Heatsink; Linux - Android Users - Digi ConnectCore 6 Plus Hardware Reference Manual

Specifications for the ConnectCore 6 Plus

Heatsink

CAUTION! Maximum perpendicular pressure not to exceed 10kg.

Linux - Android users

You can measure the processor junction temperature by entering the following shell command:
cat /sys/class/thermal/thermal_zone0/temp
Note Depending on the operating system, the junction temperature is displayed in milli °C or °C.
The ConnectCore 6 Plus multichip module was designed to provide customers with unique options
to simplify and support the implementation of thermal management approaches in their designs, as
needed:
The ConnectCore 6 Plus offers a fully shielded design (including internal thermal
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compounds) with optimized heat transfer and heat spreading for specific internal
components (processor and PMIC). It is ideally suited for more efficient heat dissipation by
providing a single, uniform surface for thermal management via enclosures, heat sinks or
other means.
The surface mount design of the ConnectCore 6 Plus allows for additional dissipation of
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heat through the carrier board it is mounted on.
Evaluation of the ConnectCore 6 Plus thermal performance has successfully demonstrated
that the ambient operating temperatures specified can be supported by the module.
However, actual ambient operating temperature performance may vary and is highly
dependent on the specific use-case, such as enclosure design, system design, i.MX6QP
processor variant, GPU/VPU activity, and on-module peripherals used. Your specific system
design and application may require additional thermal management such as passive
(heatsink/-spreader) or active (airflow) cooling at elevated temperatures.
ConnectCore 6 Plus variant
Industrial
Commercial
CAUTION!
passive (heatsink/spreader) or active (airflow) cooling to achieve the maximum
operating temperature without exceeding the processor junction temp limit.
See Heatsink
Contact Digi if you need information and/or guidance related to thermal management in your
specific application.
ConnectCore 6 Plus Hardware Reference Manual
Ambient operating
temperature
o 1
-40 to 85 C
o
0 to 70 C
1
Your final product may require additional thermal management such as
for more information.
Environmental specifications
Storage temperature
o
-40 to 125 C
o
-40 to 125 C
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