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8.2
STORAGE CONDITIONS
Resin material of the plastic mold package absorbs moisture when exposed in a room. If the package being mounted
with moisture absorbed, therefore, it may adversely influence Device reliability (especially in its moisture resistance).
The products, therefore, are shipped in dry-pack for which aluminum laminated bags with desiccant placed inside.
For storage prior to mounting, pay attention to the following:
1. Handle with enough care so as not to apply excessive impact or to stab with a sharp edged item. The package may
be broken.
2. Store this, before opening, at 30ºC with humidity of 60% or below, and try to use this in as short a period as
possible.
3. After opening a bag, use this quickly. If you like to store this even temporarily after opening, be sure to put
desiccant, fold the opening, and seal it with tape, etc..
8.3
OTHERS
1. Pay attention so that no mechanical stress is applied to lead terminals, etc. of the package. It may result in
damage on the external lead terminal, disconnection of the internal lead, or deterioration in moisture resistance.
2. On soldering, try to keep thermal stress minimum.
3. Beware of static electricity which may destroy IC's. Provide the work place, workers, jigs and equipments with
appropriate preventive measures against static electricity.
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