Page 1 CHALLENGE™/Onyx™ L Deskside Installation Instructions Document Number 108-7039-020...
Page 2 This document contains proprietary and conﬁdential information of Silicon Graphics, Inc. The contents of this document may not be disclosed to third parties, copied, or duplicated in any form, in whole or in part, without the prior written permission of Silicon Graphics, Inc. Restricted Rights Legend...
Page 3 Intel is a trademark of Intel Corporation. Futurebus+ is a trademark of Futurebus, Inc. MIPS is a registered trademark, and R4400 is a trademark of MIPS Technologies, Inc. Sun is a registered trademark of Sun Microsystems, Inc. UNIX is a registered trademark of UNIX System Laboratories.
Page 5 Overview1-1 Product Description1-1 Terminology1-4 Safety1-4 Restrictions and Important Notes1-5 Chassis Tour2-1 The New CHALLENGE/Onyx Deskside Components2-1 Controls, Connectors, and Indicators2-7 2.2.1 I/O Filter Boards2-11 2.2.2 Interrupt Connectors2-11 Heartbeat Interrupts 2-12 Master Orchestrator 2-13 CHALLENGE/Onyx Deskside System Slot Designations2-13 Backplanes2-17 2.4.1 Graphics Backplane2-17 2.4.2 Server Backplane2-18...
Page 6 Cache Controller (CC) 4-5 Address Path (A) ASIC 4-5 Data Path (D) ASIC 4-5 MC3 Memory Board4-5 4.3.1 Interleaving4-6 4.3.2 Memory Board Structure4-6 I/O Subsystem4-7 4.4.1 IO4 Board4-7 Bus Architecture 4-8 S Controller ASIC 4-8 F Controller ASIC 4-8 EPC 4-8 4.4.2 Mezzanine Boards4-10 VMEbus Channel Adapter Module (VCAM) Board 4-10...
Page 7 4.10 New Addressing Scheme for Drives4-25 4.10.1 Addressing Drives Using the PROM4-26 4.10.2 Addressing Drives under IRIX4-26 4.10.3 Forming the Drive Address4-27 PROM Addressing 4-27 IRIX Addressing 4-27 Using the New Address 4-27 Installation5-1 Overview5-1 Safety5-1 Unpacking5-2 Graphics System Installation5-3 5.4.1 Graphics System Installation Summary5-3 5.4.2...
Page 8 5.12 Configuring a SCSI Channel5-27 5.12.1 Configuring IO4 and SCSI Mezzanine Boards5-28 5.12.2 Configuring Channel Adapter Boards5-29 5.12.3 Configuring SCSI Cables5-29 5.12.4 Configuring a Drive Adapter Board5-29 5.12.5 SCSI Channel Terminator5-31 5.13 Labels on a SCSI Channel5-32 5.14 Configuring the Software for Additional IO4 Boards5-42 5.14.1 SCSI Expansion and Software Configuration5-43 5.14.2...
Page 9 General Procedures 5a-2 5.16.2 Powering Down the System5a-3 5.16.3 Opening the Chassis Front Door5a-4 5.16.4 Replacing the Front Door5a-5 5.16.5 Opening the I/O Door5a-6 5.16.6 Replacing the I/O Door5a-8 5.16.7 Removing the Rear Plastic Panel and Sheet-metal Cover5a-8 5.16.8 Removing the Side Panels5a-9 5.16.9 Replacing the Top Hat5a-10 5.16.10...
Page 10 Monitor CablesB-21 Input Device CablesB-24 Serial Device CablesB-25 Parallel Device CablesB-25 Network CablesB-25 Modem CablesB-26 Rackmount System Interrupt CablesB-26 Memory Upgrade ConfigurationsC-1 Drive MaintenanceD-1 Operating and Maintaining the 4-mm DAT and 8-mm Tape DrivesD-1 Archive Python 4320 NT (4-mm DAT Drive)D-1 D.2.1 Loading and Unloading CassettesD-1 D.2.2...
Page 11 CHALLENGE/Onyx Deskside System1-2 Figure 1-1 CHALLENGE/Onyx Deskside Product Evolution1-3 Figure 1-2 Interface modules (mezzanine boards)2-5 Figure 2-1 VME channel adapter module (VCAM, P/N 030-0243-xxx)2-5 Figure 2-2 Figure 2-3 Flat Cable Interface modules (standard and short)2-6 Figure 2-4 SCSI channel adapter boards2-6 Figure 2-5 IO4 Filter2-6 Figure 2-6...
Page 12 Mezzanine Boards4-27 Connecting a 21-inch Monitor5-4 Figure 5-1 Installing a 19-inch Monitor with BNC Connectors5-4 Figure 5-2 Installing a 19-inch Monitor with 13W3 Connectors5-5 Figure 5-3 Figure 5-4 Keyboard Cabling5-6 Figure 5-5 Connecting an ACSII Terminal5-8 Figure 5-6 CHALLENGE/Onyx Main Power Switch5-10 Figure 5-7 System Controller Status Panel5-11 Figure 5-8...
Page 13 Memory Bank Organization5-53 Figure 5-39 SIMM Organization per Bank5-54 Figure 5-40 Top View of MC3 Board5-55 Figure 5-41 MC3 SIMM5-56 Figure 5-42 Figure 5-43 One-way Interleaving5-57 Figure 5-44 Two-way Interleaving (Bank 0 on Leaf 0 and Leaf 1 Shown), One Board5-58 Four-way Interleaving (Two Boards Required)5-59 Figure 5-45 Relation between Memory Performance and the Number of...
Page 14 Panels5a-3 Powering Down the System5a-4 Figure 5-68 Opening the Front Door5a-5 Figure 5-69 Removing the Front Door5a-6 Figure 5-70 Figure 5-71 Opening the I/O Door5a-7 Figure 5-72 Removing the I/O Door5a-8 Figure 5-73 Removing the Rear Sheet-metal Cover5a-9 Figure 5-74 Removing the Side Panels5a-10 Figure 5-75 Replacing the Top Hat5a-11...
Page 15 Swap Ready PortB-9 Figure B-11 Frame Grab PortB-9 Figure B-12 Composite Video Ports A, BB-9 Figure B-13 S-VIDEO Ports A, BB-10 Figure B-14 Figure B-15 Monitor Port (13W3 Receptacle)B-11 Figure B-16 Alpha PortB-11 Figure B-17 Sync PortB-12 Figure B-18 Genlock IN, Genlock OUTB-12 Figure B-19 68-pin Connector on I/O PanelB-14 Figure B-20...
Page 16 128 MB (Two-way Interleaving) to 256 MB (Four-way Figure C-11 Interleaving)C-14 Figure C-12 128 MB (Two-way Interleaving) to 512 MB (Four-way Interleaving)C-15 Figure C-13 128 MB (Two-way Interleaving) to 512 MB (Eight-way Interleaving)C-16 128 MB to 640 MB (Two-way Interleaving)C-17 Figure C-14 Figure C-15 128 MB to 1024 MB (Eight-way Interleaving)C-18...
Page 17 512 MB (Two-way Interleaving) to 1280 MB (Four-way Figure C-36 Interleaving)C-39 Figure C-37 512 MB (Four-way Interleaving) to 2048 MB (Eight-way Interleaving)C-40 Figure C-38 512 MB (Eight-way Interleaving) to 2048 MB (Eight-way Interleaving)C-41 640 MB to 1024 MB (Two-way Interleaving)C-42 Figure C-39 Figure C-40 640 MB to 1280 MB (Four-way Interleaving)C-43...
Page 18 xviii...
Page 19 CHALLENGE/Onyx Multiname Terms1-4 Table 1-1 The New CHALLENGE/Onyx System Components2-1 Table 2-1 System Controls, Connectors, and Indicators2-7 Table 2-2 I/O Panel Connectors2-11 Table 2-3 Table 2-4 Onyx Graphics I/O Panel Connectors2-13 Table 2-5 Onyx Graphics Configuration2-13 Table 2-6 CHALLENGE Server Configuration Slot Designations2-14 Table 2-7 Graphics and Server Backplane Connectors and Jumpers2-17 Table 3-1...
Page 20 Allowable Memory Configurations for MC3 Boards with P/N Table 5-25 030-0245-008 and Above5-63 Table A-1 CHALLENGE/Onyx Deskside System SpecificationsA-1 Table B-1 Parallel PortB-2 Table B-2 Ethernet PortB-3 Table B-3 Serial Port tty_1B-4 Serial Ports tty_2, tty_3 for Unpowered PeripheralsB-5 Table B-4 Serials Ports tty_2, tty_3 for Powered PeripheralsB-6 Table B-5 Serial Port tty_4 RS-422 ProtocolB-6...
Page 21 Keyboard/Mouse Extension Cable, Round, 30’ Length, Table B-30 Shielded, 6-pin Circular Mini-DIN Plugs at Both EndsB-24 Table B-31 Keyboard/Mouse Extension Cable, Round, 75’ Length, Shielded, 6-pin Circular Mini-DIN Plugs at Both EndsB-25 Table B-32 Rackmount System Interrupt CableB-26 Table C-1 Memory Upgrade RequirementsC-1 Table D-14-mm DAT Drive Front Panel LEDsD-2 Table D-28-mm Tape Drive Front Panel LEDsD-4...
Page 22 xxii...
Page 23 The multiprocessor CHALLENGE L and Onyx L (hereinafter called the CHALLENGE/Onyx deskside) systems are an evolutionary enhancement over previous- generation Silicon Graphics deskside systems such as the 12-slot and 15-slot twin towers and 13-slot and 14-slot Single Towers. See Figure 1-1 and Figure 1-2.
Page 24 • system status panel that provides a continuous display of current system operating conditions • ofﬂine switching (OLS) power supply that operates at 110 or 220 VAC and provides up to a maximum of 1900 watts of power. Other distinguishing features of this system include •...
Page 25 CHALLENGE/Onyx • Multiprocessor R4400 capability • Greater storage, memory, I/O capability • Enhanced graphics with RealityEngine or VTX board set • 20 times faster system bus • Up to 2 GB of memory per MC3 board Single Tower/Crimson • Single−processor R4000 •...
Page 26 Terminology If you read many Silicon Graphics documents, or talk with various organizations in the company, you may encounter different terminology being used for the same concepts. To avoid confusion, Table 1-1 provides a list of these terms and their marketing and in-house aliases.
Page 27 This equipment is extremely sensitive to damage from electrostatic discharge Caution: (ESD), an electrical charge caused by the buildup of electrical potential on clothing and other materials. You must use the following ESD preventive measures: • Attach a ground strap to your wrist when connecting/disconnecting boards or peripherals.
Page 28 Overview...
Page 29 Chapter 2 Chassis Tour This chapter provides an overview of the chassis for the CHALLENGE/Onyx deskside system; a description of the controls, connectors, and indicators; and a functional description of the backplane. The New CHALLENGE/Onyx Deskside Components Table 2-1 identiﬁes the new principal components of the CHALLENGE/Onyx deskside systems as well as available options and brieﬂy compares them with previous Crimson and Single Tower technology.
Page 30 Product/Board Name Description Comments/Comparison MC3 (P/N 030-0245-xxx) Memory board This board replaces the MC2 memory board used in the Single Tower system. The MC3 board supports memory interleaving, which enables faster read and write accesses across the bus. The MC3 also supports up to 2 GBs per memory board.
Page 31 Product/Board Name Description Comments/Comparison System bus The Ebus The Everest bus has a bandwidth of 1.2 GB per second and is 20 times greater than the bandwidth of the MP bus in the Single Tower and Crimson systems. I/O Subsystem Front-loading devices (FLDs) The CHALLENGE/Onyx drive The CHALLENGE/Onyx...
Page 32 Product/Board Name Description Comments/Comparison SCSI channel adapter boards These small boards that mount See Figure 2-4. directly to the SCSI bus connectors on the IO4 board are used to conﬁgure the SCSI bus for single-ended or differential operation. They are color-coded as follows: red = differential, green = single-ended.
Page 33 Product/Board Name Description Comments/Comparison Raster Memory The RM4 scans and converts This board is identical to the (RM4—P/N 030-0337-xxx) triangle data into pixel data. board used in the RealityEngine graphics. However, the RE /VTX board set does not require an RM4T board to terminate the triangle bus as in the Reality Engine.
Page 34 Short Long Figure 2-3 Flat Cable Interface modules (standard and short) Adapter Board SCSI Connector IO4 Board SCSI channel adapter boards Figure 2-4 Figure 2-5 IO4 Filter Figure 2-6 Video ﬁlter (EF7) Chassis Tour...
