ch1) and Receiver Card (R2) Group 1 GTLP Data In (Ch2) Figure 4–3 shows the probe hookup and O-Scope output for Case 3. The LVTTL data input goes to the SN74GTLPH1655 driving device A-port input, and the GTLP data input goes to the SN74GTL1655 receiving device B-port in slot 2.
Timing Relationship of Driver Card (D1) Data Pattern (Ch1) and Receiver Card (R2) Group 1 LVTTL Data Out (Ch2) 4.4 Timing Relationship of Driver Card (D1) Data Pattern (Ch1) and Receiver Card (R2) Group 1 LVTTL Data Out (Ch2) Figure 4–4 shows the probe hookup and O-Scope output for Case 4. The LVTTL data input goes to the SN74GTLPH1655 driving device A-port input, and the LVTTL data output of the SN74GTL1655 receiving device goes to A port in slot 2.
Timing Relationship of Receiver Card (R2) Group 1 GTLP Data In (Ch1) 4.5 Timing Relationship of Receiver Card (R2) Group 1 GTLP Data In (Ch1) and Receiver Card (R20) Group 1 GTLP Data In (Ch2) Figure 4–5 shows the probe hookup and O-Scope output for Case 5. You can see the flight-time delay between the output of the SN74GTLPH1655 driving device B port in slot 1 and the SN74GTL1655 receiving device B port in slot 20.
Monitored Waveforms 4.6 Monitored Waveforms There are differences in waveforms between GTLP monitor test points and measurements taken at the backplane connector pins, due to interference from LVTTL data and clock signals not shielded adequately on the daughter cards. This concern is only for this demonstration backplane because there is no reason to extend the GTLP signals past the GTLP device B-port output pins on operational daughter cards.
Replacing 5-A Fuse F2 5.2 Replacing 5-A Fuse F2 Fuse F2 (see Figure 5–2) provides power from the 3.3-V switching regulator to the 3.3-V power plane and blows if V is shorted to GND. Shorting can occur if a connector pin is bent during insertion or if measurements are taken directly from the backplane.
Replacing 2.5-A Fuse F1 5.3 Replacing 2.5-A Fuse F1 Fuse F1 (see Figure 5–3) provides power from the power supply to the 3.3-V and 5-V switching regulators and blows if the switching regulators fail. It is replaced as easily as fuse F2. Disconnect the power from the board, pull out the fuse with pliers, push in the new fuse, then reconnect the power supply.
Damage to the Daughter Cards 5.4 Damage to the Daughter Cards The daughter cards are not field repairable and must be returned to the factory for repair. Troubleshooting...
Appendix A Appendix A Bill of Materials, Schematics, Board Layouts, and Suggested Specifications Topic Page GTLP EVM Bill of Materials ........Board Layouts and Schematics .
GTLP EVM Bill of Materials A.1 GTLP EVM Bill of Materials Backplane Device Type Quantity Z-PAK 110-Pin Male Connector Z-PAK 55-Pin Male Connector 2.5 AMP Fuseholder 5 AMP Fuseholder Surface Mount 0.01uF Cap Surface Mount 0.1uF Cap Surface Mount Tantalum 10uF/10V Cap Surface Mount Tantalum 1uF/35V Cap Surface Mount Tantalum 47uF/10V Cap Surface Mount 100 ohm Resistor...
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GTLP EVM Bill of Materials Clock Driver Card Device Type Quantity Z-PAK 55-Pin Female Connector CDC2586 TQFP Clock Driver Surface Mount 0.1uF Cap Surface Mount 453 ohm Resistor Oscillator Mount SMB Coax Connector Termination Card Device Type Quantity Z-PAK 55-Pin Female Connector Surface Mount 0.1uF Cap Surface Mount 25 ohm Resistor Monitored Receiver Card...
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GTLP EVM Bill of Materials Monitored Driver Card Device Type Quantity Z-PAK 55-Pin Female Connector SN74ALVC126 TVSOP Buffer SN74GTLP1394 TVSOP Transceiver SN74GTLPH1655 TSSOP UBT SN74ALVCH16344 TSSOP Buffer CDC351 Clock Buffer SN74LVC112A JK Flip-Flop SN74LVC04 Inverter Surface Mount 0.1uF Cap Surface Mount 47pF Cap Surface Mount 1K ohm Resistor Surface Mount 2K ohm Resistor Surface Mount 500 ohm Resistor...
Board Layouts and Schematics A.2 Board Layouts and Schematics Figure A–1. Backplane Layout, Front Side Ç Ç Ç Ç Ç Ç Ç Ç Bill of Materials, Schematics, Board Layouts, and Suggested Specifications...
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