Wavecom FASTRACK M1306B User Manual page 59

Notes:
Short description of Class IE13 (
"Locations without controlled temperature and humidity, where heating may be used
to raise low temperatures, locations in buildings providing minimal protection against
daily variations of external climate, prone to receiving rainfall from carrying wind".
Short description of Class IE23 (
"Transportation in unventilated compartments and in conditions without protection
against bad weather, in all sorts of trucks and trailers in areas of well developed road
network, in trains equipped with buffers specially designed to reduce shocks and by
boat".
Short description of Class IE35 (
"Locations with no control on heat or humidity where heating may be used to raise
low temperatures, to places inside a building to avoid extremely high temperatures,
to places such as hallways, building staircases, cellars, certain workshops,
equipment stations without surveillance".
Short description of Class IE73 (
"Transfer to places where neither temperature nor humidity are controlled but where
heating may be used to raise low temperatures, to places exposed to water droplets,
products can be subjected to ice formation, these conditions are found in hallways
and building staircases, garages, certain workshops, factory building and places for
industrial processes and hardware stations without surveillance".
Warning: The specification in the above table applies to the M1306B product only.
Customers are advised to verify that the environmental specification of the SIM Card
used is compliant with the M1306B environmental specifications. Any application
must be qualified by the customer with the SIM Card in storage, transportation and
operation.
The use of standard SIM cards may drastically reduce the environmental conditions
in which the Product can be used. These cards are particularly sensible to humidity
and temperature changes. These conditions may produce oxidation of the SIM card
metallic layers and cause, in the long term, electrical discontinuities. This is
particularly true in left alone applications, where no frequent extraction/insertion of
the SIM card is performed.
In case of mobility when the application is moved through different environments
with temperature variations, some condensation may appear. These events have a
negative impact on the SIM and may favor oxidation.
If the use of standard SIM card, with exposition to the environmental conditions
described above, can not be avoided, special care must be taken in the integration of
the final application in order to minimize the impact of these conditions. The solutions
that may be proposed are:
•
Lubrication of the SIM card to protect the SIM Contact from oxidation.
•
Putting the Wireless CPU
confidential ©
This document is the sole and exclusive property of WAVECOM. Not to be distributed or divulged
without prior written agreement.
WM_PRJ_M13_UGD_001 -003
Fastrack M1306B User Guide
For more information see standard IEC 60721-3-1)
For more information, see standard IEC 60721-3-2)
For more information see standard IEC 60721-3-3)
For more information see standard IEC 60721-3-7)
® in a waterproof enclosure with desiccant bags.
Technical Characteristics
Page: 58 / 65
November 11, 2006