Page 35 Controls, Connectors, and Indicators Figure 2-7, Figure 2-8, and Figure 2-9 show the locations of the standard controls, connectors, and indicators for the CHALLENGE/Onyx deskside systems. Table 2-2, Table 2-3, and Table 2-4describe each item. Item Description Power receptacle This socket is an IEC320-C20 and accepts an IEC 320-C19 connector. Main circuit breaker This circuit breaker switch controls the main power supply to the chassis and protects the system from electrical damage.
Page 36 System Controller Drive Access Door Front− loading Drives Front View of CHALLENGE/Onyx System with Drive Door Open Figure 2-7 Chassis Tour...
Page 37 Circuit Breaker AC Power Receptacle Rear View of CHALLENGE/Onyx Deskside System Chassis Figure 2-8 SGI Field Engineering Template, 1.93...
Page 38 Frame CMPST SVideo Genlock Grab Alpha Swap CMPST SVideo Genlock Ready Monitor Sync 0 1 2 3 RS422 RS232 RS232 System tty_4 tty_3 tty_2 Console tty_1 Interrupts Ethernet Parallel Powered Keyboard/ Peripheral Mouse Powered Peripheral Figure 2-9 Main I/O and Graphics I/O Panels 2-10 Chassis Tour...
Page 39 Description Keyboard/Mouse This 6-pin minicircular dual inline (DIN) connector accepts the standard Connector Silicon Graphics keyboard cable in Onyx systems. Parallel Port This is a 25-pin D-sub Centronics-compatible connector. Ethernet This 15-pin D-sub port provides a standard Ethernet connection. See note in Section 2.2.1, “I/O Filter Boards.”...
Page 40 Secondary I/O filter boards Primary I/O filter board Empty plate for Remote System Control/Peripheral Rack Control (optional) Figure 2-10 Server System with Multiple I/O Panels 2.2.2.1 Heartbeat Interrupts In this scenario, the customer uses the interrupts as a heartbeat transmitter, involving two systems working in tandem in a master/slave conﬁguration.
Page 41 The channels are interchangeable. 13W3 This output connector equals and replaces the RGB BNC connectors on earlier Silicon Graphics workstations. The 13W3 provides RGB out and logic sense for the monitor. SYNC This output connector provides an external sync signal for non-Silicon Graphic monitors, as required.
Page 42 Slot Number Description IO4 base board (Note: An IO4 must reside in slot 3.) VCAM board (Note: The VCAM mezzanine board connects to both the IO4 and the backplane.) GE10 (Geometry Engine) board DG2 (Display Graphics) board Third or fourth RM4 (Raster Manager) board Second RM4 (Raster Manager) board Third or fourth RM4 (Raster Manager) board First RM4 (Raster Manager) board...
Page 43 Owing to less air ﬂow coming into slot 1 and because of the heat generated by Caution: the IP19 board, the cooler-operating MC3 must be in the ﬁrst slot. Note: The server system can have up to three CPU boards or three MC3 boards or three IO4 boards.
Page 44 Figure 2-12 CHALLENGE Server Board Locations 2-16 Chassis Tour...
Page 45 Backplanes The CHALLENGE server system uses an 11-slot backplane to provide interconnection and power to the boards in the system. The Onyx graphics system uses a 13-slot backplane. Figure 2-13 and Figure 2-14 provide illustrations of the graphics and server backplanes. 2.4.1 Graphics Backplane The backplane provides two types of board connectors: •...
Page 46 Status Panel 505 Power Boards 512 Power Board Jumpers System Controller Board Future Option EBUS Drive (not used) (not used) JTAG GRD1 (not used) (not used) (not used) Fan Power OLS Sense/Control SCSI Power Figure 2-13 Onyx Graphics Backplane 2.4.2 Server Backplane The backplane provides two types of board connectors: •...
Page 47 • slots 6 through 11 on the server conﬁguration, which connect to the VME bus, are 0.8 inches wide and use three 96-pin DIN connectors Figure 2-14 illustrates the CHALLENGE server backplane. Note the power board connections (505, 512, and System Controller). The power boards convert the 48 DC volts from the ofﬂine switching (OLS) power supply to the required DC voltages for the boards.
Page 48 Status Panel 505 Power Board 512 Power Board System Controller Board Lines Ebus Drive (not used) (not used) JTAG GRD1 (not used) (not used) (not used) Future Option Fan Power SCSI Power Figure 2-14 CHALLENGE Server Backplane Connectors and Jumpers 2-20 Chassis Tour...
Page 49 Chapter 3 Conﬁgurations and Components This chapter describes the available system versions and the major components (ﬁeld-replaceable units) for the CHALLENGE (server) and Onyx (graphics) system conﬁgurations. Both conﬁgurations are available in 110 and 220 VAC versions. CHALLENGE Deskside Server System Conﬁgurations The 11-slot server system comes in the following base conﬁguration: •...
Page 50 The deskside server system can physically hold up to three MC3 boards; Caution: however, this is not legal conﬁguration. See Section 5.15.5, “Avoiding Three MC3 Board Conﬁgurations,” in Chapter 5, “Installation,” for more information. 3.1.2 Power Boards The server system comes standard with a set of four power boards that plug into the backplane.
Page 51 3.2.2 VTX Graphics Board Set The Onyx deskside system supports one 5-span (only) VTX board set. The VTX conﬁguration also uses the standard 19-inch Silicon Graphics monitor. Note: For a list of differences between the RE and VTX graphics board sets, see Chapter 4, “Theory of Operations.”...
Page 52 CHALLENGE/Onyx Main Components This section provides ﬁeld-replaceable units (FRUs) and part numbers for the CHALLENGE/Onyx deskside systems (see Table 3-1, Table 3-2, and Table 3-3). See Chapter 5, “Installation,” for drawing of many of the following components: Part Number Description 013-0511-xxx Video ﬁlter PCB (GFX) 030-0263-xxx...
Page 53 Part Number Description 018-0294-xxx Three-drive SCSI cable assembly 018-0331-xxx Secondary I/O cable assembly 018-0333-xxx General I/O cable assembly 015-0113-xxx Blower power harness assembly 015-0114-xxx Disk power harness assembly Table 3-2 (continued) CHALLENGE/Onyx Cable Assemblies Part Number Description 013-0500-xxx Blower module 013-0508-xxx Chassis power assembly 013-0509-xxx...
Page 54 Configurations and Components...
Page 55 Chapter 4 Theory of Operations This chapter provides a block diagram description of the CHALLENGE/Onyx system. A functional overview of the RealityEngine ) and VTX graphics board set is also provided. Overall Functional Description Figure 4-1 shows a simpliﬁed block diagram of the CHALLENGE/Onyx bus and system architecture.
Page 56 Ebus for short. The Ebus replaces the old standard MP bus in the Silicon Graphics POWER Series™ systems such as the Single Tower and POWER Center™ (Predator). The Ebus provides a 256-bit data bus and a 40-bit address bus that can sustain a bandwidth of 1.2 GB per second.
Page 57 Power RS−232 Power Fans Supplies Boards Memory System Boards Boards Controller (1−3) (1−3) Everest Addr Bus (40 bits) IO4 Base IBUS Everest Data Bus (256 bits) Board VME Bus VME Bus VCAM Interface Boards Modules (1−2) Onyx and Challenge Board Set Internal SCSI / SCSI II Buses SCSI/SCSI II...
Page 58 dedicated supporting logic. This processor slicing allows each microprocessor to run cache-independent of the others. The only portion of the CPU board circuitry that is shared by the resident microprocessors is the bus arbitration logic. See Figure 4-2 for a functional block diagram illustrating the CPU board.
Page 59 4.2.2 Processor Subsystem As shown in Figure 4-2, each CPU has it own secondary cache and a cache controller, the CC device. Each CPU is also connected to the Ebus through the address path (A) ASIC and four data path (D) ASICs. 4.2.2.1 Cache Controller (CC) The cache controller implements a duplicate set of secondary cache tags that handle and...
Page 60 4.3.1 Interleaving Interleaving, a technique for organizing memory into leaves, increases the sustainable memory bandwidth. For example, using two overlapped memory accesses, operating on two memory leaves, effectively doubles the memory bandwidth attainable without interleaving. (A single memory leaf can start to process a new read request every 200 nanoseconds;...
Page 61 Address and Control MA - IC Memory Controller Addr Path Interface Lat/Xcvr Addr Path, DRSC DRAM Array Leaf 0 Data Bank 0 Bank 1 Check bits DRAM Array Leaf 0 Bank 2 MD - ICs (4) Bank 3 EDC logic Data Buffers DRAM Array Leaf 1 Data Path Interface...
Page 62 • two SCSI-2 cable connections • two Ibus connections See Figure 4-4 for a functional block diagram of the IO4 board. 4.4.1.1 Bus Architecture Communication with the VME and SCSI buses, the installed graphics boards set(s), and the Ethernet takes place through the Ibus. A set of interface control devices, an I address (IA) and I data (ID), interfaces the Ibus to the Ebus, the main system bus.
Page 63 The Everest peripheral controller (EPC) supports the basic peripheral ICs and interfaces required for system boot and operation. The EPC manages the data movement to and from the Ethernet, a parallel port, and various types of on-board PROMs and RAM. The EPC consists of the following components: •...
Page 64 4.4.2 Mezzanine Boards Other principal components of the I/O subsystem are mezzanine boards. The mezzanine boards mount directly onto the IO4 base board through a set of standoffs. The available mezzanine boards consist of these types: • a VCAM board •...
Page 65 4.4.2.4 SCSI Channel Adapter Boards There are two versions of the SCSI channel adapter board, differential and single-ended. The differential board is color coded red. The single-ended board is color coded green. The adapters insert directly into the SCSI connectors at the forward edge of the IO4 board. System Power The CHALLENGE/Onyx systems are powered through an ofﬂine switcher (OLS) and a set of specialized power boards.
Page 66 The RealityEngine ) and VTX are the graphics boards sets in the Onyx deskside and rackmount systems. The RE and VTX graphics subsystems comprise three board types: the Geometry Engine (GE10), the Display Generator (DG2), and the Raster Memory (RM4). The principal features of the RealityEngine and VTX graphics board sets are •...
Page 67 Feature RealityEngine RealityEngine High-deﬁnition television (HDTV) support RM4T board required Frontplane used DI1 for Onyx DI1, DI2, DI3, rackmount and DI3 for depending on system Onyx deskside Supported systems Onyx deskside and Onyx deskside and POWER Series systems rackmount rackmount including —...
Page 68 (For Diagnostics) J Bus Triangle Bus From FCI GE10 via the VCAM Readback Bus J Bus Board Digital Video Bus Video (DI) Optional Video Boards VC Bus Color Monitor RGB Output AUX Equipment etc. Low Res Composite Output Composite Monitor Digital Video Figure 4-5...
Page 69 Triangle Bus Readback GE10 GEF/GE i860−50 48 d 6 or 12 GE Processors 64 d 33 d 32 a GEF/GE i860−50 48 d VC Bus (toDG2 board) Figure 4-6 Geometry Engine Functional Block Diagram The major components on the GE10 are the Flat Cable Interface–to- graphics (FCG) ASIC, the command processor (CP), and the geometry engine (GE) processors.
Page 70 50Mhz i860XP DRAM To RM Triangle Pixel Video Data 6 or 12 GE Processors Geometric Data and Command Commands Processor 50Mhz i860XP DRAM To RM Triangle GE Processor Block Diagram Figure 4-7 The GE10 ties into the display generator subsystem (the DG2) board through the video control bus.
Page 71 1 Span of 5 Triangle Bus Texture Pixel Memory Address Generator Texture Data Buffer ASIC Video Stream 4MBits 4MBits 4MBits 4MBits Figure 4-8 Raster Memory (RM4) Board Block Diagram The RE board set can have up to four RM4 boards per pipeline. The cost-reduced VTX supports one RM4 board.
Page 72 4.6.5.1 XMAP ASICs The ten XMAP ASICs on the DG2 board receive the serial stream of digital video data from the video control (VC) bus. The ASICs reorder data from the frame buffer to provide a left-to-right scan line display. The XMAPs also handle the lookup of the color-mapped pixels and generate the proper RGB color for each pixel.
Page 73 Color XMap R G B A Color XMap Hardware Cursor Support Digital Video Programmable Shadow Video Timing Programmable NTSC/PAL Pixel Clock Video Encoder Synthesis Function Manager Genlock Support Figure 4-9 Display Generator (DG2) Block Diagram Storage Devices SCSI front-loading devices (FLDs) require no additional cabling at installation; however, each device should be checked to ensure that it has a valid ID select number.
