Manufacturing Options - Intel BOXD850EMD2L - 850E 478PIN MAX-2GB UATX 3PCI Specifications

Table 2. Feature Summary (continued)
Hardware
Management
Subsystem
Audio (Integrated)
For information about
The board's compliance level with ACPI, Plug and Play, and SMBIOS.

1.2.2 Manufacturing Options

Table 3 describes the manufacturing options. Not every manufacturing option is available in all
marketing channels. Please contact your Intel representative to determine which manufacturing
options are available to you.
Table 3.

Manufacturing Options

LAN
CNR
USB 2.0
✏
NOTE
The LAN and the CNR manufacturing options are mutually exclusive.
One of the following:
• Hardware monitoring ASIC
 Voltage sense to detect out-of-range power supply voltages
 Thermal sense to detect out-of-range thermal values
 Fan monitoring
• Hardware monitoring and fan control ASIC
 Voltage sense to detect out-of-range power supply voltages
 Thermal sense to detect out-of-range thermal values
 Fan monitoring and control
Audio subsystem that uses the Analog Devices AD1885 analog codec for AC '97
processing
®
Intel 82562ET 10/100 Mbit/sec Platform LAN Connect (PLC) device
One Communication and Networking Riser (CNR) connector (slot shared with
PCI bus connector 3 on the desktop board D850EMD2 and with PCI bus connector
6 on the desktop board D850EMV2)
Support for USB 2.0 devices. The USB 2.0 option supports up to five USB ports.
It uses the following components:
• NEC µPD720100 USB 2.0 host controller
• SMSC LPC47M132 LPC bus I/O controller
The USB 1.1 ports routed through the ICH2 are not available with the USB 2.0
option.
Product Description
Refer to
Section 1.5, page 19
13