Thermal Interface Material; Heatsink Installation Procedures - TYAN TOMCAT K8SH Manual

2.18 -- Thermal Interface Material

Aways check with the manufacturer of the heatsink & processor to
NOTE ensure the Thermal Interface material is compatible with the
processor & meets the manufacturer's warranty requirements

2.19 Heatsink Installation Procedures

Type A: CAM LEVER (TYPE) INSTALLATION
There are two types of thermal
interface materials designed for use
with the AMD Opteron processor.
The most common material comes as
a small pad attached to the heatsink at
the time of purchase. There should be
a protective cover over the material.
Take care not to touch this material.
Simply remove the protective cover
and place the heatsink on the
processor.
The second type of interface material
is usually packaged separately. It is
commonly referred to as 'thermal
compound'. Simply apply a thin layer
on to the CPU lid (applying too much
will actually reduce the cooling).
1. After placing backplate and interface
material under motherboard place
heatsink retention frame on top of
motherboard. Align plastic retention
bracket screw hole
with CPU back-plate standoffs.
Tighten screws to secure plastic
retention bracket. Repeat for on other
side.
DO NOT OVER TIGHTEN.
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