Page 74 These guidelines also apply to systems having additional SCSI channels owing to the installation of one of the optional mezzanine cards. SCSI Support The CHALLENGE/Onyx products support many types of SCSI protocols, resulting in a wide variety of SCSI channel conﬁgurations. This document introduces the supported SCSI protocols for CHALLENGE/Onyx products, deﬁnes the components in a SCSI channel, and explains how to conﬁgure and label a SCSI channel.
Page 75 4.8.4 SCSI Data Transfer Rate Data transfer rates are either slow or fast, measured in megatransfers per second. Megatransfers are the millions of operations per bus cycle. An operation is either 8- or 16-bit in size. Megatransfers are based on a bus’s burst data rate. Data transfer rates depend on the bus bandwidth.
Page 76 Slow Fast Slow Fast 8-bit 16-bit Figure 4-11 SCSI Bus Data Transfer Rates The system controller negotiates independently with the devices on a bus to establish the acceptable transfer rate of each device, allowing a mix of fast and slow devices on the same bus.
Page 77 4.8.5 SCSI Conﬁguration Guidelines These guidelines reﬂect the dependencies between SCSI bus bandwidths, types, and data transfer rates. Follow these guidelines to minimize inconsistent or inoperable SCSI buses: • Install 8-bit and 16-bit devices on separate buses. • Install single-ended and differential devices on separate buses. •...
Page 78 Figure 4-12 IO4 Board A SCSI mezzanine board (see Figure 4-13) attaches to an IO4 board, up to two mezzanine boards for each IO4 board. Each SCSI mezzanine board supports three SCSI buses.On the inner connectors, two buses use differential protocol only, and on the outer connector, the bus is selectable as either single-ended or differential by using a Channel adapter board.
Page 79 A SCSI bulkhead (see Figure 4-15) supplies a blind-pluggable receptacle to each SCSI device bay in a SCSI box. Each receptacle provides up to two SCSI channels, selectable using a drive adapter board.The bulkhead also provides connectors at the end of the channels for termination.Several different SCSI bulkheads exist based on the chassis involved.
Page 80 A SCSI device (see Figure 4-18) is a media retrieval mechanism that uses the SCSI interface. Figure 4-18 SCSI Device (CD player shown) A SCSI terminator (see Figure 4-19) resides at the end of a SCSI channel and terminates the signals.
Page 81 IO4 Board Terminators SCSI Bus 0 SCSI Bus 1 Channel Adapter Boards SCSI Bulkhead SCSI Cables, IO4 End SCSI Device Cable Connector SCSI Cables, Bulkhead End Drive Adapter Board SCSI Device Figure 4-20 Deskside Internal SCSI Channel Components 4.10 New Addressing Scheme for Drives An IO4 board can have up to eight SCSI bus interfaces or channels (see Figure 4-21).
Page 82 4.10.1 Addressing Drives Using the PROM The previous PROM drive addressing format remains basically in place, for example, dksc(a,b,c), where a represents the SCSI bus number, b refers to the drive number, and c refers to the drive’s partition number. The dksc designation is the monitor’s name for SCSI. Note: The PROM can address only the master IO4 board in a system.
Page 83 SCSI Bus/Channel 2 SCSI Bus/Channel 7 SCSI Bus/Channel 5 SCSI Bus/Channel 6 SCSI Bus/Channel 0 SCSI Bus/Channel 1 SCSI Bus/Channel 3 SCSI Bus/Channel 4 Figure 4-21 SCSI Channels or Bus Interfaces on an IO4 Board with Two Mezzanine Boards 4.10.3 Forming the Drive Address The software drive identiﬁcation number uses the same form as in the addressing scheme described earlier.
Page 84 You must know this new drive addressing and identiﬁcation method to run the disk maintenance programs such as fx and MAKEDEV. For information on running these programs, see the system administration documents for your computer. 4-30 Theory of Operations...
Page 85 Installation of this product requires speciﬁc training and technical knowledge. These instructions have been provided for use by Silicon Graphics system support engineers (SSEs) and Silicon Graphics–trained personnel only. This equipment uses electrical power internally that is hazardous if the equipment is improperly assembled or disassembled.
Page 86 • Do not use an ohmmeter on the boards. Caution: Sixteen fuses are installed on the SCSI backplane. To protect against ﬁre, replace only with a Cooper Industries, Bussman Div., P/N MCR-5, rated 125 V, 5 A fuse. There is a danger of explosion if the lithium battery-powered integrated circuit Caution: on the IO4 and system controller board is incorrectly replaced.
Page 87 Graphics System Installation Before beginning the installation procedure, verify that the installation site meets the space, power, and environmental guidelines found in the CHALLENGE/Onyx Site Preparation Guide (P/N 108-7040-xxx). 5.4.1 Graphics System Installation Summary See Table 5-1 for a quick installation checklist for the Onyx deskside system. Tasks Location in Manual 1.
Page 88 Note: For additional information regarding monitor operation, see the monitor’s user’s guide. 13W3 Connector 21-inch Monitor with BNC connectors Monitor Video Cable for 21-inch monitor with BNC connectors and I/O panel with 13W3 connector Connecting a 21-inch Monitor Figure 5-1 13W3 Connector BNC Connectors 19-inch monitor...
Page 89 13W3 Connector 19-inch monitor with 13W3 connectors Monitor Video Cable for 19-inch monitor (use only 018-0285-001) Installing a 19-inch Monitor with 13W3 Connectors Figure 5-3 5.4.4 Keyboard and Mouse Cabling The Onyx deskside system ships with a standard 101-key international keyboard. The keyboard has two identical plug receptacles, located in the upper right and left corners.
Page 90 Keyboard/ Mouse Connector Figure 5-4 Keyboard Cabling Installation...
Page 91 Server Installation Before beginning the installation procedure, verify that the installation site meets the space, power, and environmental guidelines found in the CHALLENGE/Onyx Site Preparation Guide (P/N 108-7040-xxx). 5.5.1 Server System Installation Summary See Table 5-2 for a quick installation checklist for the CHALLENGE deskside system. Tasks Location in Manual 1.
Page 92 9−pin Connector ASCII Terminal tty 1 RS232 Connector Null Modem Cable for ASCII Terminal with 9−pin Connector Connecting an ACSII Terminal Figure 5-5 The keyboard has two identical plug receptacles, located in the upper right and left corners. These receptacles will accept the 6-pin minicircular connectors from either the keyboard cable or the mouse.
Page 93 something is wrong with the system, it will be easier to spot the possible problem, if additional devices are not connected. Follow these procedures to power up the system. 1. Turn on the main power switch on the back of the unit (see Figure 5-6). 2.
Page 94 Off−line Switcher Power LEDs Circuit Breaker CHALLENGE/Onyx Main Power Switch Figure 5-6 Note: When the rear plastic panel is removed and the ofﬂine switcher (OLS) is exposed, there are two power LEDs on the corner of the OLS. Both these LEDs should be on when the system is turned on.
Page 95 Fault Power On System Controller LCD Screen Mgr Position On Position Off Position Key Switch Menu Scroll Scroll Execute Down System Controller Status Panel Figure 5-7 Loading the Front-loading Devices (FLDs) into the System The CHALLENGE/Onyx FLDs use a sled assembly to mount into the drive bay; however, before installing a drive into a bay or slot, you need to determine the following: •...
Page 96 1. Place the drive assembly into the desired slot. The slide lever should be pushed toward the left (in the unlocked position). Slide the drive module all the way into place. 2. Push the drive lever to the right so that drive module mounts into place. The drive should not come out if you pull on it (see Figure 5-8).
Page 97 Slide Drive Lever left to unlock sled Drive Lever in locked position Installing a Drive Figure 5-8 SGI Field Engineering Template, 1.93 5-13...
Page 98 Figure 5-9 CD-ROM Installation Optional Equipment This section describes how to connect optional equipment such as a modem and a printer to the CHALLENGE/Onyx system. 5-14 Installation...
Page 99 5.8.1 Printer Cabling The serial printer connection is a 9-pin serial port located on the CHALLENGE/Onyx system I/O panel. The parallel printer connection is a 25-pin Centronics-compatible port. Cable the printer using a printer or null modem cable, as shown in Figure 5-10 and Figure 5-11.
Page 100 Printer/ Modem Connector Figure 5-10 Connecting a Printer or Modem 5-16 Installation...
Page 101 Parallel Printer Connector Figure 5-11 Connecting a Parallel Printer SGI Field Engineering Template, 1.93 5-17...
Page 102 Connecting the System to Ethernet The CHALLENGE/Onyx system comes with a 15-pin AUI (attachment unit interface) Ethernet connector. If you have a CHALLENGE server system with multiple I/O panels, you can use multiple Ethernet drops. Follow these instructions to connect an Ethernet drop to your system.
Page 103 Slide−latch 15−pin Ethernet connector Figure 5-12 Ethernet Connection 5.10 Conﬁguring the Onyx Graphics System This section • describes the controls and connectors for the 21-inch and 19-inch monitors SGI Field Engineering Template, 1.93 5-19...
Page 104 • shows how to connect additional video attachments to an Onyx system • describes how to set and change the screen resolution. 5.10.1 The 21-inch Monitor Controls and Connectors Figure 5-13 show the controls and connectors for the 21-inch monitor. 21-inch Monitor 13W3 Connector with BNC connectors...
Page 105 Table 5-3 and Table 5-4 describe the controls for the 21-inch color monitor. Control Description BNC/D-SUB signal input selection Selects BNC or 15-pin mini-D connectors. switch Auto/manual selection switch The Auto position selects one of the seven factory-preset viewing modes. Manual position allows display size and position to be changed using the Store, Selection, and Adjustment controls.
Page 106 Active (Lit) Adjustment Minus (–) Plus (+) Button Vertical Position Shift screen down Shift screen up Table 5-4 The 21-inch Monitor Viewing Mode Adjustments 5.10.1.2 Sync Adjustment There is a push switch at the rear of the 21-inch monitor labeled “Sync Adjustment.” This switch is used only if the monitor experiences sync problems when it is ﬁrst powered on.
Page 107 Video Mode Horizontal Frequency Vertical Frequency Resolution 2. VGA400 31.5 kHz 70 Hz 640 x 400 3. VGA480 31.5 kHz 60 Hz 640 x 480 4. 8514/A 35.5 kHz 87 Hz 1024 x 768 (interlaced) 5. 1024 x 768 48.8 kHz 60 Hz 1024 x 768 6.
Page 108 13W3 Connector 19−inch monitor with BNC connectors BNC Connectors H IG Monitor Video Cable for 19−inch monitor with BNC connectors and I/O panel with 13W3 connector POWER BRIGHTNESS CONTRAST POWER DEGAUSS INDICATOR FUNCTION LEDs Figure 5-14 The 19-inch Monitor Controls and Indicators Control Description Brightness control (sun icon)
Page 109 Control Description Contrast control (half moon icon) Two buttons (+ and –) used to adjust foreground brightness. An LED, located between the Contrast and Brightness controls, lights when the control is active. The LED ﬂashes when the control limit is reached.
Page 110 Figure 5-15 illustrates a sample video setup using the VTX or RE graphics hardware. The SVHS and CMPST A and CMPST B outputs enable you to view and record simultaneously. The 13W3 connector uses either a 13W3-to-13W3 or a 13W3-to-BNC external cable, depending on the monitor connector.
Page 111 Note: Only the RE graphics (two and four RM4 board versions) support 1600 x 1200 resolution. This resolution is displayed only on the 21-inch monitor. For additional information regarding monitor operation, see the monitor’s user’s guide. 5.10.4.1 Checking the Monitor Resolution Use the following command to determine the screen resolution: /usr/gfx/gfxinfo You should get a message similar to the following:...
Page 112 By selecting speciﬁc jumpers and connectors, many different SCSI devices can use the same basic mechanical design within several chassis. To conﬁgure a SCSI channel, verify the type of SCSI protocol required, identify each component in the SCSI channel using the charts in Chapter 4, “Theory of Operations,” in Section 4.8, obtain any missing components, and conﬁgure all components to the desired protocol as shown in Section 5.12.1 through Section 5.12.5.
Page 113 5.12.2 Conﬁguring Channel Adapter Boards Channel adapter boards determine the protocol of a SCSI channel leaving an IO4 or SCSI mezzanine board. The two types of channel adapter boards are color coded to simplify identiﬁcation, green for a single-ended protocol and red for a differential protocol. Single-ended channel adapter boards also include jumpers for setting the data transfer rate of the channel, either slow or fast.
Page 114 Both Channels Set for Single-ended Channel A Set for Single-ended Channel B Set for Differential No jumpers set; No jumpers set; reserved for future use reserved for future use. Channel A = Single-ended Both Channels = Single-ended Channel B = Differential Figure 5-18 Setting SCSI Protocols on a 50-pin Drive Adapter Board 5-30...
