Cleaning The Evm; Ultrasonic Wash; Manual Cleaning Procedure; Schematic, Pcb Layout, And Bill Of Materials - Texas Instruments OPA928 User Manual

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5 Cleaning the EVM

Follow these cleaning instructions whenever the EVM is suspected of contamination within the guard area and
performance is degraded.
The recommended cleaning procedure requires access to an ultrasonic bath. If an ultrasonic bath is not
available, a manual cleaning procedure is detailed below. The ultrasonic wash produces the best and most
consistent outcomes and is preferred over manual cleaning.
Remove all RF shields from the EVM before cleaning and follow the instructions for handling the board as
described in the Section 1.1.

5.1 Ultrasonic Wash

1. Place the EVM in the ultrasonic cleaner and fill with fresh deionized (DI) water.
2. Run the ultrasonic cleaner for 30 minutes at 85°C.
3. Remove the EVM from the ultrasonic cleaner and bake for two hours at 100°C

5.2 Manual Cleaning Procedure

1. Flush contaminants from the EVM.
a. Hold the board by the edges and flush the top and bottom using a combination of fresh isopropyl alcohol
(IPA) and fresh DI water. Focus on the input traces, guard copper, and feedback components.
2. Scrub contaminants from top side of the EVM.
a. Hold the board by the edges with the top layer facing up. Flood sensitive input and feedback areas with
fresh IPA.
b. Use a toothbrush to gently scrub for 30–60 seconds. Focus on the areas surrounding P1, P2, JP2, JP3,
SH1, and the area directly right of J1.
c. Flush the scrubbed areas with fresh DI water, tilting the board to allow runoff to flow away from the input
areas.
3. Scrub contaminants from the bottom layer TIA input.
a. Hold the board by the edges with the bottom layer facing up. Flood sensitive input and feedback areas
with fresh IPA.
b. Use a toothbrush to gently scrub for 30–60 seconds. Focus on areas surrounding U2, R4, Rf, Cf, K2, K1,
U1, R1, and all input and guard traces.
c. Flush the scrubbed areas with fresh DI water, tilting the board to allow runoff to flow away from the input
areas.
4. Remove moisture from the PCB.
a. Bake the EVM for two hours at 100°C.

6 Schematic, PCB Layout, and Bill of Materials

This section provides the OPA928EVM hardware schematics, PCB layout and bill of materials.
SBOU282A – DECEMBER 2022 – REVISED MARCH 2023
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Cleaning the EVM
OPA928 Evaluation Module 13