Internal Chassis Layout - HP Carrier-grade cc2300 Product Manual

1. Push down on the blue locking button on the top cover while sliding the top cover rearward to release it
from the chassis.
2. Lift the top cover up to remove.
Figure 11-6. Removing the Top Cover

Internal Chassis Layout

The server uses the Telco and Industrial Grade server baseboard, which contains connectors for installing up
®
to two Intel Xeon™ processors with 512 KB L2 cache utilizing the FCPGA sockets. The baseboard has
6 DIMM slots and supports up to 12 GB error checking and correcting (ECC) SDRAM memory. The Telco
and Industrial Grade server baseboard also contains 6 PCI slots (implemented via riser cards), input/output
(I/O) ports, and various controllers.
Figure 11-7. HP Carrier-Grade Server (shown with top cover and bezel removed)
A. Power supply
B. PCI card bracket (full-length)
C. Riser card assembly (full-length)
D. PCI card bracket (low-profile)
E. Server baseboard
F. PCI add-in card (accessory to system)
G. Riser card assembly (low-profile)
96
B C
A D
F
E
G
H
M L K
H. Server fans
I. FPIO server board
J. RJ-45 COM2 and dual USB ports
K. Control panel
L. SCSI hard disk drive bays
M. Peripheral bay (optional CD-ROM module
or FDD module available)
TP108
I
J
TP124
Chapter 8