Page 115 Channel A Set for Single-ended Both Channels Set for Differential Channel B Set for Differential No jumpers set; No jumpers set; reserved for future use. reserved for future use. Channel A = Single-ended Both Channels = Differential Channel B = Differential Figure 5-19 Setting SCSI Protocols on a 68-pin Drive Adapter Board 5.12.5 SCSI Channel Terminator...
Page 116 Single−ended Terminators LO−PROFILE TERMINATOR 869516−1 ACTIVE "P" LO−PROFILE TERMINATOR 869515−1 DIFFERENTIAL Differential Terminators Figure 5-20 SCSI Terminator Labels 5.13 Labels on a SCSI Channel To simplify SCSI channel identiﬁcation, labels are on the I/O panel, connectors, cables, devices, SCSI boxes, and terminators. Depending on the component, a label may provide a •...
Page 117 Also, a channel adapter board is color coded to simplify identiﬁcation. Single-ended channel adapter boards are green, and differential channel adapter boards are red. See Figure 5-19 through Figure 5-35 and for a description of deskside SCSI channel labels and their locations. IO4 Board Terminators SCSI Bus 0...
Page 118 Description Procedure Identiﬁes SCSI protocol (SE or Select label based on the slot DF) and the bus number (0-7); and bus number of the I/O SE SCSI 0 label is part number board. For example, bus 0 on 024-0637-xxx; DF SCSI 1 label is an IO4 board in slot 13 gets part number 024-0640-xxx (see the label DF SCSI 130.
Page 119 Description Procedure Identiﬁes SCSI protocol (SE or Select label based on the slot DF) and the bus number (0-7); and bus number of the I/O SE SCSI 0 label is part number board. For example, bus 0 on 024-0637-xxx; DF SCSI 1 label is an IO4 board in slot 13 gets part number 024-0640-xxx (see Figure 5-24).
Page 120 Description Procedure On 50-pin adapter boards (see None required. Figure 5-26), the two selectable connectors are marked JA1 and JB1; on 68-pin adapters, the connectors are marked J1_A and J1_B. Drive Adapter Board Markings for SCSI Channels A and B Table 5-12 JA1 or J1_A JB1 or J1_B...
Page 121 Description Procedure Identiﬁes the SCSI protocol (SE Select label based on the slot or DF) and bus number (0-7): and bus number of the I/O SE SCSI 0 label is part number board. For example, bus 0 on 024-0637-xxx; DF SCSI 1 label is an IO4 board in slot 13 gets part number 024-0640-xxx (see the label DF SCSI 130.
Page 122 Description Procedure SCSI box label, part number Place label on the inner face 024-0655-xxx. See Figure 5-30. of the drive door in the upper left corner. For each channel, indicate the channel protocol (SE for single-ended, DF for differential) and the SCSI bus number (0 or 1).
Page 123 Description Procedure SCSI bulkhead (see Figure 5-32). None required. In early revisions, no distinction between connectors A and B; channel A is the bottom connector, and channel B is the top connector; in later revisions, the markings JTA_SCSI and JTB_SCSI are on the bulkhead next to the connectors.
Page 124 SE SCSI 0 DF SCSI 1 SCSI SCSI Terminators: DF Passive SE Active DF SCSI 1 SE SCSI 0 SCSI BACKPLANE DF SCSI 1 SE SCSI 0 024−0660−001 A Figure 5-34 External SCSI Labeling of a Deskside Chassis 5-40 Installation...
Page 125 DF SCSI 0 3 4 5 6 7 8 9 10 11 12 13 14 15 Figure 5-35 Location of SCSI Labels on Devices SGI Field Engineering Template, 1.93 5-41...
Page 126 All labels in this diagram are identical, as determined by the SCSI bus number: Bus Number Label Set Part Number Secondary IO4 Board Bus 0−7 024−0610−xxx Bus 30−37 024−0648−xxx Bus 40−47 024−0649−xxx Bus 50−57 024−0650−xxx Bus 70−77 024−0651−xxx Bus 90−97 024−0652−xxx Bus 110−117 024−0653−xxx...
Page 127 Note: The information in this section applies only to a CHALLENGE L system with two or more IO4 boards, not the Onyx L. An Onyx deskside system can support only one IO4 board. See also Chapter 3, “Conﬁgurations and Components,” regarding legal system conﬁgurations.
Page 128 The serial and Ethernet ports on IO4s require specifying the Ebus slot number of the particular IO4 where they originate. For serial ports, there is one vector line per IO4 board with the “unit” ﬁeld values as shown in Table 5-20 Location /dev/ttyXX unit=...
Page 129 5.15.1 Key MC3 Terms Term Deﬁnition MC3 or interleaved memory board (IMB) The MC3 board has 32 SIMM sockets organized into leaves and banks. 32 SIMM Sockets per MC3 Board Term Deﬁnition Leaves (leaf 0 and leaf 1) The MC3 board consists of two leaves (leaf 0 and leaf 1).
Page 130 Leaf 0 Leaf 0 Leaf 1 Leaf 1 Leaf 0 Leaf 0 Leaf 1 Leaf 1 Term Deﬁnition Bank (also known as block) A bank or block is the basic building unit of the MC3 board. A single bank is composed of four SIMMs.
Page 131 Bank A SIMM SIMM Leaf 0 Leaf 0 Bank B SIMM SIMM Leaf 1 Leaf 1 Bank A SIMM SIMM Leaf 0 Leaf 0 Bank B SIMM SIMM Leaf 1 Leaf 1 Term Deﬁnition High-density SIMM This is the 16 MB SIMM (also known as a type 2 SIMM).
Page 132 Bank A Bank B Bank A Bank B Four-way Interleaving Four-way interleaving takes place when the same SIMM type (for example, 16 MB) is installed on corresponding banks across two MC3 boards. Four-way interleaving requires a minimum of 16 SIMMs. The ﬁgure below shows SIMMs installed into corresponding banks A and B on two MC3 boards.
Page 133 1st MC3 Bank A Bank B Bank A Bank B 2nd MC3 Bank A Bank B Bank A Bank B Eight-way Interleaving Eight-way interleaving takes place when the same SIMM type (for example, 16 MB) is installed on corresponding banks across four MC3 boards.
Page 134 1st MC3 Bank A Bank B Bank A Bank B 2nd MC3 Bank A Bank B Bank A Bank B 3rd MC3 Bank A Bank B Bank A Bank B 4th MC3 Bank A Bank B Bank A Bank B 5.15.2 SIMM Leaves and Banks The MC3 board has 32 SIMM sockets organized as follows (see Figure 5-37): •...
Page 135 • four banks per leaf (banks A, C, E, and G on leaf 0 and banks B, D, F, and H on leaf 1) • four SIMMs per bank See Figure 5-37 through Figure 5-41 and the following paragraphs for a breakdown of the memory organization.
Page 136 SIMM SIMM Leaf SIMM SIMM SIMM SIMM SIMM SIMM SIMM SIMM Leaf SIMM SIMM SIMM SIMM SIMM SIMM SIMM SIMM Leaf SIMM SIMM SIMM SIMM SIMM SIMM SIMM SIMM Leaf SIMM SIMM SIMM SIMM SIMM SIMM Figure 5-38 Memory Leaves Organization Note: Each memory board has two leaves, leaf 0 and leaf 1.
Page 137 BANK A BANK C BANK E BANK G BANK B SIMM SIMM BANK D SIMM SIMM BANK F SIMM SIMM BANK H SIMM SIMM BANK A BANK C BANK E BANK G BANK B SIMM SIMM BANK D SIMM SIMM BANK F SIMM SIMM...
Page 138 BANK A SIMM SIMM BANK C BANK E BANK G BANK B BANK D BANK F BANK H BANK A SIMM SIMM BANK C BANK E BANK G BANK B BANK D BANK F BANK H Figure 5-40 SIMM Organization per Bank Note: Each bank has four SIMMs.
Page 139 Figure 5-41 Top View of MC3 Board 5.15.3 SIMM Types The MC3 can use two types of SIMMs: • 16 MB (high-density) • 64 MB (very high-density) Table 5-21 provides additional information for these modules. Figure 5-42 shows an illustration of a SIMM. SGI Field Engineering Template, 1.93 5-55...
Page 140 SIMM Size SIMM Type Color Part Number 16 MB High-density Pink 030-0256-xxx 64 MB Very high-density Purple 030-0257-xxx Table 5-21 CHALLENGE/Onyx System SIMM Information Chart Note: The SIMMs are color coded to distinguish type and size. The color bar appears on the top corner and side of the SIMM nearest the notched bottom.
Page 141 Bank A Bank A Figure 5-43 One-way Interleaving 5.15.4.2 Two-way Interleaving Two-way interleaving occurs across a single MC3 board, as a bank of memory on leaf 0 and links with a bank of memory on leaf 1. Two-way interleaving requires a minimum of eight SIMMs.
Page 142 Bank A Bank B Bank A Bank B Figure 5-44 Two-way Interleaving (Bank 0 on Leaf 0 and Leaf 1 Shown), One Board Note: To set up two-way interleaving, install the same SIMM type (for example, 16 MB) across the same corresponding banks (see Table 5-22) in each leaf. Leaf 0 Leaf 1 Table 5-22...
Page 143 5.15.5 Avoiding Three MC3 Board Conﬁgurations Do not install three MC3 boards into a system because this is an illegal conﬁguration that is not supported by Silicon Graphics. Use only one, two, or four MC3 board conﬁgurations, as applicable to the system.
Page 144 • SIMM problems • CPU power 5.15.6.1 Memory Problems If a memory problem occurs, this could seriously affect the interleave factor for the system. For example, if the system is set up for two-way interleaving and a problem occurs with one of the SIMMs, the system could default to one-way interleaving.
Page 145 Number CPUs Interleave Factor Figure 5-46 Relation between Memory Performance and the Number of CPUs and MC3 Boards Note: The higher the number of CPU boards, the more MC3 boards that a system can effectively support, and the better the overall system memory performance. 5.15.7 Allowable Memory Conﬁgurations This section describes the allowable memory conﬁgurations for the MC3 board.
Page 146 back banks on these boards) cannot be used (see Figure 5-47). Do not populate these banks. Table 5-24 shows the allowable memory conﬁgurations for these boards. Memory SIMM Installation SIMM Installation SIMM Installation SIMM Installation Conﬁguration Location: Location: Two-way Location: Location: One-way Interleaving (1...
Page 147 Do not install SIMMs Do not install SIMMs into these banks. into these banks. Figure 5-47 Unusable Banks for MC3 Boards with P/N 030-0245-007 and Below 5.15.7.2 MC3 Boards with Part Numbers 030-0245-008 and Above MC3 boards with a part number of 030-0245-008 and above contain the updated MA ASIC and will support up to 2 GB of memory.
Page 148 Memory SIMM Installation SIMM Installation SIMM Installation SIMM Installation Conﬁguration Location: Location: Two-way Location: Location: One-way Interleaving (1 Four-way Eight-way Interleaving (1 board) Interleaving (2 Interleaving (4 board) boards) boards) 128 MB This conﬁguration See Figure 5-49. is not shown and is not recommended.
Page 149 64 MB Memory Configuration 1MC3, 1 Leaf SIMM Density High Very High Figure 5-48 64 MB Conﬁguration Note: Install one bank of high-density SIMMS (4 x 16 MB) into bank A. SGI Field Engineering Template, 1.93 5-65...
Page 150 128 MB Memory Configuration 1MC3, 2 Leaves SIMM Density High Very High Figure 5-49 128 MB Conﬁguration Note: Install two banks of high-density SIMMs (8 x 16 MB) into banks A and B. 5-66 Installation...
Page 151 256 MB Memory Configuration 1MC3, 1 Leaf SIMM Density High Very High Figure 5-50 256 MB Conﬁguration Note: Install one bank of very high-density SIMMs (4 x 64 MB) into bank A. SGI Field Engineering Template, 1.93 5-67...
Page 152 256 MB Memory Configuration 1MC3, 2 Leaves Figure 5-51 256 MB Conﬁguration (Two-way Interleaving) Note: Install four banks of high-density SIMMs (16 x 16 MB) into banks A, B, C, and D. 5-68 Installation...
Page 153 256 MB Memory Configuration 2MC3s, 4 Leaves SIMM Density High Very High Figure 5-52 256 MB Conﬁguration (Four-way Interleaving) Note: Install four banks of high-density SIMMs (16 x 16 MB) into banks A and B on two MC3 boards. SGI Field Engineering Template, 1.93 5-69...
