HP 19 Disassembly Manual

Also See for 19:

Product end-of-life disassembly instructions (11 pages)

Table of Contents

Contents

1 Items Requiring Selective Treatment
2 Tools Required
3 Product Disassembly Process
4 Documents / Resources
- 4.1 Download manual

HP 19 Disassembly Manual

Items Requiring Selective Treatment

Items listed below are classified as requiring selective treatment.
Enter the quantity of items contained within the product which require selective treatment in the right column, as applicable.

Item Description	Notes	Quantity of items included in product
Printed Circuit Boards (PCB) or Printed Circuit Assemblies (PCA)	With a surface greater than 10 sq cm MB, Webcam, converter board, power button board	4
Batteries	All types including standard alkaline and lithium coin or button style batteries	7
Mercury-containing components	For example, mercury in lamps, display backlights, scanner lamps, switches, batteries	0
Liquid Crystal Displays (LCD) with a surface greater than 100 sq cm	Includes background illuminated displays with gas discharge lamps	1
Cathode Ray Tubes (CRT)		0
Capacitors / condensers (Containing PCB/PCT)		0
Electrolytic Capacitors / Condensers measuring greater than 2.5 cm in diameter or height		0
External electrical cables and cords		0
Gas Discharge Lamps		0
Plastics containing Brominated Flame Retardants weighing > 25 grams (not including PCBs or PCAs already listed as a separate item above)		0
Components and parts containing toner and ink, including liquids, semi-liquids (gel/paste) and toner	Include the cartridges, print heads, tubes, vent chambers, and service stations.	0
Components and waste containing asbestos		0
Components, parts and materials containing refractory ceramic fibers		0

Tools Required

List the type and size of the tools that would typically be used to disassemble the product to a point where components and materials requiring selective treatment can be removed.

Tool Description	Tool Size (if applicable)
Description #1	2# X10
Description #2	1# X10
Description #3
Description #4
Description #5

Product Disassembly Process

List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Disassemble rear cover
2. Disassemble the stand
3. Disassemble Speaker
4. Disassemble HDD & ODD
5. Disassemble MB Shielding
6. Disassemble FAN Module
7. Disassemble converter board
8. Disassemble Webcam
9. Disassemble Wireless card
10. Disassemble the cables connected from MB
11. Disassemble MB and MB battery
12. Disassemble DDR
13. Separate Base pan and front bezel and panel
14. Remove Mouse/Keyboard Battery/MB
15. Remove power supply
Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items contained in the product that require selective treatment (with descriptions and arrows identifying locations).
1. Place the system
2. Disassemble rear cover
  Remove 2pcs screws with circle in red.
3. Disassemble stand
  Remove 4pcs screws on both left and right so you can remove stand.
4. Disassemble speaker
  Remove 4pcs screws from left and right,
  Also remove the speaker cable with in yellow circle in order to take out two speakers from system.
5. Disassemble HDD & ODD
  Remove 1pcs screw with circles in red from HDD and pull backward to disengage the HDD from base pan.

Product Disassembly Process - Step 6
Remove 1pcs screw and push ODD forward to slide from ODD cage.

Disassemble MB shielding
Remove 3pcs screws with circles in red
Disassemble FAN Module
Remove 3pcs screws and remove the cable with in yellow circle to disassemble the fan.
Disassemble converter board
Remove two cables and 2pcs screws to remove the converter board.
Disassemble Webcam
Remove the cable and screw in order to disengage the webcam module and mechanical parts.
Disassemble Wireless card
Remove one or two cables and 1pcs screw in order to remove wireless card.
Disassemble the cables connected to MB and Base pan.
1. Remove the HDD /ODD cable
  Remove the cable with circles in yellow and remove 4pcs screws with circles in red.
2. Remove LVDS cable connected from MB.
3. Remove antenna cable on the Base pan and take away the cable.
Disassemble MB and MB battery
Remove 5pcs screws to disassemble the INTEL(Daisy) MB

Pull backward the clip with in yellow circle to release the battery

Disassemble DDR
Pull both clicks outward that holding the memory to remove the DDR.
Separate Base pan and front bezel and panel
1. Remove 14pcs screws with circles in red to separate base pan and front bezel.
2. Remove 4pcs screws with circles in red to separate base pan and AUO/LG/CM0049 Panel
Remove Mouse/Keyboard Battery/MB
Remove power supply