Page 154 512 MB Memory Configuration 1MC3, 2 Leaves SIMM Density High Very High Figure 5-53 512 MB Conﬁguration Using Very High-density SIMMs (Two-way Interleaving) Note: Install two banks of very high-density SIMMs (8 x 64 MB) into banks A and B. 5-70 Installation...
Page 155 512 MB Memory Configuration 1MC3, 2 Leaves SIMM Density High Very High Figure 5-54 512 MB Conﬁguration Using High-density SIMMs (Two-way Interleaving) Caution: This conﬁguration is possible only on an MC3 board with a part number of or higher. 030-0245-008 Note: Install eight banks of high-density SIMMS (32 x 16 MB) into banks A, B, C, D, E, F, G, and H on one MC3 board.
Page 156 512 MB Memory Configuration 2MC3s, 4 Leaves SIMM Density High Very High Figure 5-55 512 MB Conﬁguration (Four-way Interleaving, Two MC3 Boards) Note: Install eight banks of high-density SIMMs (32 x 16 MB) into banks A, B, C, and D on two MC3 boards.
Page 157 512 MB Memory Configuration 4MC3s, 8 Leaves SIMM Density High Very High Figure 5-56 512 MB Conﬁguration (Eight-way Interleaving, Four MC3 Boards) Note: Install eight banks of high-density SIMMs (32 x 16 MB) into banks A and B on four MC3 boards.
Page 158 640 MB Memory Configuration 1MC3, 2 Leaves SIMM Density High Very High Figure 5-57 640 MB Conﬁguration (Two-way Interleaving, One MC3 Board) Note: Install two banks of high-density SIMMs (8 x 16 MB) into banks A and B, then install two banks of very high-density SIMMs (8 x 64 MB) into banks C and D. 5-74 Installation...
Page 159 1024 MB Memory Configuration 1MC3, 2 Leaves SIMM Density High Very High Figure 5-58 1024 MB Conﬁguration (Two-way Interleaving, One MC3 Board) Note: Install four banks of very high-density SIMMs (16 x 64 MB) into banks A, B, C, and D. SGI Field Engineering Template, 1.93 5-75...
Page 160 1024 MB Memory Configuration 2MC3s, 4 Leaves SIMM Density High Very High Figure 5-59 1024 MB Conﬁguration Using Very High-density SIMMs (Four-way Interleaving, Two MC3 Boards) Note: Install four banks of very high-density SIMMs (16x 64 MB) into banks A and B on two MC3 boards.
Page 161 1024 MB Memory Configuration 2MC3s, 4 Leaves SIMM Density High Very High Figure 5-60 1024 MB Conﬁguration Using High-density SIMMs (Four-way Interleaving, Two MC3 Boards) Caution: This conﬁguration is possible only on an MC3 board with a part number of or higher.
Page 162 1024 MB Memory Configuration 4MC3s, 8 Leaves SIMM Density High Very High Figure 5-61 1024 MB Conﬁguration (Eight-way Interleaving, Four MC3 Boards) Note: Install 14 banks of high-density SIMMs (64 x 16 MB) into banks A,B, C, and D on four MC3 boards.
Page 163 1280 MB Memory Configuration 2MC3s, 4 Leaves SIMM Density High Very High Figure 5-62 1280 MB Conﬁguration (Four-way Interleaving, Two MC3 Boards) Caution: This conﬁguration is possible only on an MC3 board with a part number of or higher. 030-0245-008 Note: Install four banks of very high-density SIMMs (16 x 64 MB) into banks A and B and four banks of high-density SIMMs (16 x 16 MB) into banks C and D on two MC3 boards.
Page 164 2048 MB Memory Configuration 2MC3s, 4 Leaves SIMM Density High Very High Figure 5-63 2048 MB Conﬁguration (Four-way Interleaving, Two MC3 Boards) Caution: This conﬁguration is possible only on an MC3 board with a part number of or higher. 030-0245-008 Note: Install eight banks of very high-density SIMMS (32 x 64 MB) into banks A, B, C, and D on two MC3 boards.
Page 165 2048 MB Memory Configuration 4MC3s, 8 Leaves SIMM Density High Very High Figure 5-64 2048 MB Conﬁguration (Eight-way Interleaving, Four MC3 Boards) Caution: This conﬁguration is possible only on an MC3 board with a part number of or higher. 030-0245-008 Note: Install 16 banks of high-density SIMMS (64 x 16 MB) into banks A, B, C, D, E, F, G, and H on two MC3 boards.
Page 166 5.15.8 Memory Upgrades See Appendix C, “Memory Upgrade Conﬁgurations,” for a description of all the available memory upgrades. 5.15.9 Installing SIMMs Use the following instructions and Figure 5-65 to install SIMMs on the MC3 board. Review Section 5.15.7, “Allowable Memory Conﬁgurations,” before you begin. MC3 boards with P/N 030-0245-007 and below support only up to 1 GB of Caution: memory.
Page 167 5.15.10Removing SIMMs Use the SIMM extraction tool (see Figure 5-66) to remove SIMMs from the MC3 board. Observe proper ESD practices (such as using a ground strap and an antistatic Caution: mat) when installing SIMMs. 1. Place the extraction tool over the SIMM ejector tab as shown in Figure 5-66. 2.
Page 168 This equipment uses electrical power internally that is hazardous if the equipment is improperly disassembled. The procedures in this manual require speciﬁc training and technical knowledge and are for use only by Silicon Graphics system support engineers or other Silicon Graphics-trained personnel. Caution: This equipment is extremely sensitive and susceptible to damage by electrostatic discharge (ESD).
Page 169 Top hat Top panel Side panel assembly Sheet metal cover Rear Panel Side panel assembly Front door Bumper Drive door Figure 5-67 CHALLENGE/Onyx Deskside System Plastic Doors and Panels 5.16.2 Powering Down the System Use these procedures to power down the system: 1.
Page 170 Circuit Breaker Figure 5-68 Powering Down the System 5.16.3 Opening the Chassis Front Door Use these procedures to open the front door: 1. Open the drive door to expose the drives and front panel retainer latches. 2. Release the two retainer latches by fully depressing and releasing each latch with a pointed object, such as a screwdriver.
Page 171 Releasing the Retainer Latches Opening Door at 90° to Chassis 90° Figure 5-69 Opening the Front Door 5.16.4 Replacing the Front Door Use these procedures to replace the front door: 1. Open the front door, as described in Section 5.16.3. 2.
Page 172 Figure 5-70 Removing the Front Door 5.16.5 Opening the I/O Door Follow these procedures to open the I/O door: 1. Power down the system, as described in Section 5.16.2, “Powering Down the System.” 2. Open the chassis front door until it is perpendicular to its normal, closed position, as shown in Figure 5-69 (the chassis front must be in this position for the I/O door to open completely).
Page 173 5. Release the I/O door by removing the three screws on the door’s upper edge, as shown in Figure 5-71. 6. Lower the I/O door. Figure 5-71 Opening the I/O Door SGI Field Engineering Template, 1.93...
Page 174 5.16.6 Replacing the I/O Door To remove the I/O door (P/N 013-0409-xxx), see Figure 5-72 and follow these steps: 1. Open the front door, as described in Section 5.16.3. 2. Open the I/O door, as described in Section 5.16.5, “Opening the I/O Door.” 3.
Page 175 Figure 5-73 Removing the Rear Sheet-metal Cover 5.16.8 Removing the Side Panels To remove the side panels (013-0343-xxx), see Figure 5-74 and follow these steps: 1. Grasp the bottom edge of the panel. 2. Pull the panel away from the chassis until the ball and socket fasteners release. 3.
Page 176 Figure 5-74 Removing the Side Panels 5.16.9 Replacing the Top Hat Follow these procedures to replace the top hat (P/N 050-0006-xxx): 1. Gently pry up the top hat with a ﬂat-bladed screwdriver. 2. Lift the front edge of the top hat until it clears the top panel (see Figure 5-75). 3.
Page 177 Figure 5-75 Replacing the Top Hat 5.16.10Replacing the Top Panel To replace the top panel (P/N 050-0007-xxx), see Figure 5-76 and follow these procedures: 1. Remove the right side panel, as described in Section 5.16.8, “Removing the Side Panels.” 2. Locate the hidden catch plate centered along the right side of the top panel. 3.
Page 178 5. To install the top panel, check that the hidden catch is bent slightly upward. Align the plastic ﬁngers of the top panel with their corresponding slots and slide the panel right; the hidden catch plate engages automatically. Figure 5-76 Replacing the Top Panel 5.16.11Label Placement Figure 5-77 illustrates how to change the top hat label.
Page 179 Figure 5-77 Top Hat Label Placement 5.17 Speciﬁc Procedures The following section provides instructions for replacing the ﬁeld-replaceable units (FRUs). To replace an FRU, ﬁrst use Figure 5-78 to identify the appropriate unit and its position in the chassis. Then proceed to the appropriate section and perform the steps. SGI Field Engineering Template, 1.93 5-13...
Page 180 Backplane P/N 013-0314-xxx (server) P/N 013-0310-xxx (graphics) Upper card guide shelf P/N 013-0388-xxx Status panel assembly Power supply P/N 041-0025-xxx assembly P/N 013-0513-xxx Blower module P/N 013-0500-xxx Lower card guide shelf AC power receptacle P/N 013-0387-xxx P/N 013-0515-xxx PTA/RS232 Option Drive shelf P/N 013-0364-xxx Front loading...
Page 181 5.17.1 Replacing the Status Panel To replace the status panel (P/N 041-0025-xxx), perform the following: 1. Power down the system, as described in Section 5.16.2. 2. Open the front door, as described in Section 5.16.3. 3. Remove the screw from the left side of the system controller. 4.
Page 182 Ribbon Cable System Controller Tab Slots Tabs Figure 5-79 Replacing the Status Panel 5.17.2 Replacing the Backplane To remove the backplane, see Figure 5-80 and follow these steps. Installation...
Page 183 Note: The backplane part number for a server system is 030-0314-xxx. The backplane part number for a graphics system is 030-0310-xxx. 1. Power down the system, as described in Section 5.16.2. 2. Open the front door, as described in Section 5.16.3. 3.
Page 184 Baffle Exhaust Divider Status Panel Connector Figure 5-80 Removing the Backplane 5.17.3 Replacing the Ofﬂine Switcher (OLS) Power Supply Use these procedures to replace the OLS (P/N 013-0513-xxx): Installation...
Page 185 Note: The OLS is an autoranging power supply that works for both 110 and 220 VAC operation. 1. Power down the system, as described in Section 5.16.2. 2. Remove the rear plastic panel and sheet-metal cover, as described in Section 5.16.7. 3.
Page 186 Use these procedures to replace the power connector assembly: 1. Power down the system, as described in Section 5.16.2, and remove the power cord. 2. Remove the back plastic panel and sheet-metal cover, as described in Section 5.16.7. 3. Disconnect the AC hot, neutral, and earth ground wires from the power supply. 4.
Page 187 Toroid Assembly Figure 5-82 Replacing the Power Connector Assembly 5.17.5 Replacing a System Board The Everest bus (Ebus) boards (IP19, MC3, and IO4) use 560-pin Futurebus+ Metral connectors that require some force to engage the pins and sockets. Use care when installing these boards because the connector pins can bend.
Page 188 Before installing a new board, check for ribbon cables to the immediate left of Caution: the slot receiving the new board. Disconnect or secure these cables before inserting the new board; otherwise, the cables of the adjacent board may be chafed and damaged by the pins of the new board.
Page 189 Loosen screws Card guide braces Figure 5-83 Removing the Board Brace Follow these instructions to replace an option board: 1. Power down the system, as described in Section 5.16.2. 2. Open the front door, as described in Section 5.16.3. 3. Open the I/O door, as described in Section 5.16.5. SGI Field Engineering Template, 1.93...
Page 190 Backplane Upper Card Guide Lower Card Guide Figure 5-84 Installing/Removing a Board 4. Remove the two board 5. braces (013-0578-xxx) that secure the top and bottom of the system boards by loosening the Phillips screw and moving the slide bar to the right. You can then pull out the braces (see Figure 5-83).
Page 191 5.17.7 Skipping a VME Slot Skipping a slot is occasionally required to ﬁt oversized VME boards or improve air ﬂow. A slot can be skipped if jumper blocks are placed on the appropriate VME jumper block pins located on the rear of the backplane (see Figure 5-85). Note: If you install the VME boards in order (from left to right), then no jumpering is required.
Page 192 To skip first VME slot: Jumpers Slot 1 installed jumpers Slot 2 present To skip first and second VME slots: Jumpers Jumpers Slot 1 installed Jumpers Slot 2 installed Figure 5-85 VME Slot Jumper Locations 5-12 Installation...
Page 193 5.17.8 Replacing a Mezzanine Board The optional SCSI and FDDI mezzanine boards attach to the IO4 baseboard through four standoffs. An IO4 board can house up to two mezzanine boards. Follow these procedures to install or remove a mezzanine board: 1.
Page 194 5.17.9 Installing the VCAM Board The VCAM (VME channel adapter module) board mounts on the rear of the IO4 baseboard and comes standard with every CHALLENGE or Onyx system. Follow these instructions to install or remove a VCAM board: 1. Orient the VCAM board so that the backplane connectors face the rear. 2.
Page 195 3. Grasp the applicable power board, then use two hands to pull the board straight out. Note: For power board locations, see Chapter 2, “Chassis Tour.” Figure 5-88 Installing a Power Board 5.17.11Upgrading the PROM on the System Controller Board This section describes how to upgrade the PROM in the System Controller board in the CHALLENGE/Onyx system, if applicble.
Page 196 • deskside chassis (CHALLENGE/Onyx L) start-up display errors Note: For a complete list of reporting error problems, see the associated software release notes. This upgrade applies to the following versions of the System Controller board: • 030-0265-005 and below • 030-0380-002 and below Note: Despite the two different part numbers, these boards are interchangeable in the ﬁeld.
Page 197 Controller Board Notch Figure 5-89 System Controller PROM Location (Onyx Deskside Backplane Shown) 5.17.12Replacing a Drive in the CHALLENGE/Onyx Deskside Chassis The CHALLENGE/Onyx deskside system provides seven half-height drive bays or up to three full-height bays. See the Peripherals Reference Guide (Document Number 108-7027-xxx) for important information concerning system limits and drive conﬁguration before continuing with this section.
Page 198 The CHALLENGE/Onyx deskside system does not use the previous front-loading drive mounts of earlier Silicon Graphic systems, such as the Single Tower or Crimson. The drives now sit on a drive sled that mounts on a drive shelf in the chassis (see Figure 5-90). To install a SCSI drive on a drive sled 1.
Page 199 5.17.12.2 Converting Old-style Front-loading Drives If you need to convert an existing old-style front-loading drive, see Figure 5-91 and follow these steps: 1. Place the drive to be converted on top of an antistatic surface. 2. Remove the side bracket on each side of the drive by removing four screws (total); see Figure 5-91.
Page 200 Remove Power Connector Remove Data Connector Remove Side Brackets Remove Pull Strap EMI Shield Drive Sled Figure 5-91 Modifying an Old Front-loading Drive 5-20 Installation...
Page 201 5.17.13Removing or Replacing the Drive Shelf To convert a half-height slot to a full-height slot or vice versa, you must either remove or add a drive shelf. To remove a drive shelf, 1. Power down the system, as described in Section 5.16.2. 2.
Page 202 Drive Shelf SCSI Backplane Drive Shelf Retaining Screw Filler Plate Figure 5-92 Replacing a Drive Shelf 5.17.14Replacing the Drive Bulkhead Assembly Use these procedures to replace the drive bulkhead assembly (P/N 013-0510-xxx): 1. Power down the system, as described in Section 5.16.2. 2.
Page 203 With the cover off, you can now see the bulkhead assembly. Before you Caution: start pulling out cables, note the SCSI cable connectors A and B on the bottom of the SCSI backplane (see Figure 5-92). Be sure to label these cables (SCSI A and SCSI B) to ease reinstallation.
Page 204 SCSI Backplane SCSI Backplane Access Cover Plate Figure 5-93 Removing the SCSI Backplane Access Cover Plate 5-24 Installation...
Page 205 Displace chassis power assembly; SCSI backplane move toward OLS to make room for backplane. Disconnect Disconnect Rotate backplane SCSI cables. SCSI power and and remove through fan connectors. access port. Figure 5-94 Removing the Bulkhead Assembly SGI Field Engineering Template, 1.93 5-25...
Page 206 Figure 5-95 Replacing the Drive Bulkhead 5-26 Installation...
Page 207 5.17.15Replacing the Blower Module To remove the blower module (P/N 013-0500-xxx), 1. Power down the system, as described in Section 5.16.2. 2. Remove the left side panel (the side opposite the drives). See Section 5.16.8. 3. Maker sure that the fans have stopped spinning then remove the three screws that secure the blower module to the sheet-metal housing (see Figure 5-96).
Page 208 5-28 Installation...
Page 209 Appendix A System Speciﬁcations This appendix lists the speciﬁcations for the CHALLENGE/Onyx deskside system (see Table A-1). Parameter Speciﬁcations Dimensions (height x 26” x 21” x 29“ (66 cm x 54 cm x 74 cm) width x depth) Weight Minimum 195 lbs (88.45 Kg) Maximum 300 lbs (112 Kg)
Page 210 Parameter Speciﬁcations Environmental Operating 5 to 35 degrees C at sea level Nonoperating -20 to +60 degrees C at sea level Heat dissipation Chassis 8160 BTU/hour max. Monitor 512 BTU/hour Relative humidity 10 to 80%, noncondensing (operating) 10 to 95%, noncondensing (nonoperating) Noise (acoustics) 57 dBA Processor...
Page 211 Parameter Speciﬁcations Communication ports Up to four serial ports, one parallel port, one Ethernet port, one AUI Ethernet port, one set of internal, and external system (graphics system) interrupt jacks. compatible Parallel 25-pin Centronics VME64 controllers Ethernet, FDDI, SCSI I/O system I/O bus type VME64 bus No.
Page 212 System Specifications...
Page 213 Appendix B Cabling Local and Peripheral Devices This chapter describes the signal connectors and cables for local and peripheral devices used with Challenge/Onyx systems. Connector Panels Standard device cabling is supported by one I/O board and its related connectors on a common I/O panel.
Page 214 Frame CMPST S−VIDEO Genlock Alpha Grab Swap CMPST S−VIDEO Genlock Monitor Sync Ready Video Panel I/O Panel 0 1 0 1 2 3 tty4 tty3 tty2 tty1 Ethernet Interrupts Keyboard/ Powered Mouse Parallel Peripheral Figure B-1 Challenge/Onyx System Main and Video Connector Panels Description Signal Flow (from chassis)
Page 215 Description Signal Flow (from chassis) Busy PE: Paper Empty SLCT: Select/Online AUTOFD ERROR INIT (reset) SLCTIN 18-25 Table B-1 Parallel Port Figure B-2 Parallel Port Description Signal Flow (from chassis) Ethernet port. See Figure B-3. Logic GND 15-pin AUI (attachment unit interface) according to IEEE 802.3 speciﬁcation.
Page 216 Description Signal Flow (from chassis) TXD– two-way Logic GND RXD– two-way Power (+12V) output Logic GND Table B-2 Ethernet Port Figure B-3 Ethernet Port Description Signal Flow (from chassis) Serial port tty_1. See Figure B-4. 9-pin D-sub receptacle. RS-232 protocol. output input output...
Page 217 Figure B-4 Serial Port tty_1 Description Signal Flow (from chassis) Serial ports tty_2, tty_3 for unpowered not used peripherals. See Figure B-5. 9-pin D-sub receptacle. RS-232 protocol. Serial ports tty_2 and tty_3 provide a choice of 9-pin D-sub or an 8-pin DIN receptacle. (See below.) Only one receptacle from each port can be used at a given time.
Page 218 Description Signal Flow (from chassis) Serials ports tty_2, tty_3 for powered output peripherals. See Figure B-6. 8-pin DIN receptacle. input Stereo Sync output input output Power +10V output Table B-5 Serials Ports tty_2, tty_3 for Powered Peripherals Serials Ports tty_2, tty_3 for Powered Peripherals Figure B-6 Description Signal...
Page 219 a. Pins 2 and 7 must be twisted pair in cable. b. Pins 3 and 8 must be twisted pair in cable c. Pins 2 and 7 must be twisted pair in cable. d. Pins 3 and 8 must be twisted pair in cable Figure B-7 Serial Port tty_4 RS-422 Protocol Description...
Page 220 Figure B-9 System Interrupt OUT Description Signal Flow (from chassis) Keyboard/mouse port. See Figure B-10. KBD_RXD input 6-pin receptacle MOUSE_RXD input SIG GND Power +12V output KBD_TXD output Keyboard/Mouse Port Table B-9 Figure B-10 Keyboard/Mouse Port Description Signal Flow (from chassis) Swap Ready port.
Page 221 Figure B-11 Swap Ready Port Description Signal Flow (from chassis) Frame Grab port. See Figure B-12. center FRAME_GRAB input shield Chassis GND BNC receptacle. Impedance 75 ohms. Table B-11 Frame Grab Port Figure B-12 Frame Grab Port Description Signal Flow (from chassis) Composite video ports A, B.
Page 222 Description Signal Flow (from chassis) S-VIDEO ports A, B. See Figure B-14. LUMOND output 4-pin receptacle. NTSC or PAL-compatible. CHRMOND output output CHRM output Table B-13 S-VIDEO Ports A, B Figure B-14 S-VIDEO Ports A, B Description Signal Flow (from chassis) Monitor port.
Page 223 a. On some cables these signals are NC 5 A2 Figure B-15 Monitor Port (13W3 Receptacle) Description Signal Flow (from chassis) Alpha port. See Figure B-16. center Alpha output BNC receptacle. Impedance 75 ohms. shield Chassis GND Table B-15 Alpha Port Figure B-16 Alpha Port Description Signal...
Page 224 Figure B-17 Sync Port Description Signal Flow (from chassis) Genlock IN, Genlock OUT. See Figure B-18. center Genlock two-way loop-through BNC receptacle. Impedance 75 ohms. shield Chassis GND Table B-17 Genlock IN, Genlock OUT Figure B-18 Genlock IN, Genlock OUT Signal Name Pin Number Pin Number...
Page 225 Signal Name Pin Number Pin Number Signal Name -DB(5) -DB(6) -DB(7) -DB(P) TERMPWR TERMPWR TERMPWR TERMPWR Reserved Reserved -ATN -BSY -ACK -RST -MSG -SEL -C/D -REQ -I/O -DB(8) -DB(9) -DB(10) -DB(11) Table B-18 68-pin, Single-ended, High-density SCSI Pinouts (See Figure B-19.) SGI Field Engineering Template, 1.93 B-13...
Page 226 68−pin connector on I/O panel Figure B-19 68-pin Connector on I/O Panel Note: Read the following information regarding the SCSI signal pinouts. A hyphen preceding a signal name indicates that the signal is active low. 8-bit devices that connect to the P-cable leave these signals open: -DB(8), -DB(9), -DB(10), -DB(11), -DB(12), -DB(13), -DB(14), -DB(15), -DB(P1).
Page 227 Signal Name Pin Number Pin Number Signal Name TERMPWR TERMPWR TERMPWR TERMPWR Reserved Reserved +ATN -ATN +BSY -BSY +ACK -ACK +RST -RST +MSG -MSG +SEL -SEL +C/D -C/D +REQ -REQ +I/O -I/O +DB(8) -DB(8) +DB(9) -DB(9) +DB(10) -DB(10) +DB(11) -DB(11) Table B-19 68-pin, Differential, High-density SCSI Pinouts (See Figure B-20.) 68−pin connector on I/O panel Figure B-20 68-pin Connector on I/O Panel...
Page 228 -DB(14), -DB(15), -DB(P1), -DB(8), -DB(9), -DB(10), -DB(11), +DB(12), +DB(13), +DB(14), +DB(15), +DB(P1), +DB(8), +DB(9), +DB(10), and +DB(11). All other signals are connected as shown in this table. Signal Name Pin Number Pin Number Signal Name -DB(0) -DB(1) -DB(2) -DB(3) -DB(4) -DB(5) -DB(6) -DB(7)
Page 229 50−pin connector on I/O panel for older−style systems Figure B-21 50-pin Connector on I/O Panel for Older-style Systems Note: Read the following information regarding the SCSI signal pinouts. A hyphen preceding a signal name indicates that the signal is active low. The signal labeled “Reserved”...
Page 230 Signal Name Pin Number Pin Number Signal Name Reserved Reserved TERMPWR TERMPWR Reserved Reserved +ATN -ATN +BSY -BSY +ACK -ACK +RST -RST +MSG -MSG +SEL -SEL +C/D -C/D +REQ -REQ +I/O -I/O Table B-21 50-pin, Differential, High-density SCSI Pinouts (See Figure B-22.) 50−pin connector on I/O panel for older−style systems Figure B-22 50-pin Connector on I/O Panel for Older-style Systems...
Page 231 CHALLENGE/Onyx system. It is listed here for reference only. 68-pin to 50-pin SCSI Converter Cables Table B-22 lists the different 68-pin to 50-pin SCSI converter cables available through Silicon Graphics. Figure B-23 illustrates the connectors for these cables. Cable Part Number Cable Type...
Page 232 (POSITION 26) (POSITION 1) (PIN 1) (PIN 35) DB(0) DB(0) DB(1) DB(1) DB(2) DB(2) DB(3) DB(3) DB(4) DB(4) DB(5) DB(5) DB(6) DB(6) DB(7) DB(7) DB(P) DB(P) TERM PWR TERM PWR RESERVED RESERVED RESERVED RESERVED Figure B-23 3-foot and 15-foot Single-ended SCSI Cable and 50-foot Differential Swizzle SCSI Cable B-20 Cabling Local and Peripheral Devices...
Page 233 Monitor Cables This section identiﬁes the monitor cables provided by Silicon Graphics. See Table B-23 for a summary of monitor cables and Table B-24 through Table B-29 for speciﬁc details of each cable. Description Length Connectors Part Number Extension cable 15’...
Page 234 Part Number Description 018-0286-001 Monitor extension cable, round, 15’ length, shielded, 13W3 hybrid plug at chassis end, 3 BNC plugs (RGB) at monitor end. See Figure B-25. Table B-25 Monitor Extension Cable, Round, 15’ Length, Shielded, 13W3 Hybrid Plug at Chassis End, 3 BNC Plugs (RGB) at Monitor End Figure B-25 Monitor Extension Cable, Round, 15’...
Page 235 Part Number Description 018-0343-001 Monitor adapter cable, round, 1’ length, shielded, 13W3 hybrid receptacle at one end, 3 BNC plugs (RGB) at other end. See Figure B-27. Table B-27 Monitor Adapter Cable, Round, 1’ Length, Shielded, 13W3 Hybrid Receptacle at One End, 3 BNC Plugs (RGB) at Other End Figure B-27 Monitor Adapter Cable, Round, 1’...
Page 236 Part Number Description 018-0275-003 Monitor extension cable, round, 75’ length, shielded, 3 BNC plugs (RGB) at both ends. See Figure B-29. Table B-29 Monitor Extension Cable, Round, 75’ Length, Shielded, 3 BNC Plugs (RGB) at Both Ends Figure B-29 Monitor Extension Cable, Round, 75’ Length, Shielded, 3 BNC Plugs (RGB) at Both Ends Input Device Cables The main keyboard (and mouse) connects to a dedicated port using a standard 30-foot...
Page 237 Part Number Description 081-0075-001 Keyboard/mouse extension cable, round, 75’ length, shielded, 6-pin circular mini-DIN plugs at both ends. See Figure B-31. Table B-31 Keyboard/Mouse Extension Cable, Round, 75’ Length, Shielded, 6-pin Circular Mini-DIN Plugs at Both Ends Figure B-31 Keyboard/Mouse Extension Cable, Round, 75’ Length, Shielded, 6-pin Circular Mini-DIN Plugs at Both Ends All other input devices connect to the chassis using serial ports.
Page 238 Modem Cables To attach a modem to the system, connect a modem or null modem cable to one of the 9-pin serial connectors located on the I/O panel. If a 9-pin to 25-pin adapter is used, the adapter must be placed at the modem, and a cable with a 9-pin plug must be connected to the I/O panel.
Page 239 Appendix C Memory Upgrade Conﬁgurations Table C-1 and Figure C-1 through Figure C-46 describe the SIMM upgrades required to install additional memory to an existing conﬁguration. Starting 128 MB 256 MB 512 MB 640 MB 1024 MB 1280 MB 2048 MB Memory Size 64 MB For Two-way...
Page 240 Starting 128 MB 256 MB 512 MB 640 MB 1024 MB 1280 MB 2048 MB Memory Size 256 MB From 256 MB From 256 MB From 256 MB From 256 MB (Two-way) to Figure C-22. (One-way) to (One-way) to (Two-way) to 1024 MB 1280 MB, see 2048 MB...
Page 241 Starting 128 MB 256 MB 512 MB 640 MB 1024 MB 1280 MB 2048 MB Memory Size 640 MB Figure C-39. Figure C-40. Figure C-41. 1024 MB From 1024 Figure C-42. (Two-way to 2048 MB (Four-way), Figure C-43. From 1024 (Four-way) to 2048 MB (Four-way),...
Page 242 64 MB 128 MB SIMM Density High Very High Figure C-1 64 MB to 128 MB (Two-way Interleaving) Note: Add 64 MB using one bank of high-density SIMMs (4 x 16 MB) into bank B. Memory Upgrade Configurations...
Page 243 64 MB 256 MB (2-way Interleaving) SIMM Density High Very High Figure C-2 64 MB to 256 MB (Two-way Interleaving) Note: Add 192 MB using three banks of high-density SIMMs (12 x 16 MB) into banks B, C, and D. SGI Field Engineering Template, 1.93...
Page 244 256 MB (4-way Interleaving) 64 MB SIMM Density High Very High Figure C-3 64 MB to 256 MB (Four-way Interleaving) Note: Add 192 MB using three banks of high-density SIMMs (12 x 16 MB) into banks A and B on two MC3 boards. Memory Upgrade Configurations...
Page 245 512 MB (4-way Interleaving) 64 MB SIMM Density High Very High 64 MB to 512 MB (Four-way Interleaving) Figure C-4 Note: Add 448 MB using seven banks of high-density SIMMs (28 x 16 MB) into banks A, B, C, and D on two MC3 boards. SGI Field Engineering Template, 1.93...
Page 246 64 MB SIMM Density High Very High 512 MB (8-way Interleaving) Figure C-5 64 MB to 512 MB (Eight-way Interleaving) Note: Add 448 MB using seven banks of high-density SIMMs (28 x 16 MB) into banks A and B on four MC3 boards. Memory Upgrade Configurations...
Page 247 64 MB 640 MB (2-way Interleaving) SIMM Density High Very High 64 MB to 640 MB (Two-way Interleaving) Figure C-6 Note: Add 576 MB using one bank of high-density SIMMs (4 x 16 MB) into banks A and B and two banks of very high-density SIMMS (8 x 64 MB) into banks C and D. SGI Field Engineering Template, 1.93...
Page 248 64 MB SIMM Density High Very High 1024 MB (8-way Interleaving) Figure C-7 64 MB to 1024 MB (Eight-way Interleaving) Note: Add 960 MB using 15 banks of high-density SIMMs (60 x 16 MB) into banks A, B, C, and D on four MC3 boards. C-10 Memory Upgrade Configurations...
Page 249 1280 MB (4−way Interleaving) 64 MB SIMM Density High Very High Figure C-8 64 MB to 1280 MB (Four-way Interleaving) Caution: This conﬁguration is possible only on an MC3 board with a part number of 030-0245-008 or higher. Note: Add 1216 MB using three banks of high-density SIMMs (12 x 16 MB) into bank B of the ﬁrst MC3 board and into banks A and B on the second MC3 board.
Page 250 64 MB SIMM Density High Very High 2048 MB (8−way Interleaving) Figure C-9 64MB to 2048 MB (Eight-way Interleaving) Caution: This conﬁguration is possible only on an MC3 board with a part number of 030-0245-008 or higher. Note: Add 1984 MB using 31 banks of high-density SIMMs (124 x 16 MB) into banks A, B, C, D, E, F, G, and H on four MC3 boards.
Page 251 128 MB 256 MB (2-way Interleaving) SIMM Density High Very High Figure C-10 128 MB to 256 MB (Two-way Interleaving) Note: Add 128 MB using two banks of high-density SIMMs (8 x 16 MB) into banks C and D. SGI Field Engineering Template, 1.93 C-13...
Page 252 256 MB (4-way Interleaving) 128 MB SIMM Density High Very High Figure C-11 128 MB (Two-way Interleaving) to 256 MB (Four-way Interleaving) Note: Add 128 MB using two banks of high-density SIMMs (8 x 16 MB) into banks A and B on a second MC3 board.
Page 253 512 MB (4-way Interleaving) 128 MB SIMM Density High Very High Figure C-12 128 MB (Two-way Interleaving) to 512 MB (Four-way Interleaving) Note: Add 384 MB using six banks of high-density SIMMs (24 x 16 MB) into banks A, B, C, and D on two MC3 boards.
Page 254 128 MB SIMM Density High Very High 512 MB (8−way Interleaving) Figure C-13 128 MB (Two-way Interleaving) to 512 MB (Eight-way Interleaving) Note: Add 384 MB using six banks of high-density SIMMs (24 x 16 MB) into banks A, B, C, and D on three more MC3 boards.
Page 255 128 MB 640 MB (2−way Interleaving) SIMM Density High Very High Figure C-14 128 MB to 640 MB (Two-way Interleaving) Note: Add 512 MB using two banks of very high-density SIMMS (8 x 64 MB) into banks C and D. SGI Field Engineering Template, 1.93 C-17...
Page 256 128 MB SIMM Density High Very High 1024 MB (8-way Interleaving) Figure C-15 128 MB to 1024 MB (Eight-way Interleaving) Note: Add 896 MB using 14 banks of high-density SIMMs (56 x 16 MB) into banks A, B, C, and D on four MC3 boards. C-18 Memory Upgrade Configurations...
Page 257 1280 MB (4−way Interleaving) 128 MB SIMM Density High Very High Figure C-16 128 MB to 1280 MB (Four-way Interleaving) Caution: This conﬁguration is possible only on an MC3 board with a part number of 030-0245-008 or higher. Note: Add 1152 MB using two banks of high-density SIMMs (8 x 16 MB) into banks A and B on a second MC3 board.
Page 258 128 MB SIMM Density High Very High 2048 MB (8−way Interleaving) Figure C-17 128 MB to 2048 MB (Eight-way Interleaving) Caution: This conﬁguration is possible only on an MC3 board with a part number of 030-0245-008 or higher. Note: Add 1920 MB using 30 banks of high-density SIMMs (120 x 16 MB) into all the banks (A through H) on four MC3 boards.
Page 259 512 MB 256 MB (2−way Interleaving) (2−way Interleaving) SIMM Density High Very High Figure C-18 256 MB (Two-way Interleaving) to 512 MB (Two-way Interleaving) Caution: This conﬁguration is possible only on an MC3 board with a part number of 030-0245-008 or higher. Note: Add 256 MB using four banks of high-density SIMMs (16 x 16 MB) into the remaining banks (E,F, G, and H) on the MC3 board.
Page 260 256 MB 512 MB (1-way Interleaving) (2-way Interleaving) SIMM Density High Very High Figure C-19 256 MB (One-way Interleaving) to 512 MB (Two-way Interleaving) Note: Add 256 MB using one bank of very high-density SIMMs (4 x 64 MB) into bank B. C-22 Memory Upgrade Configurations...
Page 261 512 MB (4-way Interleaving) 256 MB (2-way Interleaving) SIMM Density High Very High Figure C-20 256 MB (Two-way Interleaving) to 512 MB (Four-way Interleaving) Note: Add 256 MB using four banks of high-density SIMMs (16 x 16 MB) into banks A and B on a second MC3 board.
Page 262 256 MB (4−way Interleaving) 512 MB (4−way Interleaving) SIMM Density High Very High Figure C-21 256 MB (Four-way Interleaving) to 512 MB (Four-way Interleaving) Note: Add 256 MB using four banks of high-density SIMMs (16 x 16 MB) into banks C and D on two MC3 boards.
Page 263 256 MB 640 MB (1-way Interleaving) (2-way Interleaving) SIMM Density High Very High Figure C-22 256 MB (One-way Interleaving) to 640 MB (Two-way Interleaving) Note: Add 384 MB using one bank of very high-density SIMMS (4 x 64 MB) into bank B and two banks of high-density SIMMs (8 x 16 MB) into banks C and D.
Page 264 256 MB 1024 MB (1-way Interleaving) (2-way Interleaving) SIMM Density High Very High Figure C-23 256 MB (One-way Interleaving) to 1024 MB (Two-way Interleaving) Note: Add 768 MB using three banks of very high-density SIMMS (12 x 64 MB) into banks B, C, and D.
Page 265 256 MB (2-way Interleaving) SIMM Density High Very High 1024 MB (8-way Interleaving) Figure C-24 256 MB (Two-way Interleaving) to 1024 MB (Eight-way Interleaving) Note: Add 768 MB using 12 banks of high-density SIMMS (48 x 16 MB) into banks A, B, C, and D on three additional MC3 boards.
Page 266 256 MB (4-way Interleaving) SIMM Density High Very High 1024 MB (8-way Interleaving) Figure C-25 256 MB (Four-way Interleaving) to 1024 MB (Eight-way Interleaving) Note: Add 768 MB using 12 banks of high-density SIMMS (48 x 16 MB) into banks A, B, C, and D on two additional MC3 boards.
Page 267 1280 MB (4-way Interleaving) 256 MB (1-way Interleaving) SIMM Density High Very High Figure C-26 256 MB (One-way Interleaving) to 1280 MB (Four-way Interleaving) Caution: This conﬁguration is possible only on an MC3 board with a part number of 030-0245-008 or higher. Note: Add 256 MB using four banks of high-density SIMMS (16 x 16 MB) into banks C and D on two MC3 boards.
Page 268 1280 MB (4−way Interleaving) 256 MB (2−way Interleaving) SIMM Density High Very High Figure C-27 256 MB (Two-way Interleaving) to 1280 MB (Four-way Interleaving) Caution: This conﬁguration is possible only on an MC3 board with a part number of 030-0245-008 or higher. Note: Remove 128 MB of high-density SIMMs from banks A and B (8 x 16 MB) of the ﬁrst MC3 board, and add them to Banks C and D on the second MC3 board.
Page 269 256 MB (4−way Interleaving SIMM Density High Very High 1280 MB (4−way Interleaving) Figure C-28 256 MB (Four-way Interleaving to 1280 MB (Four-way Interleaving) Caution: This conﬁguration is possible only on an MC3 board with a part number of 030-0245-008 or higher. Note: Add 1024 MB using four banks of very high-density SIMMs (16 x 64 MB) into banks C and D of both MC3 boards.
Page 270 256 MB (2−way Interleaving) SIMM Density High Very High 2048 MB (8−way Interleaving) Figure C-29 256 MB (Two-way Interleaving) to 2048 MB (Eight-way Interleaving) Caution: This conﬁguration is possible only on an MC3 board with a part number of 030-0245-008 or higher. Note: Add 1792 MB of high-density SIMMS into all the available SIMM slots on 4 MC3 boards by adding 256 MB using four banks of high-density SIMMS (16 x 16 MB) into banks E, F, G, and H and the ﬁrst MC3 board.
Page 271 256 MB (4−way Interleaving) SIMM Density High Very High 2048 MB (8−way Interleaving) Figure C-30 256 MB (Four-way Interleaving) to 2048 MB (Eight-way Interleaving) This conﬁguration is possible only on an MC3 board with a part number of Caution: 030-0245-008 or higher. Note: Add 1792 MB of high-density SIMMS into all the available SIMM slots on four MC3 boards by adding 768 MB using 12 banks of high-density SIMMS (48 x 16 MB) into banks C, D, E, F, G, and H on the ﬁrst two MC3 boards.
Page 272 512 MB 640 MB (2−way Interleaving) (2−way Interleaving) SIMM Density High Very High Figure C-31 512 MB (Two-way Interleaving) to 640 MB (Two-way Interleaving) Note: Add 128 MB using two banks of high-density SIMMS (8 x 16 MB) into banks C and D.
Page 273 512 MB 1024 MB (2-way Interleaving) (2-way Interleaving) SIMM Density High Very High Figure C-32 512 MB (Two-way Interleaving) to 1024 MB (Two-way Interleaving) Note: Add 512 MB using two banks of very high-density SIMMs (8 x 64 MB) into banks C and D.
Page 274 512 MB (4-way Interleaving) SIMM Density High 1024 MB (8-way Interleaving) Very High Figure C-33 512 MB (Four-way Interleaving) to 1024 MB (Eight-way Interleaving) Note: Add 512 MB using sixteen banks of high-density SIMMs (64 x 16 MB) into banks A, B, C, and D on two additional MC3 boards.
Page 275 512 MB (4−way Interleaving) SIMM Density High 1024 MB Very High (4−way Interleaving) Figure C-34 512 MB (Four-way Interleaving) to 1024 MB (Four-way Interleaving) This conﬁguration is possible only on an MC3 board with a part number of Caution: 030-0245-008 or higher. Note: Add 512 MB using eight bank s of high-density SIMMs (32 x 16 MB) into the remaining SIMM slots (banks E through H).
Page 276 512 MB (8-way Interleaving) SIMM Density High Very High 1024 MB (8-way Interleaving) SIMM Density High Very High Figure C-35 512 MB (Eight-way Interleaving) to 1024 MB (Eight-way Interleaving) Note: Add 512 MB using 16 banks (64 SIMMS) of high-density (16 MB) type into banks C and D on all four MC3 boards.
Page 277 1280 MB (4−way Interleaving) 512 MB (2−way Interleaving) SIMM Density High Very High Figure C-36 512 MB (Two-way Interleaving) to 1280 MB (Four-way Interleaving) Caution: This conﬁguration is possible only on an MC3 board with a part number of 030-0245-008 or higher. Note: Add 768 MB of high-density SIMMS into two MC3 board, by adding 128 MB of high-density SIMMs (8 x 16 MB) into banks C and D on the ﬁrst MC3 board and another 128 MB of high-density SIMMs (8 x16) into banks C and D on the second...
Page 278 512 MB (4−way Interleaving) SIMM Density High Very High 2048 MB (8−way Interleaving) Figure C-37 512 MB (Four-way Interleaving) to 2048 MB (Eight-way Interleaving) Caution: This conﬁguration is possible only on an MC3 board with a part number of 030-0245-008 or higher. Note: Add 1536 MB of high-density SIMMS into all the available SIMM slots on 4 MC3 boards by adding 512 MB using eight banks of high-density SIMMS (32 x 16 MB) into banks E, F, G, and H and the ﬁrst two MC3 boards.
Page 279 512 MB (8−way Interleaving) SIMM Density High Very High 2048 MB (8−way Interleaving) SIMM Density High Very High Figure C-38 512 MB (Eight-way Interleaving) to 2048 MB (Eight-way Interleaving) Caution: This conﬁguration is possible only on an MC3 board with a part number of 030-0245-008 or higher.
Page 280 640 MB 1024 MB (2-way Interleaving) (2-way Interleaving) SIMM Density High Very High Figure C-39 640 MB to 1024 MB (Two-way Interleaving) Note: Remove the two banks of high-density SIMMs (8 x 16 MB) and insert two banks of very high-density (8 x 64 MB) SIMMs into banks A and B. C-42 Memory Upgrade Configurations...
Page 281 1280 MB (4−way Interleaving) 640 MB (2−way Interleaving) SIMM Density High Very High Figure C-40 640 MB to 1280 MB (Four-way Interleaving) Caution: This conﬁguration is possible only on an MC3 board with a part number of 030-0245-008 or higher. Note: Add 640 MB to a second MC3 board by adding two banks of high-density SIMMs (8 x 16 MB) and two banks of very high-density SIMMs (8 x 64 MB).
Page 282 2048 MB (4−way Interleaving) 640 MB (2−way Interleaving) SIMM Density High Very High Figure C-41 640 MB to 2048 MB (Four-way Interleaving) Caution: This conﬁguration is possible only on an MC3 board with a part number of 030-0245-008 or higher. Note: Remove 128 MB of high-density SIMMs from Banks A and B on the ﬁrst MC3 board.
Page 283 1024 MB (4−way Interleaving) SIMM Density High 1280 MB Very High (4−way Interleaving) Figure C-42 1024 MB (Four-way Interleaving) to 1280 MB (Four-way Interleaving) Caution: This conﬁguration is possible only on an MC3 board with a part number of 030-0245-008 or higher. Note: Add 256 MB using four banks of high-density SIMMS (16 x 16 MB) to banks C and D on the two MC3 boards.
Page 284 2048 MB (4−way Interleaving) 1024 MB (2−way Interleaving) Figure C-43 1024 MB (Two-way Interleaving) to 2048 MB (Four-way Interleaving) Caution: This conﬁguration is possible only on an MC3 board with a part number of 030-0245-008 or higher. Note: Add 1024 MB using four banks of very high-density SIMMs (16 x 64 MB) into banks A and B on a second MC3 board.
Page 285 1024 MB (4−way Interleaving) SIMM Density High 2048 MB Very High (4−way Interleaving) Figure C-44 1024 MB (Four-way Interleaving) to 2048 MB (Four-way Interleaving) Caution: This conﬁguration is possible only on an MC3 board with a part number of 030-0245-008 or higher. Note: Add 1024 MB using four banks of very high-density SIMMs (16 x 64 MB) into banks B and D on each MC3 board.
Page 286 1024 MB (8−way Interleaving) SIMM Density High Very High 2048 MB (8−way Interleaving) SIMM Density High Very High Figure C-45 1024 MB (Eight-way Interleaving) to 2048 MB (Eight-way Interleaving) Caution: This conﬁguration is possible only on an MC3 board with a part number of 030-0245-008 or higher.
Page 287 1280 MB (4−way Interleaving) SIMM Density High 2048 MB Very High (4−way Interleaving) Figure C-46 1280 MB to 2048 MB (Four-way Interleaving) This conﬁguration is possible only on an MC3 board with a part number of Caution: 030-0245-008 or higher. Note: Remove the high-density SIMMs (sixteen total) and replace them with sixteen very high-density SIMMS (16 x 64 MB).
Page 288 C-50 Memory Upgrade Configurations...
Page 289 Appendix D Drive Maintenance This appendix describes the preventive maintenance required for systems having 1/4-inch tape drives, 4-mm DAT, and 8-mm tape drives, as well as CD-ROM drives. Operating and Maintaining the 4-mm DAT and 8-mm Tape Drives These are the manufacturers’ recommended cleaning schedules: •...
Page 290 When you load a cassette, the unit checks to see if the tape is initialized. This checking process takes between 10 and 20 seconds. If the tape has never been initialized, the drive will initialize it when you ﬁrst start to write data to the tape. Initializing the tape takes an extra 30 seconds beyond what is required to write the data.
Page 291 Action Meaning Green On (lit) A cassette is loaded in the drive and it does not generate excess errors (normal operation). Green Flashing slowly A cassette is inserted but is generating excess soft errors beyond a predeﬁned error threshold (warning: heads may need cleaning).
Page 292 1. Power cycle the tape drive and then try ejecting the tape. 2. If this does not eject the tape, power cycle the drive again while holding down the unload button. If neither of these two steps ejects the jammed cassette, contact your service provider. D.3.3 The 8-mm Drive Front Panel Lights The 8-mm tape drive has two front panel lights: an amber LED and a green LED.
Page 293 Avoid touching the drive’s printed circuit board (PCB). Leave the unit in ESD protective wrap as long as possible. Use a static-conductive mat or antistatic grounding devices when inspecting or handling the drive. Additional handling tips are 1. Keep the drive in the packing box or antistatic bag until the installation. 2.
Page 294 D.4.1 CD-ROM Environmental Considerations Bringing a disc from a cold to a warm environment may cause moisture to form on its surface. Wipe any condensed moisture off with a soft, lint-free cloth (not a paper towel) before use. Allow approximately one hour for the disc to acclimate to room temperature. Protect discs from dust, scratches, and warping by storing them in a caddy or nonfunctional plastic storage container (known as a jewel case).
Page 295 Drive Status Seconds Elapsed OnOff LED off - Drive Ready Caddy Load/Spin Up/Standby LED off - Disc Auto-Ejects Unacceptable Disc Media Cleaning of Disc or Drive Needed Disc is Playing an Audio Track Disc Access and Transfer = LED On = LED Off Clean the tape head by following these steps: 1.
Page 296 Figure D-3 Tape Head Cleaning Drive Maintenance...
Page 297 Numbers 5-79 1280 MB Conﬁguration 19-inch Monitor Controls and Connectors 8-mm tape drive front panel lights loading and unloading cassettes removing jammed cassettes attachment unit interface (AUI) 4-17 5-18 Display Generator (DG2) Backplane Ebus 5b-3 disconnecting cables 5b-2 5b-14 5-59 replacing Eight-way Interleaving 5a-2...
Page 298 4-13 4-14 4-15 4-17 GE10 NTSC 4-15 GE10V 5a-2 General procedures Geometry Engine 2-17 Graphics Backplane 4-11 Off-Line Switcher (OLS) Graphics System Installation off-line switching Off-line Switching (OLS) 5-56 One-way Interleaving Onyx 4-13 5a-4 HDTV Opening the chassis front door 5a-6 Opening the I/O door 5b-8...
Page 299 5b-27 Replacing the fan module Top panel 5a-11 hidden catch plate 5a-8 Replacing the I/O door 5a-11 replacing 5b-5 Replacing the power connector assembly 5-57 Two-way Interleaving 5b-4 Replacing the power supply assembly 5b-1 Replacing the status panel 5a-10 Replacing the top hat 5a-11 Replacing the top panel 5a-4...

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